AMONGCredit Agreement • July 14th, 2000 • Chippac Inc • Semiconductors & related devices • New York
EXHIBIT 2.1 STOCK PURCHASE AGREEMENTStock Purchase Agreement • July 14th, 2000 • Chippac Inc • Semiconductors & related devices • New York
Exhibit 10.1.2 AMENDMENT NO. 2 dated as of June 8, 2001 (this "Amendment"), to the CREDIT AGREEMENT dated as of August 5, 1999, as amended and restated as of June 30, 2000, and as amended by Amendment No. 1 dated as of March 13, 2001 (the "Credit...Credit Agreement • August 14th, 2001 • Chippac Inc • Semiconductors & related devices • New York
Exhibit 1.1 15,500,000 Shares ChipPAC, Inc. Class A Common Stock UNDERWRITING AGREEMENT ----------------------Underwriting Agreement • August 4th, 2000 • Chippac Inc • Semiconductors & related devices • New York
THIS SHAREHOLDERS AGREEMENT (this "Agreement") is made as of June 30, --------- 2000, by and among ChipPAC, Inc., a California corporation (the "Company"), ------- the Persons listed on Schedule I attached hereto (the "Bain Group"), the SXI ----------...Shareholders Agreement • July 14th, 2000 • Chippac Inc • Semiconductors & related devices • California
ChipPAC, Inc., a Delaware corporation (the "Company"), proposes to issue ------- and sell to Citicorp Mezzanine III, L.P. (the "Purchaser"), upon the terms set --------- forth in a purchase agreement, dated as of June 11, 2001 (the "Purchase --------...Chippac Inc • August 14th, 2001 • Semiconductors & related devices • New York
EXHIBIT 10.51 Bump Chip Carrier (called "BCC" in this Agreement) License Agreement Administrative Amendment ------------------------ This administrative amendment made and entered into as of the 5th day of March, 2002, by and between: FUJITSU LIMITED,...Chippac Inc • April 1st, 2002 • Semiconductors & related devices
INDENTUREChippac Inc • August 14th, 2001 • Semiconductors & related devices • New York
Exhibit 10.1.1 AMENDMENT NO. 1 dated as of March 13, 2001 (this "Amendment"), to the CREDIT AGREEMENT dated as of August 5, 1999, as amended and restated as of June 30, 2000 (the "Credit Agreement"), among CHIPPAC INTERNATIONAL COMPANY LIMITED, a...Credit Agreement • August 14th, 2001 • Chippac Inc • Semiconductors & related devices • New York
Exhibit 1.1 10,000,000 Shares ChipPAC, Inc. Class A Common Stock UNDERWRITING AGREEMENT ----------------------License Agreement • August 7th, 2000 • Chippac Inc • Semiconductors & related devices • New York
This Amended and Restated Supplemental Agreement No. 1 (this "Supplemental Agreement") is dated as of August 2, 2000 by and among ChipPAC, ---------------------- Inc., a Delaware corporation ("ChipPAC"), ChipPAC Limited, a corporation -------...Supplemental Agreement • August 7th, 2000 • Chippac Inc • Semiconductors & related devices • New York
ChipPAC, Inc.Agreement • May 20th, 2002 • Chippac Inc • Semiconductors & related devices • New York
GUARANTYGuaranty • December 7th, 2001 • Chippac Inc • Semiconductors & related devices • New York
ChipPAC, Inc.Chippac Inc • January 17th, 2002 • Semiconductors & related devices • New York
AMENDED AND RESTATED AGREEMENT AND PLAN OF MERGER OF CHIPPAC, INC. A CALIFORNIA CORPORATION AND CHIPPAC, INC. A DELAWARE CORPORATIONAgreement and Plan • August 4th, 2000 • Chippac Inc • Semiconductors & related devices
THIS AMENDMENT NO. 3 TO AMENDED AND RESTATED REGISTRATION AGREEMENT (this "Amendment") is dated as of August 2, 2000, by and among --------- ChipPAC, Inc., a Delaware corporation and successor by merger to ChipPAC, Inc., a California corporation (the...Registration Agreement • August 7th, 2000 • Chippac Inc • Semiconductors & related devices • California
ChipPAC International Company Limited, a British Virgin Islands corporation (the "Company"), proposes to issue and sell to Citicorp Capital ------- Investors, Limited (the "Purchaser"), upon the terms set forth in a purchase --------- agreement, dated...Chippac Inc • August 14th, 2001 • Semiconductors & related devices • New York
WITNESSETH THAT:License Agreement • April 1st, 2002 • Chippac Inc • Semiconductors & related devices
RECITALSLicense Agreement • April 1st, 2002 • Chippac Inc • Semiconductors & related devices • California
Exhibit 10.1 AMENDMENT NO. 3, WAIVER AND AGREEMENT dated as of December 31, 2001 (this "Amendment"), to the CREDIT AGREEMENT dated as of August 5, 1999, as amended and restated as of June 30, 2000, as amended by Amendment No. 1 dated as of March 13,...Waiver and Agreement • January 10th, 2002 • Chippac Inc • Semiconductors & related devices • New York
EXHIBIT 10.47 [Translation] PATENT AND TECHNOLOGY LICENSE AGREEMENT This Patent and Technology License Agreement (the "Agreement") is made and entered into as of August 5, 1999 (hereinafter "Effective Date") by and between Hyundai Electronics...Patent and Technology License Agreement • April 1st, 2002 • Chippac Inc • Semiconductors & related devices
AGREEMENT AND PLAN OF MERGER OF CHIPPAC, INC. A CALIFORNIA CORPORATION AND CHIPPAC, INC. A DELAWARE CORPORATIONAgreement and Plan of Merger • July 14th, 2000 • Chippac Inc • Semiconductors & related devices
AnTerms of Agreement • April 1st, 2002 • Chippac Inc • Semiconductors & related devices • California
This Intellectual Property Rights Agreement (this "Agreement") is made and --------- entered into as of June 30, 2000 ("Effective Date"), between Intersil -------------- Corporation, a corporation organized under the laws of Delaware ("Parent") and...Intellectual Property Rights Agreement • July 14th, 2000 • Chippac Inc • Semiconductors & related devices • New York
RECITALSSupply Agreement • July 14th, 2000 • Chippac Inc • Semiconductors & related devices • New York
RECITALSCommon Stock Purchase Agreement • July 14th, 2000 • Chippac Inc • Semiconductors & related devices • California
CHIPPAC, INC. 2-1/2% Convertible Subordinated Notes Due 2008 PURCHASE AGREEMENTPurchase Agreement • August 26th, 2003 • Chippac Inc • Semiconductors & related devices • New York
AGREEMENT AND PLAN OF MERGER AND REORGANIZATION among ST ASSEMBLY TEST SERVICES LTD, CAMELOT MERGER, INC. and CHIPPAC, INC. Dated as of February 10, 2004Agreement and Plan of Merger And • February 23rd, 2004 • Chippac Inc • Semiconductors & related devices • Delaware
AGREEMENT AND PLAN OF MERGER AND REORGANIZATION, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), CAMELOT MERGER, INC., a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), and ChipPAC, INC., a Delaware corporation (the “Company”).
VOTING AGREEMENT among ST ASSEMBLY TEST SERVICES LTD and the STOCKHOLDERS OF CHIPPAC, INC. identified on the signature pages hereto Dated as of February 10, 2004Voting Agreement • February 23rd, 2004 • Chippac Inc • Semiconductors & related devices • Delaware
VOTING AGREEMENT, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), and the stockholders (each a “Stockholder”) of ChipPAC, Inc., a Delaware corporation (the “Company”), identified on the signature pages hereto.
CHIPPAC, INC. RETENTION AND SEVERANCE AGREEMENTRetention and Severance Agreement • July 30th, 2004 • Chippac Inc • Semiconductors & related devices
In recognition of your committed efforts as an employee of ChipPAC, Inc. (the “Company”), we are offering you the opportunity to receive a special retention payment in the amount set forth below (the “Retention Payment”) and a special severance payment in the amount set forth below (the “Severance Payment,” together with other benefits, the “Severance Benefits”) in connection with the closing (the “Closing”) of the transactions contemplated by the Agreement and Plan of Merger and Reorganization among ST Assembly Test Services Ltd, Camelot Merger, Inc. and ChipPAC, Inc. dated as of February 10, 2004. The Retention Benefits and Severance Benefits both will be fully subject to the terms of the ChipPAC, Inc. Employee Retention and Severance Plan (the “Plan”). Capitalized terms used and not otherwise defined herein have the meanings set forth in the Plan.
ContractWaiver and Agreement • November 13th, 2002 • Chippac Inc • Semiconductors & related devices • New York
AMENDMENT NO. 4, WAIVER AND AGREEMENT dated as of May 17, 2002 (this “Amendment”), to the CREDIT AGREEMENT dated as of August 5, 1999, as amended and restated as of June 30, 2000, and as amended by Amendment No. 1 dated as of March 13, 2001, Amendment No. 2 dated as of June 8, 2001 and Amendment No. 3 dated as of December 31, 2001 (the “Credit Agreement”), among CHIPPAC INTERNATIONAL COMPANY LIMITED, a British Virgin Islands company (the “Company”), CHIPPAC, INC., a Delaware corporation (“ChipPAC”), the Lenders (as defined therein) and CREDIT SUISSE FIRST BOSTON, a bank organized under the laws of Switzerland, acting through its New York branch (“CSFB”), as administrative agent for the Lenders (in such capacity, the “Administrative Agent”), as sole lead arranger and as collateral agent for the Administrative Agent and the Lenders.
CHIPPAC, INC. REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • August 8th, 2003 • Chippac Inc • Semiconductors & related devices • New York
ChipPAC, Inc., a Delaware corporation (the “Company”), proposes to issue and sell to Lehman Brothers Inc. (the “Initial Purchaser”), upon the terms set forth in a purchase agreement dated May 22, 2003 (the “Purchase Agreement”), $125,000,000 aggregate principal amount (plus up to an additional $25,000,000 principal amount) of its 2.50% Convertible Subordinated Notes due 2008, (the “Initial Securities”). The Initial Securities will be convertible into shares of Class A common stock, par value $0.01 per share, of the Company (the “Common Stock”) at the conversion price set forth in the Offering Circular dated May 22, 2003. The Initial Securities will be issued pursuant to an Indenture, dated as of May 28, 2003, (the “Indenture”), among the Company and U.S. Bank National Association, as trustee (the “Trustee”). As an inducement to the Initial Purchaser to enter into the Purchase Agreement, the Company agrees with the Initial Purchaser, for the benefit of (i) the Initial Purchaser and (ii)
SEPARATION AGREEMENTSeparation Agreement • March 12th, 2004 • Chippac Inc • Semiconductors & related devices • California
THIS SEPARATION AGREEMENT (the “Agreement”) is made and entered into and is effective as of this 10th day of February 2004, by and among ST Assembly Test Services Ltd, a Singapore public company limited by shares (the “Company”), CHIPPAC, Inc., a Delaware company (“CHIPPAC”) and Dennis McKenna (the “Executive”).
SETTLEMENT AGREEMENT AND GENERAL RELEASESettlement Agreement and General Release • November 12th, 2003 • Chippac Inc • Semiconductors & related devices
This Settlement Agreement and General Release (hereinafter “Agreement”) is entered into as of this 26th day of September, 2003 (“Effective Date”), by and between Richard Freeman (hereinafter “Employee”) and ChipPAC, Inc. (hereinafter the “Company”).
CHIPPAC, INC RETENTION AND SEVERANCE AGREEMENTRetention and Severance Agreement • May 10th, 2004 • Chippac Inc • Semiconductors & related devices
In recognition of your committed efforts as an employee of ChipPAC, Inc. (the “Company”), we are offering you the opportunity to receive a special retention payment in the amount set forth below (the “Retention Payment”) and a special severance payment in the amount set forth below (the “Severance Payment,” together with other benefits, the “Severance Benefits”) in connection with the closing (the “Closing”) of the transactions contemplated by the Agreement and Plan of Merger and Reorganization among ST Assembly Test Services Ltd, Camelot Merger, Inc. and ChipPAC, Inc. dated as of February 10, 2004. The Retention Benefits and Severance Benefits both will be fully subject to the terms of the ChipPAC, Inc. Employee Retention and Severance Plan (the “Plan”). Capitalized terms used and not otherwise defined herein have the meanings set forth in the Plan.
