Omnivision Technologies Inc Sample Contracts

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Date
Underwriting Agreement • March 8th, 2000 • Omnivision Technologies Inc • New York
FIRST AMENDMENT TO LEASE
Lease • March 8th, 2000 • Omnivision Technologies Inc
OmniVision Software License Agreement
Software License Agreement • March 8th, 2000 • Omnivision Technologies Inc
EXHIBIT 4.2 OMNIVISION TECHNOLOGIES, INC. AMENDED AND RESTATED REGISTRATION RIGHTS AGREEMENT
Registration Rights Agreement • March 8th, 2000 • Omnivision Technologies Inc • California
SALES AGREEMENT
Sales Agreement • March 8th, 2000 • Omnivision Technologies Inc
BACKGROUND
Registration Rights Agreement • April 25th, 2005 • Omnivision Technologies Inc • Semiconductors & related devices • California
RECITALS
Preferred Stock Rights Agreement • September 9th, 2004 • Omnivision Technologies Inc • Semiconductors & related devices • Delaware
DEED OF TRUST, ASSIGNMENT OF RENTS AND LEASES, SECURITY AGREEMENT AND FIXTURE FILING
Deed of Trust • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • California

THIS DEED OF TRUST, ASSIGNMENT OF RENTS AND LEASES, SECURITY AGREEMENT AND FIXTURE FILING (the “Deed of Trust”) is made as of March 20, 2007 by OMNIVISION TECHNOLOGIES, INC., a Delaware corporation (“Trustor”), as trustor, to FIRST AMERICAN TITLE INSURANCE COMPANY (“Trustee”), as trustee, for the benefit of CITIBANK, N.A., a national banking association (“Beneficiary”), as beneficiary.

PUT AGREEMENT
Put Agreement • April 25th, 2005 • Omnivision Technologies Inc • Semiconductors & related devices • California
OMNIVISION TECHNOLOGIES 3,125,000 Shares of Common Stock Underwriting Agreement
Underwriting Agreement • June 27th, 2003 • Omnivision Technologies Inc • Semiconductors & related devices • New York

OmniVision Technologies, Inc., a Delaware corporation (the “Company”), proposes to issue and sell to the several Underwriters listed in Schedule 1 hereto (the “Underwriters”), for whom you are acting as representatives (the “Representatives”), an aggregate of 3,000,000 shares, and, at the option of the Underwriters but solely to cover over-allotments, up to an additional 468,750 shares, of Common Stock, par value $0.001 per share (the “Stock”), of the Company, and the stockholders of the Company named in Schedule II hereto (the “Selling Stockholders”) propose to sell to the Underwriters an aggregate of 125,000 shares. The aggregate of 3,125,000 shares which may be sold by the Company and the Selling Stockholders is herein called the “Underwritten Shares” and the aggregate of 468,750 additional shares, which may be sold by the Company, is herein called the “Option Shares.” The Underwritten Shares and the Option Shares are herein referred to as the “Shares”. The Shares will have attached

OMNIVISION TECHNOLOGIES, INC.
Stock Option Agreement • November 1st, 2001 • Omnivision Technologies Inc • Semiconductors & related devices • Delaware

Unless otherwise defined herein, the terms defined in the Plan shall have the same defined meanings in this Option Agreement.

EXHIBIT 10.7 Non-exclusive Distributor Agreement
Non-Exclusive Distributor Agreement • March 8th, 2000 • Omnivision Technologies Inc
AMENDMENT TO LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • June 26th, 2012 • Omnivision Technologies Inc • Semiconductors & related devices

This Amendment To Loan and Security Agreement (“Amendment”), dated April 11, 2012 by and between OmniVision Technologies, Inc. (“Borrower”) and Citibank, N.A., (“Lender”), is made with respect to the following facts:

Mortgage Agreement
Mortgage Agreement • September 9th, 2009 • Omnivision Technologies Inc • Semiconductors & related devices

Important : This Agreement is entered into by and between the parties in accordance with relevant laws and regulations and based on equal and free negotiations, and all the provisions under this Agreement represent true intention of both parties. In order to fully protect the legal rights of mortgagor, mortgagee specifically urges the mortgagor to carefully read the provisions in bolded fonts of this Agreement, and consider the contents thereof thoroughly.

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FOUNDRY MANUFACTURING AGREEMENT
Foundry Manufacturing Agreement • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • California

THIS FOUNDRY MANUFACTURING AGREEMENT (the “Agreement”) is entered into on February 27, 2007 (the “Effective Date”) by and between OmniVision International Holding Ltd., a Cayman Islands company, having its registered office at Second Floor, Zephyr House, Mary Street, P. O. Box 709, George Town, Grand Cayman, Cayman Islands, British West Indies (“OmniVision”) and Powerchip Semiconductor Corp., a company duly incorporated under the laws of the Republic of China, having its principal office located at No. 12, Li-Hsin Rd. 1, Hsinchu Science Park, Hsinchu, Taiwan, R.O.C. (“PSC”). OmniVision and PSC are each a “Party” and collectively the “Parties”.

EQUITY INTERESTS TRANSFER AGREEMENT by and among CHINA WLCSP LIMITED and INFINITY-CSVC VENTURE CAPITAL ENTERPRISE and OMNIVISION TRADING (HONG KONG) COMPANY LIMITED APRIL, 6, 2007
Equity Interests Transfer Agreement • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • New York

This Equity Interests Transfer Agreement (this “Agreement”) is made as of April 6, 2007 (the “Effective Date”), by and among the following entities:

SHARE PURCHASE AGREEMENT
Share Purchase Agreement • November 24th, 2015 • Omnivision Technologies Inc • Semiconductors & related devices • California

This Share Purchase Agreement (the “Agreement”) is effective as of August 14, 2015 (“Effective Date”) by and among TSMC Partners, Ltd., a British Virgin Islands company (“TSMC” or “Purchaser”), OmniVision Technologies, Inc. a company incorporated under the laws of Delaware, USA (“OVT”), OmniVision International Holding, Ltd. an exempted company incorporated under the Companies Law of Cayman Islands (“OmniVision Cayman”), and OmniVision Investment Holding (BVI) Ltd. a British Virgin Islands company (“OmniVision BVI”). OVT, OmniVision Cayman, and OmniVision BVI may be collectively referred individually and collectively as “Seller” or “Sellers”. The parties to this agreement may be referred to as a “Party” or collectively as the “Parties”.

Fixed Assets Loan Agreement
Fixed Assets Loan Agreement • September 9th, 2009 • Omnivision Technologies Inc • Semiconductors & related devices

For purposes stated in Article 3.1 of this contract, Party A has applied to Party B for a loan. Party B has agreed to provide the loan to Party A. In order to set forth the respective rights and obligations, pursuant to the Contract Law, the General Provisions of Lending and other relevant laws and regulations, both parties, after equal and friendly negotiation, have entered into this contract.

SHARE PURCHASE AGREEMENT
Share Purchase Agreement • November 24th, 2015 • Omnivision Technologies Inc • Semiconductors & related devices

This Share Purchase Agreement (the “Agreement”) is effective as of August 14, 2015 (“Effective Date”) by and among Taiwan Semiconductor Manufacturing Co. Ltd., a Taiwan company (“TSMC” or “Purchaser”), OmniVision Technologies, Inc. a company incorporated under the laws of Delaware, USA (“OVT”), and OmniVision International Holding Ltd., a company incorporated under the laws of Cayman Islands (“OVT Cayman”). OVT and OmniVision Cayman may be collectively referred individually and collectively as “Seller” or “Sellers”. The parties to this agreement may be referred to as a “Party” or collectively as the “Parties”.

OMNIVISION TECHNOLOGIES, INC. CONSULTING AGREEMENT
Consulting Agreement • August 28th, 2008 • Omnivision Technologies Inc • Semiconductors & related devices • California

This Consulting Agreement (the “Agreement”) is made effective as of September 30, 2008 (the “Effective Date”) by and between OmniVision Technologies, Inc. and its affiliates (together, the “Company”) and Peter V. Leigh, (“Consultant”).

FIRST AMENDMENT TO LOAN AND SECURITY AGREEMENT, PROMISSORY NOTE SECURED BY DEED OF TRUST (MORTGAGE LOAN), AND PROMISSORY NOTE SECURED BY DEED OF TRUST (TERM LOAN)
Loan and Security Agreement • December 10th, 2008 • Omnivision Technologies Inc • Semiconductors & related devices • California

This First Amendment to Loan and Security Agreement, Promissory Note Secured By Deed of Trust (Mortgage Loan), and Promissory Note Secured By Deed of Trust (Term Loan)(“Amendment”), dated as of October 31, 2008, by and between CITIBANK, N.A. (“Lender”), and OMNIVISION TECHNOLOGIES, INC. (“Borrower”) is made with reference to the following facts:

LOAN AND SECURITY AGREEMENT by and between OMNIVISION TECHNOLOGIES, INC. a Delaware corporation and CITIBANK, N.A., a national banking association Dated as of March 16, 2007
Loan and Security Agreement • June 29th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices • California

THIS LOAN AND SECURITY AGREEMENT (“Agreement”) is entered into as of the above date between Citibank N.A., a national banking association (“Lender”), with offices at 201 West Lexington Drive, 6th Floor, Glendale, California 91203, and the borrower named above (“Borrower”), whose chief executive office is located at the above address (“Borrower’s Address”).

First Amendment to the AMENDED AND RESTATED SHAREHOLDERS’ AGREEMENT
Shareholders’ Agreement • March 12th, 2007 • Omnivision Technologies Inc • Semiconductors & related devices

This Amendment (the “Amendment”) to the Amended and Restated Shareholders’ Agreement dated August 12th, 2005 (the “Amended Agreement”), is hereby made effective this 1st day of January, 2007 (the “Amendment Effective Date”) by and amongst Taiwan Semiconductor Manufacturing Co., Ltd. a company incorporated under the laws of Taiwan, Republic of China (“TSMC”), OmniVision International Holding Ltd., an exempted company incorporated under the Companies Law of Cayman Islands (“OmniVision”), VisEra Technologies Company, Ltd., a company incorporated under the laws of Taiwan, Republic of China (“VisEra Taiwan”), and VisEra Holding Company, an exempted company incorporated under the Companies Law of the Cayman Islands (“VisEra Cayman”). OmniVision and TSMC are each sometimes referred to herein as a “Shareholder” and collectively as the “Shareholders”; OmniVision, TSMC, VisEra Taiwan and VisEra Cayman are each sometimes referred to herein as a “Party” or collectively as the “Parties”.

AGREEMENT AND PLAN OF MERGER by and among SEAGULL INTERNATIONAL LIMITED, SEAGULL ACQUISITION CORPORATION and OMNIVISION TECHNOLOGIES, INC. Dated as of April 30, 2015
Merger Agreement • April 30th, 2015 • Omnivision Technologies Inc • Semiconductors & related devices • New York

THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of April 30, 2015 by and among Seagull International Limited, a Cayman Islands exempted limited company (“Investor”), Seagull Acquisition Corporation, a Delaware corporation and a wholly owned subsidiary of Investor (“Acquisition Sub”), and OmniVision Technologies, Inc., a Delaware corporation (the “Company”).

BACKGROUND ----------
Shareholders' Agreement • December 12th, 2003 • Omnivision Technologies Inc • Semiconductors & related devices • California
PATENT ASSIGNMENT AGREEMENT between EASTMAN KODAK COMPANY and OMNIVISION TECHNOLOGIES, INC. dated as of March 31, 2011
Patent Assignment Agreement • June 26th, 2012 • Omnivision Technologies Inc • Semiconductors & related devices • New York

THIS PATENT ASSIGNMENT AGREEMENT (this “Assignment Agreement”) is made as of March 31, 2011 (the “Closing Date”), by and between EASTMAN KODAK COMPANY, a New Jersey corporation having its principal place of business at 343 State Street, Rochester, New York 14650 (“Kodak”), and OMNIVISION TECHNOLOGIES, INC., a Delaware corporation having its principal place of business at 4275 Burton Drive, Santa Clara, California 95054 (“Buyer”).

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