Offering Circular. The Issuer prepared an offering circular (the “Offering Circular”) dated 4 November 2013 (the “Publication Date”) for use in connection with the offering of the Bonds and the listing of the Bonds on the Singapore Exchange Securities Trading Limited (the “Singapore Stock Exchange”).
Appears in 4 contracts
Samples: Subscription Agreement, Subscription Agreement (China Investment Corp), Subscription Agreement
Offering Circular. The Issuer prepared an offering circular (the “Offering Circular”) dated 4 November 2013 December 11, 2017 (the “Publication Date”) for use in connection with the offering of the Bonds Securities and the listing of the Bonds Securities on the Singapore Exchange Securities Trading Limited (the “Singapore Stock Exchange”).
Appears in 4 contracts
Samples: Subscription Agreement (Semiconductor Manufacturing International Corp), Subscription Agreement (Xinxin (Hong Kong) Capital Co., LTD), Subscription Agreement (Datang Telecom Technology & Industry Holdings Co., Ltd.)
Offering Circular. The Issuer prepared an offering circular (the “Offering Circular”) dated 4 November 2013 20 June 2014 (the “Publication Date”) for use in connection with the offering of the Further Bonds and the listing of the Further Bonds on the Singapore Exchange Securities Trading Limited (the “Singapore Stock Exchange”).
Appears in 1 contract
Samples: Subscription Agreement (Datang Telecom Technology & Industry Holdings LTD)
Offering Circular. The Issuer prepared an offering circular (the “Offering Circular”) dated 4 November 2013 December 11, 2017 (the “Publication Date”) for use in connection with the offering of the Bonds Securities and the listing of the Bonds Securities on the Singapore Exchange Securities Trading Limited (the “Singapore Stock Exchange”).
Appears in 1 contract
Samples: Subscription Agreement (Semiconductor Manufacturing International Corp)
