Engineering Wafers. Each of the Parent Parties will have full access to all operational and engineering data and reports related to engineering wafers manufactured for JV Products manufactured at the New Y2 Facility.
Engineering Wafers. The rights of the Parent Parties to receive Evaluation Wafers and Qualification Wafers (each as defined in the JV Master Agreements) under the JV Master Agreements apply to Evaluation Wafers and Qualification Wafers manufactured in the New Y2 Facility.
Engineering Wafers. The rights of the Parent Parties to receive Evaluation Wafers and Qualification Wafers (each as defined in the JV Master Agreements) under the JV Master Agreements apply to Evaluation Wafers and Qualification Wafers manufactured in the Y6 Facility. For the avoidance of doubt, WD may ship its share of Evaluation Wafers and Qualification Wafers to any location in its sole discretion subject to any terms and conditions of the Master Operative Documents that relate or apply to the shipment of Evaluation Wafers or Qualification Wafers by SanDisk, including applicable export control requirements; provided, that any such shipment by WD shall comply with applicable shipping procedures at the Yokkaichi Facility consistent with past practice.
Engineering Wafers. The rights of the Parent Parties to receive Evaluation Wafers and Qualification Wafers (each as defined in the JV Master Agreements) under the JV Master Agreements apply to Evaluation Wafers and Qualification Wafers manufactured in the K1 Facility, and TMC’s rights to receive Evaluation Wafers and Qualification Wafers under the JV Agreements are hereby extended to TMI. For the avoidance of doubt, WD may ship its share of Evaluation Wafers and Qualification Wafers to any location in its sole discretion subject to any terms and conditions of the Master Operative Documents that relate or apply to the shipment of Evaluation Wafers or Qualification Wafers by SanDisk, including applicable export control requirements; provided, that any such shipment by WD shall comply with applicable shipping procedures at the Yokkaichi Facility consistent with past practice with reasonable adjustments based on attributes specific to the K1 Facility or as otherwise required due to the K1 Facility’s being situated at the Kitakami Facility, and not at the Yokkaichi Facility.
Engineering Wafers. WAFERS that are processed in accordance with the applicable special pricing in Exhibit B and the applicable special specifications in Exhibit C.
Engineering Wafers. The price of Engineering Wafers shall be as follows:
(a) The price of Engineering Wafers fabricated with minor parametric variations or minor alterations in Process conditions (e.g., "corner lots") shall equal the Base Wafer Price applicable to the Process pursuant to which such Wafers are fabricated.
(b) The price of Engineering Wafers fabricated with changes in Process flow or major alterations in Process conditions shall be as agreed in each instance between the parties.
Engineering Wafers. For purposes of this Agreement, engineering wafers shall count towards any Quarterly Reservation, however pricing for such engineering wafers, including any expedite requests, shall be per GF’s then current published service price list, and the Parties shall engage in good faith negotiations regarding the delivery dates for such engineering wafers. The following requirements shall apply with respect to Customer’s orders and GF’s supply of engineering wafers: • As and when Customer has determined its engineering wafer plan needs, Customer may place purchase orders for engineering wafers and Customer shall provide quantity and split plan details. • If production wafer starts for the applicable calendar quarter are available (within the applicable Quarterly Commitment quantity):
a. GF will provide a swap or fungibility ratio (for the engineering to production wafers exchange) and a delivery schedule based on the complexity of the engineering wafers;
b. GF and Customer will determine (as needed) the purchase order quantities for production wafers that will be decommitted to accommodate the engineering wafers, based on the swap/fungibility ratio;
c. Once the swap quantities have been determined, Customer shall be committed to purchase the revised engineering and production wafer quantities and GF shall be committed to deliver the revised engineering and production wafer quantities.
d. If GF’s delivery date (and subsequent delivery) for any engineering wafers extends into a later quarter, no Supply Shortfall fees shall be assessed on such engineering wafers.
e. If Customer requests expedited delivery of engineering wafers, GF will communicate the required expedite fees and/or any required delay in delivery of production wafers required to meet the Customer requested delivery dates. In any such cases, delayed production wafers will be exempt from Supply Shortfall fees. • If production wafer starts for the applicable calendar quarter are no longer available (within the applicable Quarterly Commitment quantity):
a. Customer’s engineering wafer order shall be accommodated in the next wafer start cycle, treated as part of the purchase commitment for the next quarter, and the requirements above in (a)-(e) shall apply to such order. GLOBALFOUNDRIES & CUSTOMER CONFIDENTIAL Cirrus Logic July 27, 2021 Page 5 2.10 [***] Option. Customer shall have the option right, which may only be exercised by written notice to GF provided no later than August 31, 2021, to include the [*...
Engineering Wafers. In the event Purchaser seeks to have Products manufactured using engineering wafers, and Adaptec agrees to manufacture such Products, Purchaser shall be responsible for payment of all additional costs incurred by Adaptec in connection with the manufacture of such Products, including: (a) mask building charges; (b) expedite fees (including those related to fabrication and assembly); and (c) cost differentials between engineering wafers and production wafers. (Purchaser acknowledges that the Prices set forth in Exhibit A are based upon production wafer cost.) Such costs shall be invoiced and paid as provided in Section 7.
3. Section 5.1 of the Agreement is amended as follows:
Engineering Wafers. Notwithstanding anything herein to the contrary, to the extent requested in any Purchase Order placed, or any change order to a Purchase Order issued, by a Purchaser, the Joint Venture Company shall manufacture and deliver Engineering Wafers in lieu of Conforming Wafers. The Manufacturing Capacity required to manufacture each Engineering Wafer shall be deemed to equal [***] of the Manufacturing Capacity required to manufacture a Conforming Wafer of the same Design ID. The Joint Venture Company shall promptly provide each Purchaser with full access to all data it reasonably requests relating to Engineering Wafers that are being manufactured by the Joint Venture Company for such Purchaser.
Engineering Wafers. Upon Ramtron's request and in TI's sole but reasonable discretion, TI will provide to Ramtron such amount of engineering Wafers as Ramtron may require.
