Applied Micro Circuits Corp Sample Contracts

ARTICLE 1 AGREEMENT OF PURCHASE AND SALE ------------------------------
Purchase and Sale Agreement • February 14th, 2001 • Applied Micro Circuits Corp • Semiconductors & related devices • California
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EXHIBIT 10.21 LOAN AGREEMENT SECURED BY PROPERTY ----------------------------------
Loan Agreement • February 20th, 1998 • Applied Micro Circuits Corp • Semiconductors & related devices • California
R E C I T A L S: - - - - - - - -
Lease • June 28th, 2000 • Applied Micro Circuits Corp • Semiconductors & related devices
AGREEMENT ---------
Indemnification Agreement • October 10th, 1997 • Applied Micro Circuits Corp • Delaware
EXHIBIT 10.12 APPLIED MICRO CIRCUITS CORPORATION THIRD AMENDMENT TO PROMISSORY NOTE
Promissory Note • October 10th, 1997 • Applied Micro Circuits Corp
LEASE
Lease • October 10th, 1997 • Applied Micro Circuits Corp • California
AGREEMENT FOR CONSULTING SERVICES (LUMP SUM)
Consulting Services Agreement • November 16th, 1998 • Applied Micro Circuits Corp • Semiconductors & related devices • California
EXHIBIT 10.2 LICENSE AGREEMENT
License Agreement • May 19th, 2000 • Applied Micro Circuits Corp • Semiconductors & related devices • California
EXHIBIT 10.19 INTRODUCTION ------------
Licensing Agreement • October 10th, 1997 • Applied Micro Circuits Corp • Texas
LEASE
Lease • November 14th, 2000 • Applied Micro Circuits Corp • Semiconductors & related devices • Massachusetts
EXHIBIT 2.1 AGREEMENT AND PLAN OF MERGER dated as of March 3, 1999
Merger Agreement • April 13th, 1999 • Applied Micro Circuits Corp • Semiconductors & related devices • Delaware
1997 STOCK PLAN
Stock Option Agreement • October 30th, 2000 • Applied Micro Circuits Corp • Semiconductors & related devices • California
MULTIMEDIA COMMUNICATIONS, INC. 1993 STOCK PLAN STOCK OPTION AGREEMENT
Stock Option Agreement • October 30th, 2000 • Applied Micro Circuits Corp • Semiconductors & related devices
LEASE
Lease • June 24th, 1999 • Applied Micro Circuits Corp • Semiconductors & related devices • California
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EXHIBIT 10.25(a) GROUND LEASE
Ground Lease • November 16th, 1998 • Applied Micro Circuits Corp • Semiconductors & related devices • California
RECITALS --------
Security Agreement • October 10th, 1997 • Applied Micro Circuits Corp • California
EXHIBIT 10.22 NOTE SECURED BY DEED OF TRUST
Note Secured by Deed of Trust • February 20th, 1998 • Applied Micro Circuits Corp • Semiconductors & related devices • California
FORM OF VOTING AGREEMENT
Voting Agreement • September 3rd, 2003 • Applied Micro Circuits Corp • Semiconductors & related devices • Delaware

This Voting Agreement (“Agreement”) is made and entered into as of August , 2003, by and between Azure Corporation, a Delaware corporation (“Parent”), and the undersigned stockholder (“Stockholder”) of Jade Corporation, a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement that are not defined herein or in Section 8 shall have the meaning given to such terms in the Merger Agreement (as defined below).

EXHIBIT 99.1 AGREEMENT AND PLAN OF MERGER AND REORGANIZATION
Merger Agreement • September 7th, 2000 • Applied Micro Circuits Corp • Semiconductors & related devices • Delaware
EMPLOYMENT AND NON-SOLICITATION AGREEMENT
Employment Agreement • May 30th, 2007 • Applied Micro Circuits Corp • Semiconductors & related devices • California

This Employment and Non-Solicitation Agreement (“Agreement”) is made as of the Effective Date, as defined below, by and between 3Ware, Inc. (“Employer” or “Company”) and Barbara Murphy (“Employee”).

APPLIED MICRO CIRCUITS CORPORATION RESTRICTED STOCK UNIT AGREEMENT
Restricted Stock Unit Agreement • May 30th, 2007 • Applied Micro Circuits Corp • Semiconductors & related devices • California

Pursuant to your Restricted Stock Unit Grant Notice (“Grant Notice”) and this Restricted Stock Unit Agreement (“Agreement”), Applied Micro Circuits Corporation (the “Company”) has awarded you a Restricted Stock Unit under Section 7(a) of the Applied Micro Circuits Corporation 2000 Equity Incentive Plan (the “Plan”) for the number of shares of the Company’s common stock (the “Common Stock”) indicated in the Grant Notice (collectively, the “Award”). Defined terms not explicitly defined in this Agreement but defined in the Plan shall have the same definitions as in the Plan.

Certain confidential information contained in this document, marked by brackets, has been omitted and filed separately with the Securities and Exchange Commission pursuant to Rule 24b-2 of the Securities Exchange Act of 1934, as amended.
Intellectual Property Agreement • May 20th, 2004 • Applied Micro Circuits Corp • Semiconductors & related devices

WHEREAS, SELLER and BUYER have executed concurrently herewith an “Asset Purchase Agreement” (“APA”), and other ancillary agreements identified herein as the “Operative Agreements” for the purpose of conveying certain assets and licensing certain intellectual property from SELLER to BUYER in a divestiture and acquisition transaction (the “Transaction”) associated with SELLER’s standard products development operations.

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