Damaged Goods. The Customer will provide feedback on wafers damaged during transit which are related to inadequate packing. IBM will then take reasonable corrective action if the damages were caused by IBM. Customer may return the wafer per Section 13 of the base foundry Agreement.
Appears in 2 contracts
Sources: Agreement for Purchase and Sale of Custom Semiconductor Products (Transmeta Corp), Agreement for Purchase and Sale of Custom Semiconductor Products (Transmeta Corp)
Damaged Goods. The Customer will provide feedback on wafers damaged during transit which are related to inadequate packing. IBM will then take reasonable corrective action if the damages were caused by IBM. If IBM determines that it was the cause of the damages, then Customer may return the wafer per Section 13 of using IBM's RMA process, and IBM will provide a new wafer or credit for the base foundry Agreementwafer, at IBM's option. This is Customer's exclusive remedy against IBM for transit related damages caused by IBM.
Appears in 2 contracts
Sources: Agreement for Purchase and Sale of Custom Semiconductor Products (Transmeta Corp), Agreement for Purchase and Sale of Custom Semiconductor Products (Transmeta Corp)
Damaged Goods. The Customer will provide feedback on wafers damaged during transit which are related to inadequate packing. IBM will then take reasonable corrective action if the damages were caused by IBM. Customer may return the wafer per Section 13 of the base foundry Agreementusing IBM's RMA process.
Appears in 1 contract
Sources: Custom Sales Agreement (Integrated Device Technology Inc)