L E A S E ARTICLE 1Lease • May 15th, 2000 • Oak Technology Inc • Semiconductors & related devices • Massachusetts
This Indemnification Agreement (this "Agreement") is made as of the _____ --------- day of ________, 2002, by and between Oak Technology, Inc., a Delaware corporation (the "Corporation") and ___________ ("Indemnitee"), a director -----------...Indemnification Agreement • May 15th, 2003 • Oak Technology Inc • Semiconductors & related devices • Delaware
SETTLEMENT AGREEMENTSettlement Agreement • May 15th, 1998 • Oak Technology Inc • Semiconductors & related devices
EXHIBIT 4.07 AMENDMENT TO RIGHTS AGREEMENTRights Agreement • February 14th, 2002 • Oak Technology Inc • Semiconductors & related devices
AND BANKBOSTON, N.A. (RIGHTS AGENT) RIGHTS AGREEMENTRights Agreement • September 25th, 1997 • Oak Technology Inc • Semiconductors & related devices • Delaware
Notwithstanding anything in this Agreement to the contrary, neither Zoran Corporation ("Zoran") nor Zinc Acquisition Corporation (the "Merger Sub"), nor ----- ---------- any of their respective Affiliates, shall be deemed to be an Acquiring Person,...Rights Agreement • June 27th, 2003 • Oak Technology Inc • Semiconductors & related devices • Delaware
ANDRights Agreement • August 21st, 1997 • Oak Technology Inc • Semiconductors & related devices • Delaware
OPTION AGREEMENTOption Agreement • March 24th, 1997 • Oak Technology Inc • Semiconductors & related devices
EXHIBIT 99.6Stock Option Assumption Agreement • January 12th, 2000 • Oak Technology Inc • Semiconductors & related devices
RELEASE AND SETTLEMENT AGREEMENT This Release and Settlement Agreement ("AGREEMENT") is effective this 31st day of July, 1997, hereinafter the date of this AGREEMENT, between Oak Technology, Inc. ("OAK TECHNOLOGY"), a corporation organized and...Release and Settlement Agreement • September 25th, 1997 • Oak Technology Inc • Semiconductors & related devices • California
EXHIBIT 10.2 OAK TECHNOLOGY, INC. AGREEMENT OF PLAN PARTICIPATION This Agreement is made and entered into as of May 6, 2002, by and between Oak Technology, Inc., a Delaware corporation (the "Company"), and the Chief Executive Officer named below (the...Retention and Severance Agreement • November 15th, 2002 • Oak Technology Inc • Semiconductors & related devices
Grant _____________ [LOGO] OAK TECHNOLOGY, INC. EMPLOYEE NON-QUALIFIED STOCK OPTION AGREEMENT THIS EMPLOYEE NON-QUALIFIED STOCK OPTION AGREEMENT (this "AGREEMENT") by and between Oak Technology, Inc., a Delaware corporation (the COMPANY"), and...Employee Non-Qualified Stock Option Agreement • August 15th, 2001 • Oak Technology Inc • Semiconductors & related devices • California
FIRST AMENDMENT TO PLAN OF REORGANIZATION AND AGREEMENT OF MERGERPlan of Reorganization and Agreement of Merger • September 25th, 1997 • Oak Technology Inc • Semiconductors & related devices • Massachusetts
EXHIBIT 10.26 FIRST AMENDMENT TO THE OPTION AGREEMENT THIS FIRST AMENDMENT TO THE OPTION AGREEMENT (the "Amendment") is made and becomes effective as of March 1, 1998 (the "Effective Date") by and between Taiwan Semiconductor Manufacturing Co., Ltd.,...Option Agreement • May 15th, 1998 • Oak Technology Inc • Semiconductors & related devices
SUBLEASE AGREEMENT THIS SUBLEASE AGREEMENT (the "Sublease") is dated for reference purposes only as of December 1, 1997 by and between GLOBAL VILLAGE COMMUNICATION, INC., a Delaware corporation ("Sublandlord"), and OAK TECHNOLOGY, INC., a Delaware...Sublease Agreement • February 13th, 1998 • Oak Technology Inc • Semiconductors & related devices • California
EXHIBIT 1 FIRST AMENDMENT TO THE RIGHTS AGREEMENT AND CERTIFICATION OF COMPLIANCE WITH SECTION 27 THEREOF Pursuant to Section 27 of the Rights Agreement (the "Agreement") dated as of August 19, 1997, between Oak Technology, Inc., a Delaware...Rights Agreement • November 25th, 1998 • Oak Technology Inc • Semiconductors & related devices
R E C I T A L SNon-Qualified Stock Option Agreement • August 17th, 1999 • Oak Technology Inc • Semiconductors & related devices • California
AMENDMENT AGREEMENT (NO. 1) TO DEPOSIT AGREEMENT DATED 8 NOVEMBER 1995Amendment Agreement (No. 1) to Deposit Agreement • January 2nd, 1997 • Oak Technology Inc • Semiconductors & related devices
OAK TECHNOLOGY, INC. EMPLOYEE NON-QUALIFIED STOCK OPTION AGREEMENT UNDER TERALOGIC GROUP PLANEmployee Non-Qualified Stock Option Agreement • November 25th, 2002 • Oak Technology Inc • Semiconductors & related devices • California
THIS EMPLOYEE NON-QUALIFIED STOCK OPTION AGREEMENT (this "Agreement") by and between Oak Technology, Inc., a Delaware corporation (the "Company"), and «FIRST_NAME» «LAST_NAME» (the "Employee"), is made as of the «OPTION_DATE» (such date being sometimes referred to herein as the "Date of Grant").
AGREEMENT AND PLAN OF REORGANIZATION among ZORAN CORPORATION, a Delaware corporation (“Zoran”), ZINC ACQUISITION CORPORATION, a Delaware corporation and wholly-owned subsidiary of Zinc, and OAK TECHNOLOGY, INC., a Delaware corporation Dated May 4, 2003Agreement and Plan of Reorganization • May 7th, 2003 • Oak Technology Inc • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF REORGANIZATION is made and entered into as of May 4, 2003 by and among Zoran Corporation, a Delaware corporation (“Zoran”), Zinc Acquisition Corporation, a Delaware corporation and a wholly-owned subsidiary of Zoran (“Sub”), and Oak Technology, Inc., a Delaware corporation (“Oak”).
EXHIBIT 10.1 EXECUTIVE OFFICER SEVERANCE AGREEMENT This Executive Officer Severance Agreement (the "Agreement") is effective as of March 30, 2001 ("Effective Date"), and is by and between _______________ (the "Executive"), an individual currently...Executive Officer Severance Agreement • May 15th, 2001 • Oak Technology Inc • Semiconductors & related devices • California
R E C I T A L STermination Agreement • September 25th, 1997 • Oak Technology Inc • Semiconductors & related devices • Massachusetts
OAK TECHNOLOGY, INC. EMPLOYEE NON-QUALIFIED STOCK OPTION AGREEMENT THIS EMPLOYEE NON-QUALIFIED STOCK OPTION AGREEMENT (this "AGREEMENT") by and between Oak Technology, Inc., a Delaware corporation (the "COMPANY"), and ___________(the "EMPLOYEE"), is...Employee Non-Qualified Stock Option Agreement • January 6th, 1999 • Oak Technology Inc • Semiconductors & related devices • California
AGREEMENT AND PLAN OF MERGER BY AND AMONG OAK TECHNOLOGY, INC. OPTIC ACQUISITION CORP. AND TERALOGIC, INC. Dated as of October 7, 2002Merger Agreement • October 8th, 2002 • Oak Technology Inc • Semiconductors & related devices • Delaware
AGREEMENT AND PLAN OF MERGER, (this "Agreement") dated as of October 7, 2002, among OAK TECHNOLOGY, INC. ("Parent"), a Delaware corporation, OPTIC ACQUISITION CORP. ("Merger Sub"), a Delaware corporation, and TERALOGIC, INC. (the "Company"), a Delaware corporation.
FIRST AMENDMENT TO ASSET PURCHASE AGREEMENTAsset Purchase Agreement • April 18th, 2003 • Oak Technology Inc • Semiconductors & related devices • California
This FIRST AMENDMENT TO ASSET PURCHASE AGREEMENT (this "Amendment") is made as of the 3rd day of April, 2003, by and between OAK TECHNOLOGY, INC., a Delaware corporation ("Seller") and SUNPLUS TECHNOLOGY CO. LTC., a Taiwanese corporation ("Buyer"). Capitalized terms used herein and not otherwise defined herein have the meanings set forth in the Asset Purchase Agreement (as defined below).
Exhibit 10.29 EMPLOYMENT AGREEMENT This Employment Agreement is made and entered into by and between Oak Technology Inc. (the "Company") and Young Sohn ("Sohn") as of February 22, 1999 (the "Effective Date"). 1. POSITION AND DUTIES. Sohn shall be...Employment Agreement • May 17th, 1999 • Oak Technology Inc • Semiconductors & related devices • California
OAK TECHNOLOGY, INC. EXECUTIVE: By: ------------------------------- ---------------------------------- Name: Name: Date: Date: Appendix A ---------- RELEASE OF CLAIMSPlan Participation Agreement • November 15th, 2002 • Oak Technology Inc • Semiconductors & related devices
FIRST AMENDMENT TO NON-COMPETE AND TECHNOLOGY TRANSFER AGREEMENT THIS FIRST AMENDMENT (the "AMENDMENT") to that certain Non-Compete and Technology Transfer Agreement (the "AGREEMENT") by and among Oak Technology, Inc., a Delaware corporation ("OAK"),...Non-Compete and Technology Transfer Agreement • September 25th, 1997 • Oak Technology Inc • Semiconductors & related devices • Massachusetts
EXHIBIT A PLAN OF REORGANIZATION AND AGREEMENT OF MERGER OAK TECHNOLOGY, INC., PIXEL MAGIC, INC. XEROGRAPHIC LASER IMAGES CORPORATION AND OTI ACQUISITION CORPORATION JANUARY 29, 1998Plan of Reorganization and Agreement of Merger • February 6th, 1998 • Oak Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 99.5Stock Option Agreement • January 12th, 2000 • Oak Technology Inc • Semiconductors & related devices • Massachusetts
INDEMNITY AGREEMENTIndemnity Agreement • November 13th, 1996 • Oak Technology Inc • Semiconductors & related devices • Delaware
AMENDMENT AGREEMENT (NO. 3) TO DEPOSIT AGREEMENT DATED 8 NOVEMBER 1995Amendment Agreement (No. 3) to Deposit Agreement • February 16th, 1999 • Oak Technology Inc • Semiconductors & related devices
FIRST AMENDMENT TO THE AGREEMENT AND PLAN OF MERGERAgreement and Plan of Merger • October 30th, 2002 • Oak Technology Inc • Semiconductors & related devices • Delaware
THIS FIRST AMENDMENT TO THE AGREEMENT AND PLAN OF MERGER (this "Amendment"), is made and entered into as of the 25th day of October, 2002, by and among OAK TECHNOLOGY, INC., a Delaware corporation ("Parent"), OPTIC ACQUISITION CORP., a Delaware corporation and a wholly owned subsidiary of Parent ("Merger Sub"), and TERALOGIC, INC., a Delaware corporation (the "Company"). Capitalized terms used herein and not otherwise defined herein have the meanings set forth in the Merger Agreement (as defined below).
EXHIBIT 10.36 BILL OF SALE AND ASSIGNMENT AGREEMENT by and between CONEXANT SYSTEMS, INC.Bill of Sale and Assignment Agreement • May 15th, 2000 • Oak Technology Inc • Semiconductors & related devices • Delaware
EXHIBIT 8.01 December 10, 1999 Xionics Document Technologies, Inc. 70 Blanchard Road Burlington, MA 01803 Ladies and Gentlemen: This opinion is furnished to you pursuant to Section 8.1(g) of the Agreement and Plan of Merger and Reorganization dated as...Agreement and Plan of Merger and Reorganization • December 10th, 1999 • Oak Technology Inc • Semiconductors & related devices
