CENTRAL TRUST OF CHINA
PROCUREMENT DEPARTMENT
Contract No. YL-7604-5498 (95-GFR3-0453) Contract Date June 5, 1995
CENTRAL TRUST OF CHINA, Procurement Department, (hereinafter referred to as
Buyer) 00 Xx-Xxxxx Xxxxxx, Xxxxxxx 0, Xxxxxx, Xxxxxx 100, Republic of China
(Telex: 11377 TRUSTPRO, Fax: (00)000-0000) on behalf of the client Xxxxx
Xxxx Institute of Science and Technology hereby agrees to buy and Parlex
Corporation, 000 Xxxx Xxxxxx, Xxxxxxx, XX 00000 X.X.X. (hereinafter referred
to as Seller) agrees to sell the following in accordance with the terms and
conditions set forth hereunder and at the back of this contract:
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Item
No. Description Qty. Extension
--------------------------------------------------------------------------------------
Rigid-Flex PCB Manufacturing Technology Transfer. 1 lot *
Details as per attached statement of work.
Payment by 100% irrevocable L/C against invoices, etc.,
and advised through Shawmut Bank N.A., 0 Xxxxxxx Xxxxxx,
Xxxxxx, XX 00000, XXX, A/C #000-000000-0, ABA #000000000.
All banking charges outside Taiwan shall be paid by the
beneficiary.
All required documentation should be delivered to
consignee by common carrier. The consignee's address:
Xxxxx Xxxx Institute of Science and Technology, Xx. 000,
Xxxx-Xx Xxx., Xxxxx-Xxxxx Xx.., Xxxx-Xx Xxxxxxx, Xxxxxxx,
Xxxxxx.
All other requirements specified in special notes
attached.
SHIPPING MARKS: L/C beneficiary ____________________
ORDER NO: YL-7604-5498(95-GFR3-0453) same as seller
Address: same as seller
Supplier: same as seller
Shipping Wts: Address: same as seller
GFR3-840321 Measurements: Manufacturer: same as seller
XB4165A Case No.: Address: same as seller
CSIST
P D
Taipei, Taiwan
INSURANCE: To be effected by Buyer upon receipt of Seller's shipping notice.
TO COMPLETE THE PROGRAM:
SHIPMENT: Within 28 weeks after the contract being effected.
Partial shipments are/not permitted.
INSPECTION: Maker's Inspection Certificate required on specifications,
quantity, quality, proper packing and marking.
IN WITNESS WHEREOF, the parties hereto have caused this Contract signed by
their respective officers duly authorized.
FOR CENTRAL TRUST OF CHINA FOR Parlex Corporation
PROCUREMENT DEPARTMENT
/s/ XXXXX XXXXX /s/ XXXXX X. XXXXXX
---------------------------------- ----------------------------------
* Confidential information has been omitted and filed separately with the
Commission.
CENTRAL TRUST OF CHINA
REPRESENTATIVE OFFICE IN NEW YORK
XXX XXXXX XXXXX XXXXXX - XXXXX 0000
XXX XXXX, XX 00000-0000
Telephone: (000)000-0000-0 Fax: (000)000-0000
XXXXXXXX XX. XX-0000-0000, 00-XXX0-0000
XXXXXXXXXX: SPECIAL NOTES
1. THE SELLER IS RESPONSIBLE FOR THE TRANSPORTATION, LODGING AND MEALS OF
THREE TRAINEES VISITATION DURING THE PHASE ONE.
2. THE SELLER SHOULD PROVIDE THE SUPPORT OF ANY REASONABLE REQUEST FOR
ENGINEERING ASSISTANCE IN WRITTEN FORM WITHOUT ANY ADDITIONAL CHARGE. IF
THE ENGINEERING SUPPORT IN THE BUYER'S FACILITY IS REQUIRED, WITHIN A
PERIOD OF TWO YEARS, THE FEE SHOULD BE LESS THAN US *
(PLUS AIR FARE, HOTEL & SUBSISTENCE). IF REFRESHER TRAINING IS REQUIRED
BY THE ENDUSER, CSIST, AFTER 12 MONTHS, THE FEE WILL BE NO MORE THAN
*.
3. THE REQUIRED DOCUMENTATION AND TRAINING MATERIALS WHICH WILL BE DELIVERED
TO THE ENDUSER, CSIST, IN TAIWAN VIA COMMON CARRIER WITH AIR FREIGHT
PREPAID. THE DOCUMENTATION SHALL BE SHIPPED TO CSIST WITHIN TWO MONTHS
AFTER RECEIPT OF THE LETTER OF CREDIT.
4. CONSIGNEE: CHUNG-SHAN INSTITUTE OF SCIENCE OF TECHNOLOGY
481, CHIA-AN SEC., XXXXX-XXXXX ROAD, CHIA-AN VILLAGE
LUNG-TAN, TAIWAN, R.O.C.
5. THE SELLER SHALL SEND A SHIPPING NOTICE TO CSIST BY FAX (#011-886-3-471-
1494) FOR APPROVAL AT LEAST 30 DAYS BEFORE SHIPMENT. CSIST WILL APPROVE
THE SHIPMENT WITHIN TWO WORKING DAYS AFTER RECEIPT OF SUCH NOTICE AND
NOTIFY CTC/PD TO ISSUE AN APPROVED SHIPPING ADVICE, STATING THAT SHIPMENT
IS APPROVED AND CAN BE MADE, THROUGH THE L/C ISSUING BANK TO THE SELLER.
THE APPROVED SHIPPING ADVICE ISSUED BY CTC/PD SHALL BE PRESENTED WITH THE
SHIPPING DOCUMENTS FOR L/C NEGOTIATION.
6. PAYMENT SCHEDULE:
1ST PAYMENT: * FOR DOCUMENTATION WILL BE MADE AGAINST
SHIPPING DOCUMENTS EVIDENCING THE SHIPMENT OF
DOCUMENTATION HAVE BEEN DONE.
2ND PAYMENT: * FOR TECHNOLOGY, MATERIAL AND TRAINING AT
PARLEX & CSIST WILL BE MADE AGAINST SIGNED SIMPLE
RECEIPT AND CTC/PD'S PAYMENT ADVICE THROUGH THE
L/C ISSUING BANK AFTER THE COMPLETION OF TRAINING.
3RD PAYMENT: * FOR SAMPLE QUALIFICATION ADMINISTRATION AND
PROGRAM MANAGEMENT WILL BE MADE AGAINST SIGNED
SIMPLE RECEIPT AND CTC/PD'S PAYMENT ADVICE
THROUGH THE L/C ISSUING BANK AFTER THE FINAL
ACCEPTANCE OF THE ENTIRE PROGRAM BY THE CSIST.
* Confidential information has been omitted and filed separately with the
Commission.
CENTRAL TRUST OF CHINA
REPRESENTATIVE OFFICE IN NEW YORK
XXX XXXXX XXXXX XXXXXX - XXXXX 0000
XXX XXXX, XX 00000-0000
Telephone: (000)000-0000-0 Fax: (000)000-0000
XXXXXXXX XX. XX-0000-0000, 00-XXX0-0000
XXXXXXXXXX: SPECIAL NOTES
(continuing from previous page)
7. ALL SERVICE INCOMES INCURRED IN TAIWAN, R.O.C. WILL BE LEVIED THE
BUSINESS INCOME TAX AT PREVAILING RATE AT THE TIME OF PAYMENT. THE
CURRENT RATE FOR SAID TAX IS 20%. SELLER HAS TO PAY THE TAX FOR DOING
TRAINING AT CSIST AND THE TAX AMOUNT, * WILL BE WITHHELD
UPON PAYMENT.
8. EFFECTIVENESS OF THE CONTRACT:
THIS CONTRACT WILL BE IN EFFECT AFTER CSIST'S TRAINING AT PARLEX PROGRAM
HAS BEEN APPROVED BY THE DEFENSE DEPT. GOVERNMENT OF TAIWAN REPUBLIC OF
CHINA. CSIST SHOULD SEND A NOTICE BY FAX TO SELLER (FAX: 000-000-0000)
TO EFFECT THE CONTRACT WITH A COPY TO CTC/PD FOR ISSUING THE L/C AFTER
THE SAID PROGRAM BEING APPROVED.
9. THE AIR TICKETS FEE AND LIVING EXPENSES FOR CSIST'S PERSONNEL (TRAINEES)
SENT TO PARLEX SHALL BE BORNE BY CSIST. HOWEVER, PARLEX SHALL PROVIDE
ASSISTANCE IN ARRANGING LOCAL TRANSPORTATION, ROOM AND BOARD, MEDICAL
ASSISTANCE, ETC. FOR THOSE TRAINEES.
* Confidential information has been omitted and filed separately with the
Commission.
PARLEX CORPORATION
RIGID-FLEX PCB
TECHNOLOGY TRANSFER PROPOSAL
FOR CENTRAL TRUST OF CHINA AND
XXXXX XXXX INSTITUTE OF SCIENCE
AND TECHNOLOGY
16 May 95
TABLE OF CONTENTS
Section I - Introduction
Section II - Technology
Section III - Training Plan
Section IV - Documentation
Section V - Pricing
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| This proposal and the entirety of its contents is proprietary to |
| Parlex Corporation. Its use is restricted to staff members of CSIST for |
| evaluation and it may not be transferred to any other organization without |
| the written permission of Parlex. Further the data included must be |
| treated as commercially confidential information. |
----------------------------------------------------------------------------
SECTION I
INTRODUCTION:
Parlex, a Methuen, Massachusetts based corporation is a world leader
in the flexible interconnect industry. Founded in 1970, the Company has
maintained a focus on flexible and rigid flex circuits and has been a prime
influence in the development of this technology.
Parlex has a large engineering staff and is active in the development
of new interconnect technologies. The Company is highly capitalized and has
the proper organization to support a technology sharing venture. CSIST can
expect the highest level of support from every level of this organization.
SECTION II
TECHNOLOGY
Introduction
1. QUALIFICATION PROGRAM
2. FLEXIBLE MULTILAYERS
3. FLEX RIGID MULTILAYERS
4. ADHESIVELESS FLEX RIGID MULTILAYERS
Qualification Program for Rigid-Flex Printed Wiring Boards
Parlex will assist CSIST in the fabrication of Qualification Rigid-Flex
printed wiring boards. This program is designed around the ten layer Rigid-
Flex board used to qualify manufacturers to fabricate boards which will be
in compliance with MIL-P-50884C, the Specification for Flexible and Rigid-
Flex Printed Wiring and MIL-STD-2118, the Design Requirements for Flexible
and Rigid-Flex Printed Wiring for Electronic Equipment.
The board to be fabricated during this program will be manufactured using
the artwork for the IPC-A-100043. This has the advantage of incorporating
several degrees of difficulty which allow for the evaluation of your process
technology as well as demonstrating the ability to fabricate complex Rigid-
Flex boards.
Parlex has designed this program so that upon successful completion, you
should be able to fabricate Zone B level boards and pass the qualification
of Zone B level by the Defense Electronics Supply Center (DESC).
FLEXIBLE CIRCUITRY
ALL FLEXIBLE MULTILAYER
CROSS SECTION
CU ______ Copper Pad Layer
______ Cover Coat
KAPTON
______ Inner Layer
COPPER
______ Base Laminate
KAPTON
______ Inner Layer
COPPER
______ Cover Coat
KAPTON
______ Copper Pad Layer
CU
(Adhesive layers not shown for clarity)
FLEXIBLE CIRCUITRY
FLEX RIGID MULTILAYER
CROSS SECTION
CU
FR-4 OR GI
______ Double sided rigid board
COPPER
KAPTON
COPPER ______ Single flexible layer
KAPTON
COPPER
FR-4 OR GI ______ Double sided rigid board
CU
(Adhesive layers not shown for clarity)
SECTION III
TRAINING
REQUIREMENTS
1 - TRAINING AT PARLEX
2 - TRAINING AT CSIST
TRAINING AT PARLEX
---------------------------------------------------------
| The training program will be centered on the required |
| elements for qualification to Mil-P-50884C. |
---------------------------------------------------------
CSIST TECHNOLOGY TRANSFER PROGRAM
Option I
Training at Parlex:
The training session at Parlex is critical to successful transfer of
technology. The technicians from CSIST will learn every unique element of
the rigid flex process and gain first hand experience designing and
manufacturing circuits. Training will include the following:
1.0 Flexible Circuit Design
1.1 Design rule layout for various power conditions
1.2 EMI optimization
1.3 Mil-coupon considerations
1.4 Producibility considerations
1.5 Conductor routing and design
2.0 Material
2.1 Compatibility
2.2 Producibility
2.3 Reliability
2.4 Flexibility
2.5 Testing
3.0 Product Process Design
3.1 Mil-P-50884C requirements
3.2 Standard Constructions
3.3 Density issues
3.4 Alternative constructions
4.0 Processing Techniques
4.1 Material prep
4.2 Image
4.3 Etching
4.4 Lamination
4.5 Drill Rout
4.6 Plating
4.7 Photo Develop
TRAINING AT PARLEX - Continued
---------------------------------------------------------
| The training program will be centered on the required |
| elements for qualification to Mil-P-50884C. |
---------------------------------------------------------
CSIST TECHNOLOGY TRANSFER PROGRAM
Option I
5.0 Assembly
5.1 Soldering (hand and wave)
5.2 Connector prep
5.3 Rigid flex prep
5.4 Assembly considerations
5.5 Dielectric sealing
5.6 Assembly testing
---------------------------------------------------------
| Typical Training Sequence |
| |
| Review Documentation |
| |
| Classroom Training of Process |
| |
| Practical Training of Process |
| |
| Associated Quality Training |
---------------------------------------------------------
The intensive course will require students to spend 50 hours a week at
Parlex. The course will last 30 days.
* Parlex will develop and implement a comprehensive training program for
your technical staff and will provide a matrix for material selection for
each process. Parlex will also provide the supporting documentation,
encompassing Engineering procedures. Quality standards and Manufacturing
work instructions.
* Parlex personnel will be assigned to work with CSIST technical staff to
assure a smooth transition of technical information.
TRAINING AT PARLEX - Continued
* Parlex will provide a complete list of all equipment that will be
necessary for processing advanced products.
TRAINING AT CSIST
* Engineering and Manufacturing personnel will be available to assist
CSIST in Taiwan for 200 hours.
* Phase two training will include:
1.0 Quality Assurance:
1.1 Classroom training
1.2 Practical training
2.0 Rigid-flex multilayer board fabrication:
Parlex will assist CSIST in the fabrication of ten-layer
rigid-flex board using the artwork of the IPC-A-100043) which
will be in compliance with MIL-P-50884C.
The total time duration for this program is limited to 28
weeks. The time duration for phase one shall be no less than five
(5) weeks or six hundred (600) hours. The phase two should start six
weeks after the phase one is completed. The time duration for phase
two shall be no less than two weeks or two hundred (200) hours.
Parlex will provide the exact time schedule for this program.
Parlex will provide a matrix for material selection for each
process. Parlex will also provide the supporting documentation,
encompassing Engineering procedures, Quality standards and
Manufacturing work instructions.
SECTION IV
DOCUMENTATION
REQUIREMENTS
DOCUMENTATION
Parlex will provide CSIST with all of the documentation required to
manufacture the advanced products. The attached list represents the level
of detail that will be provided to your technical, quality and management
staff. The key to any successful technical exchange is a comprehensive
documentation package.
In addition to providing the documentation, Parlex will also assist CSIST in
the establishment of documentation control procedures. Parlex will provide
semi-annual updates on the documentation for a period of two years from
contract date and will make additional updates available upon request. It
should be noted that some documentation is proprietary data and must be
treated as CSIST treats its own proprietary information.
COMPANY CONFIDENTIAL
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Parlex Document List
Prefix Number Revision Title
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POP 1000 B Documentation and Revision Control
POP 1001 - Quality Manual
POP 1002 A Document Generation Procedure
POP 1003 - Handling and Storage of Resin Impregnated Glass Cloth
POP 1004 - Handling, Storage, Packaging, and Delivery
POP 1005 - Shipping and Packaging Procedure
EPS 1006 - Engineering Change Order Procedure
POP 1007 A Control of Nonconforming Product
POP 1008 - Indication of Inspection Status
POP 1009 - Corrective Action Procedure
POP 1010 - Problem Solving Procedure
POP 1011 - Contract Review Procedure
POP 1012 A Final Inspection Procedure
POP 1013 - Electrical Test Procedure
POP 1014 - Receiving Inspection Procedure
MPS 1015 - Chemical Clean
MPS 1017 - Chemical Clean Etch Rate Measurement
MPS 1018 - ASI Chemical Clean Water Break Test
POP 1019 - Material Review Procedure
QCP 1020 - Final Visual Inspection Work Instruction
EPS 1022 - On Hold Procedure
PMS 1023 - GF Prepreg Specification
PMS 1024 - GF Laminate Specification
PMS 1025 - GI Prepreg Specification
PMS 1026 - GI Laminate Specification
MPS 1027 - Chemical Add Notice
POP 1029 A Calibration Procedure
MPS 1030 - Developing
MPS 1031 - Developer pH Control
MPS 1032 - Developer Concentration
SOW 1033 - Documentation Control Software
POP 1034 - Control of Customer Supplied Product
POP 1035 - Selection and Approval of Material Suppliers
POP 1036 A Purchasing Procedure
POP 1037 - Control of Purchased Product
POP 1038 A Internal Audit Procedure
POP 1040 - Product Identification and Traceability
POP 1041 - New Process/Equipment/Material Release Procedure
POP 1042 - Process Control Plan
POP 1043 - In-process Inspection Procedure
QCP 1044 - Quality Plan
POP 1045 A Storage and Retrieval of Quality Records
POP 1046 - New Employee Orientation
MPS 1049 - Automatic Screening
ATP 1050 - ED Copper Test Plan
MPS 1052 - Developer Direct Bath Addition Procedure
MPS 1053 - pH Probe Cleaning and Calibration
MPS 1054 - Hand Stamping
MPS 1055 - Etch Inspection
MPS 1056 - AOI Inspection
MPS 1057 - Shipping
MPS 1058 - Shearing
ATP 1059 - Impedence Test Guideline
ATP 1060 - SIR Test
MPS 1061 - Trace 948E Tester
MPS 1062 - Electrical Test Program Generation
MPS 1063 - Procedure F.A.C.T.
MPS 1064 - Cross Section, Automatic
MPS 1065 - Cross Section, Manual
MPS 1066 - Glass Etch
MPS 1067 - Pouch Venting and Sealing
MPS 1068 - Plasma Desmear and Etchback
MPS 1069 - In-process Cross Section
MPS 1070 - Nickel/Gold Plating
MPS 1071 - Solder Strip
MPS 1073 - Developer 1/2 Process Control Plan
EPS 1074 - New Order Procedure
EPS 1075 - Repeat Order Procedure
EPS 1076 - Electrical Test Fixture Generation Procedure
ATP 1077 - Cleanliness Testing Procedure
MPS 1078 - Production Control (Release of Material)
MPS 1109 - Preventive Maintenance - Wave Solderer.
MPS 1110 - Conformal Coat
MPS 1111 - Clean Potting Molds
MPS 1112 - Clean Prior Coat
MPS 1113 - Prepare Potting Compound
MPS 1114 - Filleting Circuits
QCP 1115 - X- Ray
MPS 1116 A Copper Solder Plating - Manual line
MPS 1117 - Electroless Copper - Manual Line
MPS 1118 - Application of Pressure Sensitive Adhesive to Backers/Stiffeners
MPS 1119 - Entry/Exit Material Emboss
MPS 1121 A Backer Tacking
MPS 1122 - Heatsink /Backer Alignment
MPS 1123 - Baking Prior to Comp Layup
MPS 1124 - Composite Layup/Breakdown
MPS 1125 - Dry Film Lamination
MPS 1126 - Changing Resist Rolls
MPS 1127 - Dry Film Parameter Matrix
MPS 1128 - Image
EPS 1130 - Engineering Departmental Development Plan
EPS 1131 - Panel Pinning Requirements
EPS 1132 - Drilling Requirements for Electrical Test Fixtures
EPS 1133 - Rout Machine Special requirements
EPS 1134 - Drill Machine Special Concerns
EPS 1135 - Border Requirements
EPS 1136 - Product Scaling Requirements
EPS 1137 - Data Archiving
EPS 1138 - Tooling Scheme Definitions
EPS 1139 - Layering Convenetions
EPS 1140 - Modeming Criteria
EPS 1141 - Stiffener Programs
EPS 1142 - Engineering Hardware and Software
EPS 1144 - Spartanics Targets
EPS 1145 - Master Pattern Requirements
EPS 1146 - Design Rule Checking
EPS 1147 - Data Format Requirements
EPS 1148 - Shipping and Approving Master Pattern Artwork
EPS 1149 - Outside Information Requirements
EPS 1150 - Internal Master Pattern Approval
EPS 1151 - Artwork Scaling
EPS 1152 - Manufacturing Release Procedure
EPS 1153 - Compliance Requirements
EPS 1154 - A/W Sign off Procedure
EPS 1155 - D/P Sign off Procedure
EPS 1156 - Tooling Sign off Procedure
EPS 1157 - BOM Release Procedure
EPS 1158 - Repeat Review Procedure
EPS 1159 - New Product Introduction
EPS 1160 - Design Quoting Procedure
EPS 1161 - Panel Design Review
EPS 1162 - Order Entry Requirement
EPS 1163 - Prototype Release Procedure
EPS 1164 - Product vs. Process Requirements
EPS 1165 - Feedback Implementation Procedure
EPS 1166 - Vent Hole Requirements
EPS 1167 - Soldermask Pullback
EPS 1168 - Panel Size & Profiling
EPS 1169 - A/W Registration System
EPS 1170 - Panel Plating Rack Requirements
EPS 1171 - PPE vs. PE Criteria
EPS 1172 - Preco Tooling Concepts
EPS 1173 - Black vs. Xxxxx Oxide
EPS 1174 - Manufacturing Capabilities
EPS 1175 - Plasma Etch Standards and Requirements
EPS 1176 - Plating Requirements
EPS 1177 - Soldermask Requirements
EPS 1179 - RTV's
EPS 1180 - Rubbers
EPS 1181 - Pre-preg Types and Compression's
EPS 1182 - Kapton Types
EPS 1183 - Laminate Types
EPS 1184 - Construction Options
EPS 1185 - Pouching Method
EPS 1186 - Figure Sheets Requirements
EPS 1187 - Marking of Military Parts & Packaging
EPS 1188 - Marking of Commercial Parts & Packaging
EPS 1189 - Tooling Schemes
EPS 1190 - Tool System Entry Procedure
EPS 1191 - Cost Estimating and Quoting
EPS 1192 - ECO Review for the Quoting
EPS 1193 - X.X.Xxxxxx
EPS 1194 - Cancellation Procedure
EPS 1195 - Generating APEC Quote
EPS 1196 - Steel Rule Dies
EPS 1197 - Covercoat Rigistration Fixtures
EPS 1198 - Wave Solder Fixture
EPS 1199 - Punch Jigs
EPS 1200 - Hard Tooling (Blanking Dies)
EPS 1201 - Tool Request
EPS 1202 - Tool Storage
EPS 1203 - Tool Obsoleting Requirements
EPS 1204 - Producing and Using Diazo's
EPS 1205 - Numbering of Artworks
EPS 1206 - Remakes
EPS 1207 - Revision Verification
EPS 1208 - Tagging Artwork
EPS 1209 - Inspection of Artwork
EPS 1210 - Obsoleting Artwork
EPS 1211 - Drill Program Generation
EPS 1212 - Rout Program Generation
EPS 1213 - Drill Rout Program Generation
EPS 1214 - Cost Estimating and Quoting
POP 1227 - Management Review Procedure
POP 1228 - Order Entry Procedure
MPS 1229 - Vacuum Oven
MPS 1230 - Water Break Test
EPS 1231 - Soldermask Requirements
MPS 1232 - Image
MPS 1233 - Image Matrix
MPS 1234 - Image - Process Control Plan
POP 1235 - Preventative Maintenance Procedures
QCP 1238 - Thermal Shock Test
QCP 1239 - Moisture and Humidity
KEY DESCRIPTION
POP Parlex Operating Procedure
EPS Engineering Process Specifications
MPS Manufacturing Process Specification
QCP Quality Control Procedure
PMS Parlex Material Specification
ATP Acceptance Test Plan
Parlex will make available the following documents (as determined applicable)
SECTION V
PRICING PROPOSAL
Definitions:
Item 5.1 Technology
Rights to proprietary data and intellectual property concerning development,
design and production of mil approved rigid flex circuitry - technology
transfer.
Item 5.2 Supporting Documentation
The establishment of a documentation system, all required documentation,
documentation updates for two years.
Item 5.3 Training
Training to be conducted at Parlex for 5 weeks and CSIST for two weeks in
preparation for qualifications to
Mil-P-50884C.
Item 5.4 Materials
Materials required to understand characteristics of various constructions,
learn testing techniques and build sample products at Parlex and CSIST, fees
for filing export license and Mil-P-508842 quality charges.
Item 5.5 Equipment (optional item)
Parlex has reviewed the equipment list supplied by CSIST. It is our
understanding that all required equipment is in place for the production of
rigid flex circuits with the following exception:
Single drawer mechanical press system; controlled Z axis outlining maching
to be used in conjunction with steel rule dies. The cost of new equipment
is * . Parlex could supply reconditioned used equipment for *
(FOB, Methuen, MA).
Item 5.6 Payment Method
Payment will be made by an irrevocable letter of credit to Shawmut Bank
N.A., 0 Xxxxxxx Xxxxxx, Xxxxxx, XX 00000, account # 000-000000-0, ABA #
000000000, swift code XXXXXX00.
* Confidential information has been omitted and filed separately with the
Commission.
SECTION V
5.7 PAYMENT SCHEDULE
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Accumulated
Payment Due Date
---------------------------------------------------------------------------------------
1. A. Technology * * Completion of Training
B. Material * * at Parlex
2. Documentation * * Shipment of Documents
3. Training at Parlex * * Completion of Training at Parlex
4. Training at CSIST * * Completion of Training at CSIST
5. A. Sample Qualification * * Completion of Sample Build and
B. Admin. & Program Submittal of Data for Mil
Management * * Approval
* Confidential information has been omitted and filed separately with the
Commission.
Parlex will provide the support of any reasonable request for engineering
assistance in written from without any charge. If the engineering support
in the Buyer's facility is required, within a period of two years, the fee
will be * (plus airfare, hotel & subsistence). If refresher
training is required by CSIST, after 12 months, the fee will be *.
* Confidential information has been omitted and filed separately with the
Commission.
