December 13, 2001 J.P. Morgan Securities Inc. Banc of America Securities LLC Salomon Smith Barney Inc. PNC Capital Markets, Inc. BNY Capital Markets, Inc. Mizuho International plc Tokyo-Mitsubishi International plc c/o J.P. Morgan Securities Inc. 270...Purchase Agreement • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • New York
EXHIBIT 10.1 EMPLOYMENT AGREEMENT This EMPLOYMENT AGREEMENT (the "Agreement") is dated as of August 26, 2003 and is entered into by and between ALLEGHENY TECHNOLOGIES INCORPORATED, a Delaware corporation (the "Company"), and L. PATRICK HASSEY (the...Employment Agreement • November 4th, 2003 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
ANDRights Agreement • March 13th, 1998 • Allegheny Teledyne Inc • Semiconductors & related devices • Delaware
WITNESSETH:Assignment and Assumption Agreement • November 14th, 1997 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
EXHIBIT 4.1 CREDIT AGREEMENT ($325,000,000 CREDIT FACILITY)Credit Agreement • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • Pennsylvania
SECOND AMENDMENT TO CREDIT AGREEMENT Among ALLEGHENY TECHNOLOGIES INCORPORATED, as the Borrower THE FINANCIAL INSTITUTIONS PARTY HERETO, as the Lenders MELLON BANK, N.A., JPMORGAN CHASE BANK, and BANK OF AMERICA, N.A., as Syndication Agents andCredit Agreement • March 24th, 2003 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
EXHIBIT 10.12 FORM OF AGREEMENT RESTRICTED STOCK AGREEMENT This Restricted Stock Agreement (the "Agreement") made this 15th day of May, 2003 by and among ALLEGHENY TECHNOLOGIES INCORPORATED, a Delaware corporation (the "Corporation") and __________...Restricted Stock Agreement • March 15th, 2004 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
ALLEGHENY TECHNOLOGIES INCORPORATED AND THE BANK OF NEW YORK MELLON, as Trustee INDENTURE Dated as of June 22, 2020 3.50% Convertible Senior Notes due 2025Indenture • June 22nd, 2020 • Allegheny Technologies Inc • Steel pipe & tubes • New York
INDENTURE, dated as of June 22, 2020, between ALLEGHENY TECHNOLOGIES INCORPORATED, a Delaware corporation, as issuer (the “Company”) and THE BANK OF NEW YORK MELLON, a New York banking corporation, as trustee (the “Trustee”).
BY AND AMONGAsset Purchase Agreement • February 18th, 2004 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
1 EXHIBIT 4.1 FIFTH AMENDMENT TO CREDIT AGREEMENTCredit Agreement • March 14th, 2001 • Allegheny Technologies Inc • Semiconductors & related devices • Pennsylvania
ATI INC. Underwriting AgreementUnderwriting Agreement • August 11th, 2023 • Ati Inc • Steel pipe & tubes • New York
ATI Inc., a Delaware corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule I hereto (the “Underwriters”), for whom you are acting as Representative (the “Representative”), an aggregate of $425,000,000 principal amount of its 7.250% Senior Notes due 2030 (the “Securities”). The Securities are to be issued under a base indenture, dated as of September 14, 2021 (the “Base Indenture”), as supplemented by the Second Supplemental Indenture, to be dated as of the Closing Date (as defined below) (the “Second Supplemental Indenture” and, together with the Base Indenture, the “Indenture”), between the Company and Computershare Trust Company, N.A., as successor trustee to Wells Fargo Bank, National Association (the “Trustee”).
ALLEGHENY TECHNOLOGIES INCORPORATED as Issuer and THE BANK OF NEW YORK as Trustee Indenture Dated as of December 18, 2001 ------------------------------- -------------------------------------------------Indenture • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • New York
March __, 2002 FORM OF EXCHANGE AGENT AGREEMENT The Bank of New York 101 Barclay Street, Floor 21 West New York, New York 10286 Attention: Corporate Trust Administration Ladies and Gentlemen: Allegheny Technologies Incorporated, a Delaware corporation...Exchange Agent Agreement • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • New York
EXHIBIT 4.11Exchange and Registration Rights Agreement • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • New York
FORM OFChange in Control Severance Agreement • May 5th, 2005 • Allegheny Technologies Inc • Steel pipe & tubes
1 EXHIBIT 4 FOURTH AMENDMENT TO CREDIT AGREEMENT AND WAIVERCredit Agreement • August 16th, 1999 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
Exhibit 99.2 FIRST AMENDMENT TO REVOLVING CREDIT AND SECURITY AGREEMENT First Amendment to Revolving Credit and Security Agreement, dated the 15th day of April, 2004, by and among by and among Oregon Metallurgical Corporation, a corporation organized...Revolving Credit and Security Agreement • June 2nd, 2004 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
Attention: Telephone No.: Facsimile No.: [Title of contact] [ ] [ ]Call Option Transaction • June 22nd, 2020 • Allegheny Technologies Inc • Steel pipe & tubes
The purpose of this letter agreement (this “Confirmation”) is to confirm the terms and conditions of the call option transaction entered into between [Dealer] (“Dealer”) and Allegheny Technologies Incorporated (“Counterparty”) as of the Trade Date specified below (the “Transaction”). This letter agreement constitutes a “Confirmation” as referred to in the ISDA Master Agreement specified below. Each party further agrees that this Confirmation together with the Agreement evidence a complete binding agreement between Counterparty and Dealer as to the subject matter and terms of the Transaction to which this Confirmation relates, and shall supersede all prior or contemporaneous written or oral communications with respect thereto.
and -------------, Trustee IndentureIndenture • March 22nd, 2004 • Allegheny Technologies Inc • Steel pipe & tubes • New York
COMMERCIAL PAPER DEALER AGREEMENT 4(2) PROGRAM BETWEENCommercial Paper Dealer Agreement • March 14th, 2001 • Allegheny Technologies Inc • Semiconductors & related devices • New York
BY AND AMONGSeparation and Distribution Agreement • December 13th, 1999 • Allegheny Technologies Inc • Semiconductors & related devices • Pennsylvania
RECITALSSeparation Agreement • March 27th, 1997 • Allegheny Teledyne Inc • Semiconductors & related devices • California
July 22, 2004 J.P. MORGAN SECURITIES INC. CITIGROUP GLOBAL MARKETS INC. As Representatives of the several Underwriters listed in Schedule 1 hereto c/o J.P. Morgan Securities Inc. 277 Park Avenue New York, New York 10172 Ladies and Gentlemen: Allegheny...Underwriting Agreement • July 23rd, 2004 • Allegheny Technologies Inc • Steel pipe & tubes • New York
1 Exhibit 10.25 TAX SHARING AND INDEMNIFICATION AGREEMENT THIS TAX SHARING AND INDEMNIFICATION AGREEMENT (the "Agreement"), dated as of November 29, 1999, is made by and between Allegheny Teledyne Incorporated, a Delaware corporation ("ATI") on behalf...Tax Sharing and Indemnification Agreement • March 21st, 2000 • Allegheny Technologies Inc • Semiconductors & related devices • Pennsylvania
AmongCredit Agreement • May 15th, 1998 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
CREDIT AGREEMENT Dated as of August 30, 1996 By and AmongCredit Agreement • November 14th, 1996 • Allegheny Teledyne Inc • Semiconductors & related devices
Exhibit 10(a) EMPLOYMENT AGREEMENT THIS EMPLOYMENT AGREEMENT (the "Agreement") is executed this 17 day of August, 1999, by and between ALLEGHENY TELEDYNE INCORPORATED, a Delaware corporation with its principal place of business at 10th Floor, Six PPG...Employment Agreement • November 15th, 1999 • Allegheny Teledyne Inc • Semiconductors & related devices • Pennsylvania
EXHIBIT 4.6 ISSUING AND PAYING AGENCY AGREEMENT This Agreement, dated as of January 25, 2002, is by and between Allegheny Technologies Incorporated (the "ISSUER") and JPMorgan Chase Bank ("JPMORGAN"). 1. APPOINTMENT AND ACCEPTANCE The Issuer hereby...Issuing and Paying Agency Agreement • March 15th, 2002 • Allegheny Technologies Inc • Semiconductors & related devices • New York
AGREEMENT AND PLAN OF MERGER among ALLEGHENY TECHNOLOGIES INCORPORATED, LPAD CO., PADL LLC and LADISH CO., INC. Dated as of November 16, 2010Merger Agreement • November 17th, 2010 • Allegheny Technologies Inc • Steel pipe & tubes • Delaware
This AGREEMENT AND PLAN OF MERGER, dated as of November 16, 2010 (this “Agreement”), is among ALLEGHENY TECHNOLOGIES INCORPORATED, a Delaware corporation (“Parent”), LPAD CO., a Wisconsin corporation and a direct wholly owned Subsidiary of Parent (“Merger Sub”), PADL LLC, a Wisconsin limited liability company and a direct wholly owned Subsidiary of Parent (“Merger Sub 2”), and LADISH CO., INC., a Wisconsin corporation (the “Company”). Certain terms used in this Agreement are defined in Section 8.11.
PERFORMANCE/RESTRICTED STOCK AGREEMENTPerformance/Restricted Stock Agreement • May 6th, 2013 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
This Performance/Restricted Stock Agreement (the “Agreement”) made as of the 28th day of February 2013 by and between ALLEGHENY TECHNOLOGIES INCORPORATED, a Delaware corporation (the “Corporation”) and [NAME] (the “Employee”).
BY AND AMONGAsset Purchase Agreement • February 17th, 2004 • Allegheny Technologies Inc • Steel pipe & tubes • Pennsylvania
1 EXHIBIT 4.4 ISSUING AND PAYING AGENT AGREEMENT This Issuing and Paying Agency Agreement (the "Agreement"), dated as of November 2, 2000, between Allegheny Technologies Incorporated, a Delaware corporation (the "Issuer") and Bank One, National...Issuing and Paying Agent Agreement • March 14th, 2001 • Allegheny Technologies Inc • Semiconductors & related devices • New York
Form of 2024 Time-Vested Restricted Stock Unit AgreementTime-Vested Restricted Stock Unit Agreement • February 23rd, 2024 • Ati Inc • Steel pipe & tubes • Delaware
This Time-Vested Restricted Stock Unit Agreement (“Agreement”) is made as of the __ day of January, 2024 (the “Grant Date”) by and between ATI Inc., a Delaware company (the “Company”), and #ParticipantName+C# (the “Participant”).
ALLEGHENY TECHNOLOGIES INCORPORATED, Issuer and THE BANK OF NEW YORK MELLON, Trustee INDENTURE Dated as of June 1, 2009 Senior SecuritiesIndenture • June 3rd, 2009 • Allegheny Technologies Inc • Steel pipe & tubes • New York
INDENTURE, dated as of June 1, 2009, between Allegheny Technologies Incorporated, a corporation duly organized and existing under the laws of Delaware (herein called the “Company”), having its principal office as of the date hereof at 1000 Six PPG Place, Pittsburgh, PA 15222, and The Bank of New York Mellon, a New York banking corporation, as Trustee (herein called the “Trustee”).
Form of 2024 Performance-Vested Restricted Stock Unit AgreementPerformance-Vested Restricted Stock Unit Agreement • February 23rd, 2024 • Ati Inc • Steel pipe & tubes • Delaware
This Performance-Vested Restricted Stock Unit Agreement (this “Agreement”) is made as of the __ day of January, 2024 (the “Grant Date”) by and between ATI Inc., a Delaware company (the “Company”), and #ParticipantName+C# (the “Participant”).
