EXECUTION VERSION CREDIT AGREEMENT (364-DAY) Dated as of December 6, 2001Credit Agreement • May 13th, 2002 • Sanmina-Sci Corp • Printed circuit boards • California
RECITALSVoting Agreement • August 10th, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
Relating to 5 1/2% Convertible Subordinated Notes Due 2002First Supplemental Indenture • June 23rd, 1997 • Sanmina Corp/De • Printed circuit boards • New York
AMENDMENT AGREEMENTCredit Agreement • December 4th, 2002 • Sanmina-Sci Corp • Printed circuit boards • California
ADDENDUM TO ASSET PURCHASE AGREEMENT RELATING TO REAL ESTATE MATTERSAsset Purchase Agreement • November 15th, 1996 • Sanmina Corp/De • Printed circuit boards • Delaware
EXHIBIT 4.11 AMENDMENT NO. 1 TO CREDIT AGREEMENT AMENDMENT NO. 1 TO CREDIT AGREEMENT (this "AMENDMENT"), dated as of June 30, 2003, among Sanmina-SCI Corporation, a Delaware corporation ("COMPANY"), each of the Guarantors listed on the signature pages...Credit Agreement • August 11th, 2003 • Sanmina-Sci Corp • Printed circuit boards • New York
EXHIBIT 10.48.2 SECOND AMENDMENT TO THIRD AMENDED AND RESTATED RECEIVABLES PURCHASE AGREEMENT This Second Amendment to Third Amended and Restated Receivables Purchase Agreement, dated as of October 8, 2002 (this "Amendment"), is among SCI FUNDING,...Receivables Purchase Agreement • December 4th, 2002 • Sanmina-Sci Corp • Printed circuit boards • New York
ARTICLE 1 RELATION TO BASE INDENTURE; DEFINITIONSSupplemental Indenture • December 4th, 2002 • Sanmina-Sci Corp • Printed circuit boards • New York
STATEMENT OF ELIGIBILITY UNDER THE TRUST INDENTURE ACT OF 1939 OF A CORPORATION DESIGNATED TO ACT AS TRUSTEETrust Indenture • May 16th, 2001 • Sanmina Corp/De • Printed circuit boards
ARTICLE ONE DEFINITIONS AND OTHER PROVISIONS OF GENERAL APPLICATION SECTION 101. Definitions.................................................. 1 SECTION 102. Compliance Certificates and Opinions......................... 42 SECTION 103. Form of...Indenture • February 11th, 2003 • Sanmina-Sci Corp • Printed circuit boards • New York
1 Exhibit 8.1 September 25, 1997 Sanmina Corporation 355 East Trimble Road San Jose, California 95131 Ladies and Gentlemen: This opinion is being delivered to you in accordance with Section 6.3(d) of the Agreement and Plan of Merger dated as of July...Reorganization Agreement • September 26th, 1997 • Sanmina Corp/De • Printed circuit boards
BY AND AMONGRegistration Rights Agreement • July 30th, 1999 • Sanmina Corp/De • Printed circuit boards • New York
1 EXHIBIT 4.3 REGISTRATION RIGHTS AGREEMENTRegistration Rights Agreement • November 20th, 2000 • Sanmina Corp/De • Printed circuit boards • New York
1 EXHIBIT 2.4 AMENDMENT TO MERGER AGREEMENT AMENDMENT, dated September 14, 2001, to AMENDED AND RESTATED AGREEMENT AND PLAN OF REORGANIZATION (the "AGREEMENT") made and entered into as of July 13, 2001, among Sanmina Corporation, a Delaware...Merger Agreement • September 26th, 2001 • Sanmina Corp/De • Printed circuit boards
Sanmina – SCI Corporation Underwriting AgreementUnderwriting Agreement • February 3rd, 2006 • Sanmina-Sci Corp • Printed circuit boards • New York
Sanmina-SCI Corporation, a corporation organized under the laws of Delaware (the “Company”), proposes to issue and sell to the several underwriters named in Schedule A hereto (the “Underwriters”), for whom you (the “Representatives”) are acting as representatives, $600,000,000 principal amount of its 8.125% Senior Subordinated Notes due 2016 (the “Notes”). The Notes will be guaranteed (collectively, the “Guarantees”) by each of the subsidiary guarantors named in Schedule B hereto (the “Notes Guarantors”). The Notes and the Guarantees are collectively referred to herein as the “Securities.” The Securities are to be issued under an indenture (the “Indenture”), to be dated as of the Closing Date (as defined in Section 4 hereof), among the Company, the Notes Guarantors and U.S. Bank National Association, as trustee (the “Trustee”). To the extent there are no additional underwriters listed on Schedule A other than you, the term Representatives as used herein shall mean you as the Underwrite
EXHIBIT 4.6 CREDIT AND GUARANTY AGREEMENT DATED AS OF DECEMBER 23, 2002Credit and Guaranty Agreement • February 11th, 2003 • Sanmina-Sci Corp • Printed circuit boards • New York
EXHIBIT 2.7 EMPLOYMENT AGREEMENT THIS AGREEMENT, by and among Sanmina Corporation, a Delaware corporation ("Sanmina"), SCI Systems, Inc., a Delaware corporation (the "Corporation"), and James E. Moylan (the "Executive"), dated as of this ____ day of...Employment Agreement • November 1st, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
EXHIBIT 2.5 EMPLOYMENT AGREEMENT THIS AGREEMENT, by and between Sanmina Corporation ("Sanmina") and SCI SYSTEMS, INC., a Delaware corporation (the "Corporation"), and A. Eugene Sapp, Jr. (the "Executive"), dated as of this ____ day of _______, 2001. W...Employment Agreement • November 1st, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
STATEMENT OF ELIGIBILITY UNDER THE TRUST INDENTURE ACT OF 1939 OF A CORPORATION DESIGNATED TO ACT AS TRUSTEETrust Indenture Act Eligibility Statement • May 16th, 2001 • Sanmina Corp/De • Printed circuit boards
1 EXHIBIT 10.0 AGREEMENT AND PLAN OF MERGER dated as of July 22, 1997, among SANMINA CORPORATION, a Delaware corporation ("Parent"), SANM ACQUISITION SUBSIDIARY, INC., a Delaware corporation and a wholly owned subsidiary of Parent ("Sub"), and ELEXSYS...Merger Agreement • July 30th, 1997 • Sanmina Corp/De • Printed circuit boards • Delaware
ANDPreferred Stock Rights Agreement • May 25th, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
1 EXHIBIT 2.1Registration Rights Agreement • April 14th, 1999 • Sanmina Corp/De • Printed circuit boards • California
SANMINA CORPORATION STOCK OPTION AGREEMENTStock Option Agreement • May 2nd, 2019 • Sanmina Corp • Printed circuit boards • California
Unless otherwise defined herein, the terms defined in the Sanmina Corporation 2019 Equity Incentive Plan (the “Plan”) will have the same defined meanings in this Stock Option Agreement, which includes the Notice of Stock Option Grant (the “Notice of Grant”), the Terms and Conditions of Stock Option Grant attached hereto as Exhibit A, the Exercise Notice attached hereto as Exhibit B, and all other exhibits and appendices attached hereto (all together, the “Option Agreement”).
EXECUTION VERSION CREDIT AGREEMENT (MULTI-YEAR) Dated as of December 6, 2001 among SANMINA CORPORATION and CERTAIN SUBSIDIARIES, as Borrowers, BANK OF AMERICA, N.A., as Administrative Agent and L/C Issuer, CITICORP USA, INC. as Syndication Agent,...Credit Agreement • May 13th, 2002 • Sanmina-Sci Corp • Printed circuit boards
FOURTH AMENDED AND RESTATED CREDIT AGREEMENT Dated as of November 30, 2018 amongCredit Agreement • February 7th, 2019 • Sanmina Corp • Printed circuit boards • New York
THIS FOURTH AMENDED AND RESTATED CREDIT AGREEMENT (this “Agreement”) is entered into as of November 30, 2018, among SANMINA CORPORATION, a Delaware corporation (the “Borrower”), each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and an Issuing Lender.
October 28, 1998Amended and Restated Agreement and Plan of Merger • October 28th, 1998 • Sanmina Corp/De • Printed circuit boards
BY AND AMONGAgreement and Plan of Reorganization • July 17th, 2001 • Sanmina Corp/De • Printed circuit boards • Delaware
Exhibit 10.52 December 5, 2002 Mr. Gene Sapp Sanmina-SCI Corporation 1201 West Clinton Avenue Huntsville, Alabama 35805 Re: Employment Agreement Dear Gene: The term of the Employment Agreement of September, 2001 between yourself and Sanmina-SCI...Employment Agreement • February 11th, 2003 • Sanmina-Sci Corp • Printed circuit boards
The term of the Employment Agreement of September, 2001 between yourself and Sanmina-SCI Corporation (the "Employment Agreement") is set to expire on December 6, 2002. Your efforts to assist in the integration of the Sanmina and SCI business operations have proven highly valuable in the past twelve months. To continue your efforts in assisting in the integration of the two companies, the Company wishes to extend your term of employment. By executing this letter, you agree to extend the term of your employment, as described in Section 1 of the Employment Agreement, until December 6, 2003. This letter will also amend Section 2 of your Employment Agreement to provide that your services as Co-Chairman of Sanmina-SCI Corporation and SCI Systems, Inc. will end on December 6, 2002 and that your employment during the extended term will continue to focus on providing leadership to the Company in its efforts to integrate the Sanmina and SCI operations and assistance in the Company's transition e
1 EXHIBIT 8.1 August 10, 2001 Sanmina Corporation 2700 North First Street San Jose, CA 95134 Re: Merger pursuant to the Agreement and Plan of Reorganization (the "Agreement") dated July 13, 2001 among Sanmina Corporation, a Delaware corporation...Merger Agreement • August 10th, 2001 • Sanmina Corp/De • Printed circuit boards
SANMINA-SCI CORPORATION, as Issuer THE GUARANTORS PARTY HERETO, as Guarantors and U.S. BANK NATIONAL ASSOCIATION, as TrusteeIndenture • February 24th, 2005 • Sanmina-Sci Corp • Printed circuit boards • New York
INDENTURE, dated as of February 24, 2005, among Sanmina-SCI Corporation, a corporation duly organized and existing under the laws of the State of Delaware, as issuer (herein called the “Company”), having its principal executive offices at 2700 North First Street, San Jose, California 95134, the Notes Guarantors (as defined herein) and U.S. Bank National Association, as trustee (herein called the “Trustee”).
INDEMNIFICATION AGREEMENTIndemnification Agreement • August 4th, 2008 • Sanmina-Sci Corp • Printed circuit boards • Delaware
This Indemnification Agreement (“Agreement”) is made as of by and between Sanmina-SCI Corporation, a Delaware corporation (the “Company”), and (“Indemnitee”).
RECITALS:Shareholder Agreement • July 5th, 2000 • Sanmina Corp/De • Printed circuit boards • Delaware
Senior Floating Rate Notes due 2010Indenture • June 13th, 2007 • Sanmina-Sci Corp • Printed circuit boards • New York
LOAN AGREEMENTLoan Agreement • November 21st, 2012 • Sanmina Corp • Printed circuit boards • New York
This LOAN AGREEMENT (as amended, restated, modified or otherwise supplemented from time to time, this “Agreement”) dated as of July 19, 2012, made by SANMINA-SCI CORPORATION, a Delaware corporation, having an address at 2700 North First Street, San Jose, California (“Borrower”), and UNION BANK, N.A., a national banking association, having an office at Technology, Media and Telecommunications Group, National Banking, 350 California Street 17th floor, San Francisco, CA 94104 (“Bank”).
AMENDED AND RESTATED CREDIT AND GUARANTY AGREEMENT dated as of December 16, 2005 among SANMINA–SCI CORPORATION, CERTAIN SUBSIDIARIES OF SANMINA–SCI CORPORATION, as Guarantors, VARIOUS LENDERS, BANK OF AMERICA, N.A., as Initial Issuing Bank CITICORP...Credit and Guaranty Agreement • December 22nd, 2005 • Sanmina-Sci Corp • Printed circuit boards • New York
This AMENDED AND RESTATED CREDIT AND GUARANTY AGREEMENT, dated as of December 16, 2005, is entered into by and among SANMINA–SCI CORPORATION, a Delaware corporation (“Company”), CERTAIN SUBSIDIARIES OF COMPANY, as Guarantors, the Lenders party hereto from time to time, BANK OF AMERICA, N.A. (“Bank of America”), as the Initial Issuing Bank (the “Initial Issuing Bank” and, together with the Lenders, the “Lender Parties”), CITICORP USA, INC., as Syndication Agent (the “Syndication Agent”), THE BANK OF NOVA SCOTIA, DEUTSCHE BANK TRUST COMPANY AMERICAS and KEYBANK NATIONAL ASSOCIATION, as Co-Documentation Agents (the “Co-Documentation Agents”), BANC OF AMERICA SECURITIES LLC and CITIGROUP GLOBAL MARKETS INC., as Joint Book Managers and Joint Lead Arrangers (the “Lead Arrangers”), BANK OF AMERICA, as Administrative Agent (together with its permitted successors in such capacity, “Administrative Agent”), and CITIBANK, N.A., as Collateral Agent (together with its permitted successors in such ca
