LOAN AGREEMENT CONTRACT
Exhibit 10.14
The Loan Agreement (the "Agreement") between the following two parties:
(1) EIGATE (HONG KONG) TECHNOLOGY CO., LIMITED (the "Lender"), a limited liability company established and registered in Hong Kong, SAR.
Registered address: Xxxx 00, 0/X., Xxxxx X, Xxx Xxxxxxxx Xxxxx, no. 00 Xxxxxxx Xxxxxx Xxxx, Xxxx Xxx Xxxx Xxxxxxx
(2) ASPIRE SCIENCE AND TECHNOLOGY LIMITED (the "Borrower"), a limited liability company established and registered in Hong Kong, SAR.
Registered address: Xxxx X, 00/X, Xxxx Xxxxxx Xxxxx, 00 King Yip Street, Xxxx Xxxx, Hong Kong
Elgate (HK) Tech Co Ltd. agree to lend a total sum of USD 80,000,000.00 (Eighty million) to Aspire Science and Technology Limited without interest fee.
Repayment
The lending period is to be determined and the "Borrower" should return back the borrowed amount to the "Lender".
| Agree and accepted by: | Agree and accepted by: | |
| EIGATE (HONG KONG) TECHNOLOGY CO., LIMITED | ASPIRE SCIENCE AND TECHNOLOGY LIMITED | |
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| Date: 01 September 2018 | Date: 01 September 2018 |
