EXHIBIT 10.29 AMENDED AND RESTATED CREDIT AGREEMENT DATED AS OF NOVEMBER 24, 2003Credit Agreement • February 12th, 2004 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Contract Type FiledFebruary 12th, 2004 Company Industry Jurisdiction
Exhibit 10.10 REGISTRATION RIGHTS AGREEMENT by and between CABOT MICROELECTONICS CORPORATIONRegistration Rights Agreement • March 27th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • New York
Contract Type FiledMarch 27th, 2000 Company Industry Jurisdiction
Exhibit 10.11 The omitted portions indicated by brackets have been separately filed with the Securities and Exchange Commission pursuant to a request for confidential treatment under Rule 406, promulgated under the Securities Act of 1933, as amended....Purchase Agreement • February 8th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
Contract Type FiledFebruary 8th, 2000 Company Industry Jurisdiction
andRights Agreement • April 4th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • New York
Contract Type FiledApril 4th, 2000 Company Industry Jurisdiction
Exhibit 10.12 The omitted portions indicated by brackets have been separately filed with the Securities and Exchange Commission pursuant to a request for confidential treatment under Rule 406, promulgated under the Securities Act of 1933, as amended....Services Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Massachusetts
Contract Type FiledApril 3rd, 2000 Company Industry Jurisdiction
WITNESSETH:Rights Agreement • October 6th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
Contract Type FiledOctober 6th, 2000 Company Industry Jurisdiction
CREDIT AGREEMENT1Credit Agreement • August 8th, 2014 • Cabot Microelectronics Corp • Semiconductors & related devices • New York
Contract Type FiledAugust 8th, 2014 Company Industry Jurisdiction
1 Exhibit 10.16 REVOLVING CREDIT AGREEMENT Dated as of March 29, 2000Revolving Credit Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
Contract Type FiledApril 3rd, 2000 Company Industry
1 EXHIBIT 10.20 EXTENSION OF MANAGEMENT SERVICES AGREEMENT This Extension of the Management Services Agreement (this "Extension") is executed as of the 29th day of September, 2000 by and between Cabot Corporation, a Delaware corporation ("Cabot"), and...Management Services Agreement • December 28th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
Contract Type FiledDecember 28th, 2000 Company Industry
2 3 (e) Except for the restrictions arising out of its purchase of the property underlying its plant in Geino, Japan from the Japanese government, the Company has (except for the Geino, Japan plant as to which the Company and Cabot Corporation and its...Underwriting Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • New York
Contract Type FiledApril 3rd, 2000 Company Industry Jurisdiction
EXHIBIT 10.37 EMPLOYMENT AND TRANSITION AGREEMENT This EMPLOYMENT AND TRANSITION AGREEMENT (the "Agreement"), is made and entered into on and effective as of November 3, 2003, (the "Effective Date") by MATTHEW NEVILLE, residing at 425 Easton Avenue,...Employment Agreement • February 12th, 2004 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Contract Type FiledFebruary 12th, 2004 Company Industry Jurisdiction
BETWEENCredit Agreement • August 10th, 2001 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Contract Type FiledAugust 10th, 2001 Company Industry Jurisdiction
1 EXHIBIT 10.19 SUPPORT AGREEMENT FOR CABOT CORP. & CABOT MICROELECTRONICS PURPOSE The purpose of this document is to define the roles and responsibilities of Cabot Corporations support and Cabot Microelectronics support after the final split of Cabot...Support Agreement • December 28th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
Contract Type FiledDecember 28th, 2000 Company Industry
1 Exhibit 10.7 TRADEMARK LICENSE AGREEMENT THIS AGREEMENT is made and effective as of this 28th day of March, 2000, by and between Cabot Corporation, a corporation organized and existing under the laws of the State of Delaware and having its corporate...Trademark License Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Massachusetts
Contract Type FiledApril 3rd, 2000 Company Industry Jurisdiction
AGREEMENT AND PLAN OF MERGER Dated as of December 14, 2021, by and among CMC MATERIALS, INC., ENTEGRIS, INC. and YOSEMITE MERGER SUB, INC.Merger Agreement • December 16th, 2021 • CMC Materials, Inc. • Semiconductors & related devices • Delaware
Contract Type FiledDecember 16th, 2021 Company Industry JurisdictionThis AGREEMENT AND PLAN OF MERGER (this “Agreement”), dated as of December 14, 2021, is by and among CMC MATERIALS, INC., a Delaware corporation (the “Company”), ENTEGRIS, INC., a Delaware corporation (“Parent”), and YOSEMITE MERGER SUB, INC., a Delaware corporation and a wholly owned Subsidiary of Parent (“Merger Sub”).
AGREEMENT:Credit Agreement • February 14th, 2001 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Contract Type FiledFebruary 14th, 2001 Company Industry Jurisdiction
CREDIT AGREEMENT Dated as of February 13, 2012 among [Missing Graphic Reference] CABOT MICROELECTRONICS CORPORATION, as the Borrower, BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and an L/C Issuer, and The Other Lenders Party...Credit Agreement • May 9th, 2012 • Cabot Microelectronics Corp • Semiconductors & related devices • New York
Contract Type FiledMay 9th, 2012 Company Industry JurisdictionFOR VALUE RECEIVED, the undersigned (the “Borrower”), hereby promises to pay to _____________________ or registered assigns (the “Lender”), in accordance with the provisions of the Agreement (as hereinafter defined), the principal amount of each Term Loan from time to time made by the Lender to the Borrower under that certain Credit Agreement, dated as of February 13, 2012 (as amended, restated, extended, supplemented or otherwise modified in writing from time to time, the “Agreement;” the terms defined therein being used herein as therein defined), among Cabot Microelectronics Corporation, a Delaware corporation (the “Borrower”), the Lenders from time to time party thereto, and Bank of America, N.A., as Administrative Agent, Swing Line Lender and an L/C Issuer.
AMONGCredit Agreement • August 10th, 2001 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Contract Type FiledAugust 10th, 2001 Company Industry Jurisdiction
1 EXHIBIT 10.26 AMENDED AND RESTATED CREDIT AGREEMENT dated as of July 5, 2000,Credit Agreement • February 14th, 2001 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Contract Type FiledFebruary 14th, 2001 Company Industry Jurisdiction
1 Exhibit 10.11 The omitted portions indicated by brackets have been separately filed with the Securities and Exchange Commission pursuant to a request for confidential treatment under Rule 406, promulgated under the Securities Act of 1933, as...Purchase Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
Contract Type FiledApril 3rd, 2000 Company Industry Jurisdiction
R E C I T A L SCredit Agreement • December 10th, 2003 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
Contract Type FiledDecember 10th, 2003 Company Industry
ContractCredit Agreement • December 24th, 2019 • Cabot Microelectronics Corp • Semiconductors & related devices • Delaware
Contract Type FiledDecember 24th, 2019 Company Industry JurisdictionAMENDMENT NO. 1, dated as of December 20, 2019 (this “Amendment”), to the Credit Agreement, dated as of November 15, 2018 (as amended, restated, amended and restated, modified or otherwise supplemented from time to time prior to the date hereof, the “Credit Agreement,” and the Credit Agreement, as amended by this Amendment, the “Amended Credit Agreement”), among CABOT MICROELECTRONICS CORPORATION, a Delaware corporation (the “Borrower”), the several banks and other financial institutions or entities from time to time parties to the Credit Agreement (the “Lenders”), JPMORGAN CHASE BANK, N.A., as Administrative Agent (the “Administrative Agent”) and Collateral Agent and the various other parties thereto. Capitalized terms used and not otherwise defined herein shall have the meanings assigned to such terms in the Credit Agreement.
RECITALSCredit Agreement • May 13th, 2002 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
Contract Type FiledMay 13th, 2002 Company Industry
CREDIT AGREEMENT dated as of November 15, 2018, as amended by Amendment No. 1 dated December 20, 2019 among as the Borrower, THE LENDERS PARTY HERETO, JPMORGAN CHASE BANK, N.A., as Administrative Agent, BANK OF MONTREAL, HSBC BANK USA, NATIONAL...Credit Agreement • February 4th, 2021 • CMC Materials, Inc. • Semiconductors & related devices • Delaware
Contract Type FiledFebruary 4th, 2021 Company Industry Jurisdiction
Exhibit 10.2 [CABOT MICROELECTRONICS LOGO] CABOT MICROELECTRONICS CORPORATION SECOND AMENDED AND RESTATED 2000 EQUITY INCENTIVE PLAN NON-QUALIFIED STOCK OPTION GRANT AGREEMENT FOR DIRECTORS [Grant Date] [Director Name] [Address] [Address] Dear...Non-Qualified Stock Option Grant Agreement • December 8th, 2004 • Cabot Microelectronics Corp • Semiconductors & related devices • Illinois
Contract Type FiledDecember 8th, 2004 Company Industry Jurisdiction
EXHIBIT 10.2 INITIAL PUBLIC OFFERING AND DISTRIBUTION AGREEMENT, DATED AS OF MARCH 28, 2000, BY AND BETWEEN CABOT CORPORATIONInitial Public Offering and Distribution Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
Contract Type FiledApril 3rd, 2000 Company Industry Jurisdiction
ASSET PURCHASE AGREEMENT by and among Cabot Microelectronics Corporation, a Delaware corporation, QED Technologies International, Inc., a Delaware corporation, QED Technologies, Inc., a New York corporation, Don Golini, and Lowell Mintz Dated June 15,...Asset Purchase Agreement • August 9th, 2006 • Cabot Microelectronics Corp • Semiconductors & related devices • Illinois
Contract Type FiledAugust 9th, 2006 Company Industry JurisdictionThis Asset Purchase Agreement (this “Agreement”) is dated June 15, 2006, by and among, Cabot Microelectronics Corporation, a Delaware corporation (“CMC”), QED Technologies International, Inc., a Delaware corporation and wholly owned subsidiary of CMC (“Buyer”), QED Technologies, Inc., a New York corporation ("Seller"), Don Golini, an individual and resident of the State of New York (“Mr. Golini”), and Lowell Mintz, an individual and resident of the State of New York (“Mr. Mintz” and, together with Mr. Golini, the “Shareholders” and, each, a “Shareholder”).
BYTax Sharing Agreement • March 27th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods
Contract Type FiledMarch 27th, 2000 Company Industry
VOTING AND SUPPORT AGREEMENTVoting and Support Agreement • August 17th, 2018 • Cabot Microelectronics Corp • Semiconductors & related devices • Delaware
Contract Type FiledAugust 17th, 2018 Company Industry JurisdictionThis Voting and Support Agreement (this “Agreement”) dated as of August 14, 2018, is by and between Cabot Microelectronics Corporation, a Delaware corporation (“Parent”) and Fred C. Leonard III (“Shareholder”).
AMENDMENT NO. 3 TO FUMED METAL OXIDE SUPPLY AGREEMENT (Removal of Fumed Silica from Agreement)Fumed Metal Oxide Supply Agreement • May 7th, 2004 • Cabot Microelectronics Corp • Semiconductors & related devices
Contract Type FiledMay 7th, 2004 Company Industry
1 EXHIBIT 10.23 CABOT MICROELECTRONICS CORPORATION CHANGE IN CONTROL SEVERANCE PROTECTION AGREEMENT THIS SEVERANCE AGREEMENT, (the "Agreement") is entered into as of this _____ day of ________________, _______ (the "Agreement Date"), by and between...Change in Control Severance Protection Agreement • December 28th, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Illinois
Contract Type FiledDecember 28th, 2000 Company Industry Jurisdiction
EXHIBIT 10.43 GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUE This GENERAL RELEASE, WAIVER AND COVENANT NOT TO SUE ("Agreement"), is made and entered into on this 29th day of February, 2004, ("Execution Date") by Jeffrey Michael Jenkins (SSN...General Release, Waiver and Covenant Not to Sue • May 7th, 2004 • Cabot Microelectronics Corp • Semiconductors & related devices • Illinois
Contract Type FiledMay 7th, 2004 Company Industry Jurisdiction
Cabot Microelectronics Corporation 2012 Omnibus Incentive Plan Restricted Stock Award Agreement (United States Employees)Restricted Stock Award Agreement • August 8th, 2012 • Cabot Microelectronics Corp • Semiconductors & related devices • Illinois
Contract Type FiledAugust 8th, 2012 Company Industry Jurisdiction
1 Exhibit 10.8 The omitted portions indicated by brackets have been separately filed with the Securities and Exchange Commission pursuant to a request for confidential treatment under Rule 406, promulgated under the Securities Act of 1933, as amended....Dispersion Services Agreement • April 3rd, 2000 • Cabot Microelectronics Corp • Abrasive, asbestos & misc nonmetallic mineral prods • Delaware
Contract Type FiledApril 3rd, 2000 Company Industry Jurisdiction
Cabot Microelectronics Corporation 2012 Omnibus Incentive Plan Non-Qualified Stock Option Grant Agreement (United States Employees)Non-Qualified Stock Option Grant Agreement • August 8th, 2012 • Cabot Microelectronics Corp • Semiconductors & related devices • Illinois
Contract Type FiledAugust 8th, 2012 Company Industry Jurisdiction