Offering Circular. The Issuer prepared an offering circular (the “Offering Circular”) dated December 11, 2017 (the “Publication Date”) for use in connection with the offering of the Securities and the listing of the Securities on the Singapore Exchange Securities Trading Limited (the “Singapore Stock Exchange”).
Appears in 4 contracts
Samples: Subscription Agreement (Semiconductor Manufacturing International Corp), Agreement (Xinxin (Hong Kong) Capital Co., LTD), Subscription Agreement (Datang Telecom Technology & Industry Holdings Co., Ltd.)
Offering Circular. The Issuer prepared an offering circular (the “Offering Circular”) dated December 11, 2017 4 November 2013 (the “Publication Date”) for use in connection with the offering of the Securities Bonds and the listing of the Securities Bonds on the Singapore Exchange Securities Trading Limited (the “Singapore Stock Exchange”).
Appears in 3 contracts
Samples: Subscription Agreement (China Investment Corp), Subscription Agreement, Subscription Agreement (Datang Telecom Technology & Industry Holdings LTD)
Offering Circular. The Issuer prepared an offering circular (the “Offering Circular”) dated December 11, 2017 (the “Publication Date”) for use in connection with the offering of the Securities and the listing of the Securities on the Singapore Exchange Securities Trading Limited (the “Singapore Stock Exchange”).
Appears in 1 contract
Samples: Subscription Agreement (Semiconductor Manufacturing International Corp)
Offering Circular. The Issuer prepared an offering circular (the “Offering Circular”) dated December 11, 2017 20 June 2014 (the “Publication Date”) for use in connection with the offering of the Securities Further Bonds and the listing of the Securities Further Bonds on the Singapore Exchange Securities Trading Limited (the “Singapore Stock Exchange”).
Appears in 1 contract
Samples: Subscription Agreement (Datang Telecom Technology & Industry Holdings LTD)
