EXHIBIT 10.4 ------------ AMENDED & RESTATED SHAREHOLDERS AGREEMENT ---------------------- THIS SHAREHOLDERS AGREEMENT (this "Agreement") is made as of August 5, 1999, by and among ChipPAC, Inc., a California corporation (the "Company"), the Persons...Shareholders Agreement • November 24th, 1999 • Chippac LTD • California
Contract Type FiledNovember 24th, 1999 Company Jurisdiction
2D. Stockholders Agreement. The Company, Purchaser and each of the ---------------------- other stockholders of the Company listed therein will have entered into a stockholders agreement as set forth in Exhibit B attached hereto (the ---------...Stock Purchase Agreement • February 3rd, 2000 • Chippac LTD • Semiconductors & related devices • Delaware
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INDENTUREChippac LTD • November 24th, 1999
Company FiledNovember 24th, 1999
Exhibit 10.18 ADVISORY AGREEMENT ------------------ This Advisory Agreement (this "Agreement") is made and entered into as of August 5, 1999, by and between ChipPAC, Inc., a California corporation, ChipPAC Limited, a corporation incorporated under the...Advisory Agreement • November 24th, 1999 • Chippac LTD • New York
Contract Type FiledNovember 24th, 1999 Company Jurisdiction
This GUARANTY is entered into as of August 5, 1999, by CHIPPAC, INC., a California corporation ("ChipPAC"), and THE UNDERSIGNED DIRECT AND INDIRECT ------- SUBSIDIARIES of CHIPPAC (each such undersigned Subsidiary, a "Subsidiary ---------- Guarantor",...Chippac LTD • November 24th, 1999 • New York
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July 22, 1999 Credit Suisse First Boston Corporation Donaldson, Lufkin & Jenrette Securities Corporation c/o Credit Suisse First Boston Corporation Eleven Madison Avenue New York, N.Y. 10010 Ladies and Gentlemen: 1. Introductory. ChipPAC International...Purchase Agreement • November 24th, 1999 • Chippac LTD • New York
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AMENDMENT NO. 2Agreement and Plan • November 24th, 1999 • Chippac LTD
Contract Type FiledNovember 24th, 1999 Company
EXHIBIT 10.5 ------------ AMENDED & RESTATED REGISTRATION AGREEMENT ---------------------- THIS REGISTRATION AGREEMENT (this "Agreement") is made and entered into as of August 5, 1999, by and among ChipPAC, Inc., a California corporation (the...Registration Agreement • November 24th, 1999 • Chippac LTD • California
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RECITALS: --------Transition Services Agreement • November 24th, 1999 • Chippac LTD • California
Contract Type FiledNovember 24th, 1999 Company Jurisdiction
EXHIBIT 10.19 EMPLOYMENT AGREEMENT This Agreement (the "Agreement") is made and entered into and is effective as of October 1, 1999, between ChipPAC, Inc., a California corporation (the "Company") and Dennis McKenna ("Executive"). This Agreement...Employment Agreement • February 3rd, 2000 • Chippac LTD • Semiconductors & related devices • California
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July 29, 1999 CREDIT SUISSE FIRST BOSTON CORPORATION DONALDSON, LUFKIN & JENRETTE SECURITIES CORPORATION c/o CREDIT SUISSE FIRST BOSTON CORPORATION Eleven Madison Avenue New York, N.Y. 10010 Ladies and Gentlemen: ChipPAC International Limited, a...Rights Agreement • November 24th, 1999 • Chippac LTD • New York
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SUBLEASE TO 3151 Coronado Drive, Santa Clara, CA 95054Chippac LTD • November 24th, 1999
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CHIPPAC, INC., GuarantorChippac LTD • November 24th, 1999 • New York
Company FiledNovember 24th, 1999 Jurisdiction
Exhibit 10.3 SUBSIDIARY GUARANTY AGREEMENT, dated as of August 5, 1999, made by ChipPAC Korea Company Ltd., ChipPAC Limited, ChipPAC (Barbados) Ltd., ChipPAC Luxembourg S.a.R.L. and ChipPAC Liquidity Management Hungary Limited Liability Company...Subsidiary Guaranty Agreement • November 24th, 1999 • Chippac LTD • New York
Contract Type FiledNovember 24th, 1999 Company Jurisdiction
Translation] Lease Agreement This Real Estate Agreement, entered on June 30, 1998 by and between the Lessor, Hyundai Electronics Industries Co., Ltd. (the "Lessor"), and the Lessee, ChipPAC Korea ("Lessee"), as follows: Article 1. Description of...Lease Agreement • November 24th, 1999 • Chippac LTD
Contract Type FiledNovember 24th, 1999 Company
Pursuant to the Company's 1999 Stock Purchase and Option Plan (the "Plan"), a copy of which is attached hereto as Exhibit A, the Company and ---- --------- Employee desire to enter into an agreement pursuant to which the Company shall grant to...Tranche I Stock Option Agreement • November 24th, 1999 • Chippac LTD • California
Contract Type FiledNovember 24th, 1999 Company Jurisdiction
KEY EMPLOYEE PURCHASED STOCK AGREEMENT (WITH LOAN) (this "Agreement") --------- dated as of _________ __, 1999, by and between ChipPAC, Inc., a California corporation (the "Company") and ________ ("Employee"). ------- --------Key Employee Purchased Stock Agreement • November 24th, 1999 • Chippac LTD • California
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EXHIBIT 10.13 Intel/ChipPAC Confidential CHIPPAC LIMITED and INTEL CORPORATION MATERIALS AGREEMENT This Agreement (the "Agreement") is entered into as of July 1, 1999 (the "Effective Date) by and between ChipPAC Limited, a British Virgin Islands...Materials Agreement • April 13th, 2000 • Chippac LTD • Semiconductors & related devices • Delaware
Contract Type FiledApril 13th, 2000 Company Industry Jurisdiction
TESSERA, INC. TCC(R) License AgreementTessera Confidential • April 13th, 2000 • Chippac LTD • Semiconductors & related devices • California
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AMONGChinese Security Agreement • November 24th, 1999 • Chippac LTD • New York
Contract Type FiledNovember 24th, 1999 Company Jurisdiction
Amendment Agreement 2 Hyundai Electronics Industries Co., Ltd. (the "HEI") and ChipPAC Korea, Ltd. (the "CPK") agrees to amend the lease agreement ("the Agreement") executed between the parties as of June 30, 1998 and the Amendment Agreement (the...Chippac LTD • November 24th, 1999
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July 15, 1999Chippac LTD • February 3rd, 2000 • Semiconductors & related devices
Company FiledFebruary 3rd, 2000 IndustryRe: TCC License Agreement dated December 22, 1998, as amended between Tessera, Inc. and the Tessera Affiliates and ChipPAC, Inc. and the Licensee Affiliates (the "Agreement")
AGREEMENT AND PLAN OF RECAPITALIZATION AND MERGER dated as of March 13, 1999 by and among HYUNDAI ELECTRONICS INDUSTRIES CO., LTD., HYUNDAI ELECTRONICS AMERICA, CHIPPAC, INC., and CHIPPAC MERGER CORP.Agreement and Plan of Recapitalization And • November 24th, 1999 • Chippac LTD • California
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Exhibit 10.11 ------------- PATENT SUBLICENSE AGREEMENT --------------------------- THIS PATENT SUBLICENSE AGREEMENT (the "Agreement") is entered into as of the Effective Time by and between Hyundai Electronics Industries Co., Ltd., Hyundai Jeonja...Patent Sublicense Agreement • February 3rd, 2000 • Chippac LTD • Semiconductors & related devices • Illinois
Contract Type FiledFebruary 3rd, 2000 Company Industry Jurisdiction
Plan"), a copy of which is attached hereto as Exhibit A, the Company and ---- --------- Employee desire to enter into an agreement pursuant to which the Company shall grant to Employee certain options to acquire certain shares of the Company's Class A...Tranche Ii Stock Option Agreement • November 24th, 1999 • Chippac LTD • California
Contract Type FiledNovember 24th, 1999 Company Jurisdiction
Exhibit 10.8 ------------ Agreement Concerning Supply of Utilities, Use of Welfare Facilities and Management Services for Real Estate Hyundai Electronics Industries Co., Ltd. ("HEI") and ChipPAC Korea, ("CPK") hereby execute the Agreement concerning...Chippac LTD • November 24th, 1999
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