Standard Contracts
FIRST AMENDMENTCredit Agreement • May 3rd, 2001 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledMay 3rd, 2001 Company Industry Jurisdiction
W I T N E S S E T H:Credit Agreement • February 24th, 2000 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledFebruary 24th, 2000 Company Industry Jurisdiction
ANDAgreement • April 28th, 2004 • Viasystems Group Inc • Printed circuit boards • England
Contract Type FiledApril 28th, 2004 Company Industry Jurisdiction
1 EXHIBIT 2.9 STOCK PURCHASE AGREEMENTStock Purchase Agreement • September 28th, 2000 • Viasystems Group Inc • Printed circuit boards • Missouri
Contract Type FiledSeptember 28th, 2000 Company Industry Jurisdiction
WITNESSETH:Credit Agreement • July 30th, 2001 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledJuly 30th, 2001 Company Industry Jurisdiction
EXHIBIT 4.1 WARRANT AGREEMENTWarrant Agreement • April 28th, 2004 • Viasystems Group Inc • Printed circuit boards • Delaware
Contract Type FiledApril 28th, 2004 Company Industry Jurisdiction
FIRST AMENDMENTStockholders Agreement • March 13th, 2000 • Viasystems Group Inc • Printed circuit boards
Contract Type FiledMarch 13th, 2000 Company Industry
THIRD AMENDMENTCredit Agreement • April 1st, 2002 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledApril 1st, 2002 Company Industry Jurisdiction
1 EXHIBIT 1.1 40,000,000 SHARES VIASYSTEMS GROUP, INC. COMMON STOCK, $.01 PAR VALUE PER SHARE UNDERWRITING AGREEMENTUnderwriting Agreement • March 20th, 2000 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledMarch 20th, 2000 Company Industry Jurisdiction
VIASYSTEMS, INC. AND EACH OF THE GUARANTORS PARTY HERETO 7.875% SENIOR SECURED NOTES DUE 2019 INDENTURE Dated as of April 30, 2012 Wilmington Trust, National Association TrusteeIndenture • May 2nd, 2012 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledMay 2nd, 2012 Company Industry JurisdictionINDENTURE dated as of April 30, 2012 among Viasystems, Inc., a Delaware corporation (the “Company”), the Guarantors party hereto and Wilmington Trust, National Association, as trustee (the “Trustee”).
Dated as of March 29, 2000 Among VIASYSTEMS GROUP, INC., as Guarantor,Credit Agreement • May 10th, 2000 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledMay 10th, 2000 Company Industry Jurisdiction
ARTICLE 1 DEFINITIONSStockholders Agreement • March 13th, 2000 • Viasystems Group Inc • Printed circuit boards • Texas
Contract Type FiledMarch 13th, 2000 Company Industry Jurisdiction
WITNESSETH:Credit Agreement • August 14th, 2002 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledAugust 14th, 2002 Company Industry Jurisdiction
1 EXHIBIT 4.9 THE SECURITIES REPRESENTED BY THIS INSTRUMENT HAVE NOT BEEN REGISTERED UNDER THE SECURITIES ACT OF 1933, AS AMENDED, OR THE SECURITIES LAWS OF ANY STATE. THESE SECURITIES MAY NOT BE SOLD OR TRANSFERRED IN THE ABSENCE OF SUCH REGISTRATION...Subscription Agreement • July 30th, 2001 • Viasystems Group Inc • Printed circuit boards
Contract Type FiledJuly 30th, 2001 Company Industry
14% SENIOR NOTES DUE 2007Indenture • April 29th, 2002 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledApril 29th, 2002 Company Industry Jurisdiction
1 EXHIBIT 10.22 TERMINATION AND RELEASE AGREEMENT This TERMINATION AND RELEASE AGREEMENT (this "Agreement") is made and entered into as of March 29, 2000, by and among Viasystems Group, Inc., a Delaware corporation (the "Company"), Viasystems, Inc., a...Termination and Release Agreement • May 10th, 2000 • Viasystems Group Inc • Printed circuit boards • Delaware
Contract Type FiledMay 10th, 2000 Company Industry Jurisdiction
WITNESSETH:Supply Contract • April 28th, 2004 • Viasystems Group Inc • Printed circuit boards • Delaware
Contract Type FiledApril 28th, 2004 Company Industry Jurisdiction
RECITALS:Contract Manufacturing Agreement • September 28th, 2000 • Viasystems Group Inc • Printed circuit boards
Contract Type FiledSeptember 28th, 2000 Company Industry
AGREEMENT AND PLAN OF MERGER by and among DDI CORP., VIASYSTEMS GROUP, INC. and VICTOR MERGER SUB CORP. Dated as of April 3, 2012Merger Agreement • April 4th, 2012 • Viasystems Group Inc • Printed circuit boards • Delaware
Contract Type FiledApril 4th, 2012 Company Industry JurisdictionTHIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of April 3, 2012, by and among DDi Corp., a Delaware corporation (the “Company”), Viasystems Group, Inc., a Delaware corporation (“Parent”), and Victor Merger Sub Corp., a Delaware corporation and wholly-owned Subsidiary of Parent (“Merger Sub”).
1 EXHIBIT 4.10 REGISTRATION RIGHTS AGREEMENT DATED AS OF JULY 19, 2001Registration Rights Agreement • July 30th, 2001 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledJuly 30th, 2001 Company Industry Jurisdiction
INDUSTRIAL SPACE LEASE (GROSS)Industrial Space Lease • August 8th, 2012 • Viasystems Group Inc • Printed circuit boards • California
Contract Type FiledAugust 8th, 2012 Company Industry JurisdictionTHIS LEASE, dated July 1, 2012, for reference purposes only, is made by and between ROBERT D. DUCOTE and GAIL H. DUCOTE (“Landlord”), and Viasystems Corporation (“Tenant”), to be effective and binding upon the parties as of the date of the last designated signatories to this Lease shall have executed this Lease (the “Effective Date of this Lease”).
1 EXHIBIT 10.13 AMENDED AND RESTATED EXECUTIVE EMPLOYMENT AGREEMENT This agreement is made and entered into as of the 16th day of February, 2000 by and among Viasystems Group, Inc. ("Corporation"), Viasystems, Inc. ("Viasystems") and Viasystems...Executive Employment Agreement • February 24th, 2000 • Viasystems Group Inc • Printed circuit boards • Missouri
Contract Type FiledFebruary 24th, 2000 Company Industry Jurisdiction
EXHIBIT 10.5 AMENDED AND RESTATED EXECUTIVE EMPLOYMENT AGREEMENT This Agreement is made and entered into as of the 16th day of February, 2000 by and among Viasystems Group, Inc. ("Viasystems"), Viasystems, Inc. ("Inc."), and Viasystems Technologies...Executive Employment Agreement • April 28th, 2004 • Viasystems Group Inc • Printed circuit boards • Missouri
Contract Type FiledApril 28th, 2004 Company Industry Jurisdiction
VOTING AGREEMENTVoting Agreement • April 13th, 2012 • Viasystems Group Inc • Printed circuit boards • Delaware
Contract Type FiledApril 13th, 2012 Company Industry JurisdictionThis Voting Agreement (this “Agreement”), dated as of April 3, 2012, is between the individual or entity listed on the signature page hereto (the “Voting Stockholder”) and Viasystems Group, Inc., a Delaware corporation (“Parent”).
STOCKHOLDER AGREEMENTStockholder Agreement • February 17th, 2010 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledFebruary 17th, 2010 Company Industry JurisdictionTHIS STOCKHOLDER AGREEMENT (this “Stockholder Agreement”) is entered into as of February 11, 2010, by and between Viasystems Group, Inc., a Delaware corporation (the “Company”), and VG Holdings, LLC, a Delaware limited liability company (the “Stockholder”).
AGREEMENT AND PLAN OF MERGER by and among VIASYSTEMS GROUP, INC., TTM TECHNOLOGIES, INC. and VECTOR ACQUISITION CORP. Dated as of September 21, 2014Merger Agreement • September 22nd, 2014 • Viasystems Group Inc • Printed circuit boards • Delaware
Contract Type FiledSeptember 22nd, 2014 Company Industry JurisdictionTHIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of September 21, 2014, by and among Viasystems Group, Inc., a Delaware corporation (the “Company”), TTM Technologies, Inc., a Delaware corporation (“Parent”), and Vector Acquisition Corp., a Delaware corporation and wholly owned Subsidiary of Parent (“Merger Sub” and, collectively with the Company and Parent, the “Parties”).
VOTING AGREEMENTVoting Agreement • April 13th, 2012 • Viasystems Group Inc • Printed circuit boards • Delaware
Contract Type FiledApril 13th, 2012 Company Industry JurisdictionThis Voting Agreement (this “Agreement”), dated as of April 3, 2012, is among the individual or entity listed on the signature page hereto (the “Voting Stockholder”) and Viasystems Group, Inc., a Delaware corporation (“Parent”).
AMENDED AND RESTATED EXECUTIVE EMPLOYMENT AGREEMENTExecutive Employment Agreement • February 9th, 2011 • Viasystems Group Inc • Printed circuit boards • Missouri
Contract Type FiledFebruary 9th, 2011 Company Industry JurisdictionThis Agreement is made and entered into as of the 15th day of August, 2005 by and among Viasystems Group, Inc. ("Viasystems") and, Viasystems, Inc. ("Inc." and, together with Viasystems and the other subsidiaries of Viasystems set forth on the signature pages hereto, "Employer"), and Gerald G. Sax ("Employee").
AMENDED AND RESTATED EXECUTIVE EMPLOYMENT AGREEMENTExecutive Employment Agreement • September 24th, 2014 • Viasystems Group Inc • Printed circuit boards • Missouri
Contract Type FiledSeptember 24th, 2014 Company Industry JurisdictionThis Agreement is made and entered into as of the 21st day of September, 2014 (the “Effective Date”) by and among Viasystems Group, Inc. (“Viasystems”), Viasystems, Inc. (“Inc.”) and Viasystems Technologies Corp. LLC (“LLC” and, together with Viasystems, Inc. and the other subsidiaries listed on the signature page hereto, “Employer”), and David M. Sindelar (“Employee”).
INTERCREDITOR AGREEMENTIntercreditor Agreement • May 2nd, 2012 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledMay 2nd, 2012 Company Industry JurisdictionThis INTERCREDITOR AGREEMENT, dated as of April 30, 2012 (as amended, amended and restated, renewed, extended, supplemented or otherwise modified from time to time in accordance with the terms hereof, this “Agreement”), is entered into by and among Viasystems, Inc., a Delaware corporation (the “Company”), certain direct or indirect subsidiaries of the Company from time to time party hereto (together with the Company, the “Grantors”, and each, a “Grantor”), Wells Fargo Capital Finance, LLC, successor by merger to Wachovia Capital Finance Corporation (New England), in its capacity as collateral agent for the First Lien Claimholders (including its successors and assigns from time to time, the “First Lien Collateral Agent”), and Wilmington Trust, National Association, in its capacity as collateral trustee (including its successors and assigns from time to time, the “Collateral Trustee”) for the Second Lien Claimholders. As described in more detail in Section 8.10 hereof, this Agreement is
TEMPORARY OCCUPANCY AGREEMENTTemporary Occupancy Agreement • February 15th, 2012 • Viasystems Group Inc • Printed circuit boards • Texas
Contract Type FiledFebruary 15th, 2012 Company Industry JurisdictionThis Temporary Occupancy Agreement (this “Agreement”) is made and entered into by and between VERDE 9580 JOE RODRIGUEZ DR., LP, a Texas limited Partnership (“Landlord”), VIASYSTEMS TECHNOLOGIES CORP. LLC (“Occupant”), effective as of June 1, 2011 (the “Effective Date”) on the following terms:
COLLATERAL TRUST AGREEMENT dated as of April 30, 2012 among VIASYSTEMS, INC., THE OTHER GRANTORS FROM TIME TO TIME PARTY HERETO, WILMINGTON TRUST, NATIONAL ASSOCIATION, as Trustee under the Indenture, THE OTHER PARITY LIEN REPRESENTATIVES FROM TIME TO...Collateral Trust Agreement • May 2nd, 2012 • Viasystems Group Inc • Printed circuit boards • New York
Contract Type FiledMay 2nd, 2012 Company Industry JurisdictionThis COLLATERAL TRUST AGREEMENT, dated as of April 30, 2012 (this “Agreement”), is entered into by and among Viasystems, Inc. a Delaware corporation (the “Company”), the direct or indirect subsidiaries of the Company listed in the signature pages hereto (collectively, the “Guarantors”), each Additional Grantor (together with the Company and the Guarantors, the “Grantors”, and each, a “Grantor”), Wilmington Trust, National Association, as trustee (in such capacity, together with its successors and assigns in such capacity, the “Notes Trustee”) under the Indenture referred to below, the other Parity Lien Representatives from time to time party hereto, and Wilmington Trust, National Association, as collateral trustee (in such capacity, together with its successors and assigns in such capacity, the “Collateral Trustee”) for the Secured Parties.
SECOND AMENDMENT TO LEASELease • August 8th, 2012 • Viasystems Group Inc • Printed circuit boards
Contract Type FiledAugust 8th, 2012 Company IndustryTHIS SECOND AMENDMENT TO LEASE (“Amendment”) is entered into as of the 1st day of July 2012, by and between James Rando (“Lessor”) and Viasystems Corporation (“Lessee”), to amend the lease dated September 20, 2005 and amended October 1, 2010. The Parties enter into this Amendment based upon the following facts, intentions and understandings:
EXHIBIT 10.4 AMENDED AND RESTATED EXECUTIVE EMPLOYMENT AGREEMENT This Agreement is made and entered into as of the 31st day of January, 2003 by and among Viasystems Group, Inc. ("Corporation"), Viasystems, Inc. ("Viasystems") and Viasystems...Executive Employment Agreement • April 28th, 2004 • Viasystems Group Inc • Printed circuit boards • Missouri
Contract Type FiledApril 28th, 2004 Company Industry Jurisdiction
PROPOSED Viasystems Group, Inc. RESTRICTED STOCK AWARD AGREEMENTRestricted Stock Award Agreement • May 17th, 2010 • Viasystems Group Inc • Printed circuit boards • Delaware
Contract Type FiledMay 17th, 2010 Company Industry JurisdictionTHIS RESTRICTED STOCK AWARD AGREEMENT (this “Agreement”) is made effective as of _____ (the “Date of Grant”) by and between Viasystems Group, Inc., a Delaware corporation (with any successor, the “Company”), and _________ (the “Participant”).