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EXHIBIT 10.1
TERMINATION AGREEMENT
THIS TERMINATION AGREEMENT (this "Termination Agreement"), dated as of
August 31, 1998, is made by and between XXXX Technology, Inc., a Delaware
corporation ("XXXX"), and Fujitsu Limited, a Japanese corporation ("Fujitsu"
and, together with XXXX, the "Parties").
RECITALS
A. Fujitsu has licensed and provided certain proprietary information to
XXXX under the agreements listed in attached Exhibit A (the "Agreements") and
Exhibit B (the "Surviving Agreements") in order to facilitate XXXX' performance
of design and development services on Fujitsu's behalf and manufacture of
semiconductor products.
B. The Parties now wish to (i) terminate each of the Agreements and
provide for the return by XXXX to Fujitsu of all technology and proprietary
information provided or licensed by Fujitsu to XXXX under the Agreements and
(ii) confirm certain matters pertaining to the Surviving Agreements, on the
terms, and subject to the conditions, set forth herein.
AGREEMENT
NOW, THEREFORE, in consideration of the foregoing recitals and the
terms and conditions set forth herein, the Parties hereby agree follows:
1. Termination Date and Terms.
(a) Defined Terms. Capitalized terms used but not otherwise defined in
this Termination Agreement (including its exhibits) shall have the meanings set
forth in the Agreement to which they pertain.
(b) Termination Date. Effective as of July 31, 1998 (the "Termination
Date"), and except for those provisions of the Agreements which are expressly
stated in this Termination Agreement to survive the Termination Date, each of
the Agreements, including any exhibits, attachments, schedules and amendments
thereto, is hereby terminated, and shall be of no further force and effect.
Except as otherwise expressly provided in this Termination Agreement, from and
after the Termination Date, neither Party shall have any further rights,
obligations or liabilities whatsoever under any of the Agreements (or the
related exhibits, attachments, schedules and amendments).
(c) Viper Development Agreement.
(i) Surviving Provisions. Notwithstanding any provisions of the Viper
Development Agreement to the contrary, including, without limitation, Section
13.3, the following sections of the Viper Development Agreement shall survive
termination and shall remain in full force and effect after the Termination
Date:
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(1) Sections 1, 8.2, 8.4(a) (other than the last sentence), 9,
10.4, 11, 13.4 and 14 (other than Section 14.9) shall remain in full force and
effect in their entirety in accordance with their terms; and
(2) Section 8.1 shall remain in full force and effect, provided
that Section 8.1(d) shall be terminated in its entirety and Section 8.1(a) shall
be amended and restated in its entirety as set forth in attached Appendix I so
as to terminate the stand alone clauses 8.1(a)(i), (ii), (iii) and (iv) (after
the phrase "except as follows" in the 21st line of such section) as such clauses
apply to FUJITSU. For the avoidance of doubt, the Parties intend that, from and
after the Termination Date, Fujitsu shall not be limited, in any respect, in its
ability to commercially exploit its rights under Section 8.1(a) as amended and
restated hereby.
(ii) No Further Development Payments/Obligations. Each Party hereby
agrees that no additional payments of any kind are due by either Party to the
other Party under the Viper Development Agreement, with respect to work
performed through the Termination Date, as a consequence of termination, or
otherwise, including, without limitation, pursuant to Section 6 thereof
(Acceptance and Rejection of Deliverables) or Section 13 thereof (Termination).
Effective as of the Termination Date, Fujitsu hereby releases XXXX from any
further obligation to perform Services under the Viper Development Agreement and
irrevocably waives the late penalties accrued under Section 6.2 thereof through
the Termination Date. Effective as of the Termination Date, XXXX hereby releases
Fujitsu from any further obligation to make payments with respect of Services
and irrevocably waives any amount otherwise due with respect to termination of
the Viper Development Agreement under Section 13 thereof.
(iii) Effect of Termination. For the avoidance of doubt, the Parties
intend that the termination of the Viper Development Agreement be deemed a
termination pursuant to Section 13.1 or Section 13.2 thereof for purposes of the
provisions of Section 13.4 thereof relating to the post-termination rights of
the Parties.
(iv) Further Assurances. Each Party shall, promptly upon request by
the other Party, take such further actions, and execute, acknowledge and deliver
such further assignments, certificates, and other instruments, as either Party
may reasonably request from time to time in order to confirm such other Party's
rights in the New Technology in accordance with Section 8.1(e) of the Viper
Development Agreement.
(d) UPA Sublicense Agreement.
(i) Effect of Termination. Effective upon the Termination Date, all
licenses granted to XXXX pursuant to the UPA Sublicense Agreement shall be
deemed terminated, and XXXX shall have no further right to use the Licensed
Technology or to manufacture, market, sell or sublicense any Licensed Systems,
Licensed Products or Derivative Works. Upon the Termination Date, XXXX shall
immediately discontinue all use of the Licensed Technology.
(ii) Surviving Provisions. Notwithstanding any provisions of the UPA
Sublicense Agreement to the contrary, Sections 1, 3.2, 3.3, 8.5 and 9 through 12
(other than Sections 9.5, 12.3(B) and 12.4) of the UPA Sublicense Agreement
shall survive the termination and shall remain in full force and effect after
the Termination Date in accordance with their terms.
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(iii) Sublicenses. XXXX represents and warrants that it has not
granted any sublicenses under the UPA Sublicense Agreement.
(e) OBP/Post License Agreement.
(i) Effect of Termination. Effective upon the Termination Date, all
licenses granted to XXXX pursuant to the OBP/Post License Agreement shall be
deemed terminated, and XXXX shall have no further right to use the Licensed
Software and Documentation or to distribute the Derivative Software. Upon the
Termination Date, XXXX shall immediately discontinue all use of the Licensed
Software and Documentation.
(ii) Surviving Provisions. Notwithstanding any provisions of the
OBP/Post License Agreement to the contrary, Sections 1, 5.2, 8.4, 8.6, 9, 10,
11, 12 and 13 (other than Sections 13.2 and 13.11) of the OBP/Post License
Agreement shall survive the termination of the OBP/Post License Agreement and
shall remain in full force and effect after the Termination Date in accordance
with their terms.
(iii) Confirmation of Ownership. As required under Section 3.2 of the
OBP/Post License Agreement, XXXX hereby confirms that it has delivered to
Fujitsu all Error Corrections made by or for XXXX under the OBP/Post Development
Agreement and, as provided in Section 2.1 of the OBP/Post License Agreement,
XXXX hereby confirms that Fujitsu owns all Error Corrections made by or for XXXX
thereunder.
(iv) Subcontractors. XXXX represents and warrants that it has not
retained any subcontractors pursuant to the OBP/Post License Agreement.
(f) VIS Non-Disclosure Agreement. Notwithstanding the provisions of
Section 1(b) of this Termination Agreement, the VIS Non-Disclosure Agreement
shall remain in full force and effect (other than Sections 4 and 9) until all of
the obligations of confidentiality set forth thereunder expire or are terminated
in accordance with its terms.
(g) CS70 License Agreement.
(i) Effect of Termination. Upon the Termination Date, XXXX shall
immediately discontinue all use of CS70 SRAM Cell Data and shall have no further
right to use, copy or reproduce CS70 SRAM Cell or CS70 SRAM Cell Data.
(ii) Surviving Provisions. Notwithstanding any provisions of the CS70
License Agreement to the contrary, Sections 1, 3, 8.6 (except replacing "THE
FOREGOING WARRANTIES OF FUJITSU ARE IN LIEU OF ALL OTHER WARRANTIES" with
"FUJITSU MAKES NO WARRANTIES"), 9, 10 and 14 through 24 of the CS70 License
Agreement shall survive the termination of the CS70 License Agreement and shall
remain in full force and effect after the Termination Date in accordance with
their terms.
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(iii) Sublicenses. XXXX represents and warrants that it has not
granted any sublicenses under the CS70 License Agreement.
(h) Solaris License Agreement.
(i) Effect of Termination. Upon the Termination Date, XXXX shall
immediately discontinue all use of Software Products and Secondary Works and
shall have no further right to use, copy or reproduce the Software Products or
Secondary Works.
(ii) Surviving Provisions. Notwithstanding any provisions of the
Solaris License Agreement to the contrary, Sections 1, 3, 6 (other than Section
6.4), 8, 9 and 12 through 21 of the Solaris License Agreement shall survive the
termination of the Solaris License Agreement and shall remain in full force and
effect after the Termination Date in accordance with their terms.
(iii) Subcontractors. XXXX represents and warrants that it has not
retained any subcontractors pursuant to the Solaris License Agreement.
(i) RDB-II License Agreement.
(i) Effect of Termination. Upon the Termination Date, XXXX shall
immediately discontinue its use of the Database Trace Information and shall have
no further right to use the Database Trace Information.
(ii) Surviving Provisions. Notwithstanding any provisions of the
RDB-II License Agreement to the contrary, Sections 1, 4, 5, 7 and 8 of the
RDB-II License Agreement shall survive the termination of the RDB-II License
Agreement and shall remain in full force and effect after the Termination Date
in accordance with their terms.
(iii) Limitation of Liability. Neither Party shall be liable for any
indirect, special, incidental or consequential damages, including, but not
limited to, loss of profit or loss of use, with respect to any claims arising
out of or in connection with the RDB-II License Agreement, even if such Party
has been advised of the possibility of such damages.
(j) Letter Agreement.
(i) Effect of Termination. Upon the Termination Date, (A) all
services and upgrade discounts provided to XXXX under Section (1) of the Letter
Agreement shall terminate, and (B) XXXX shall immediately discontinue all use of
any (1) Successive Versions, (2) Early Access Versions and (3) Quick Source
Products of Solaris (collectively, the "Letter Agreement Deliverables") provided
under Section (2) of the Letter Agreement and shall have no further right to
use, copy or reproduce such Letter Agreement Deliverables.
(ii) Surviving Provisions. Notwithstanding any provisions of the
Letter Agreement or the SunSoft Support Agreement to the contrary, Sections 1,
10 (other than the words "OTHER THAN AS SPECIFICALLY SET FORTH IN SECTION 9
ABOVE,"), 11, 12.1 through 12.3, 12.5, 13, 14.1 through 14.3, 14.5 through 14.7,
14.8 (solely with respect to the first sentence thereof), 14.9 and 14.10 of the
SunSoft Support Agreement shall survive the termination of the Letter Agreement
and shall remain in full force and effect with respect to XXXX and Fujitsu after
the Termination Date in accordance with their terms.
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2. Delivery.
(a) Delivery. Promptly, and in any event within ten (10) days, after the
Termination Date XXXX shall deliver to Fujitsu all originals and copies of (A)
all licensed technology and other proprietary and technical information provided
or made available by Fujitsu to XXXX under any of the Agreements and Surviving
Agreements, including, without limitation, each of the items listed on attached
Exhibit C, and (B) all tangible materials embodying other "Confidential
Information" (as such term is defined in each of the Agreements and the
Surviving Agreements) provided by Fujitsu to XXXX under any of the Agreements
and Surviving Agreements in XXXX' possession or control (or in the possession or
control of its sublicensees, contractors or subcontractors, if any), in each
case F.O.B. XXXX' facility in Austin, Texas. At Fujitsu's request, XXXX shall
destroy or disable such tangible materials or electronically reproducible copies
of all items to be delivered by XXXX to Fujitsu hereunder (including, without
limitation, any such copies contained in derivative works) and all other
electronic documents and files containing all or any portion thereof.
(b) Certification. Promptly after the delivery and/or destruction of all
tangible materials, hard-copy and electronically reproducible copies of the
materials to be delivered to Fujitsu by XXXX pursuant to Section 2(a) of this
Termination Agreement, XXXX shall forward to Fujitsu a certificate (in form and
substance reasonably satisfactory to Fujitsu), signed by a duly authorized
officer of XXXX, certifying that all items required to be delivered or destroyed
by XXXX hereunder have been so delivered or destroyed. XXXX also shall forward
to Fujitsu the certificates which it has received from its sublicensees and
subcontractors, if any.
3. Surviving Agreements.
(a) Assignment. XXXX and Fujitsu hereby agree that each of the Surviving
Agreements shall be designated as "Assumed Contracts" under the Asset Purchase
Agreement (the "Asset Purchase Agreement"), dated as of July 23, 1998, between
XXXX and BridgePoint Technical Manufacturing Corporation, a Texas corporation
("BridgePoint"), and all of XXXX' rights and obligations under the Surviving
Agreements shall be assumed by BridgePoint pursuant to the Assumption Agreement
(as defined in the Asset Purchase Agreement), a fully executed copy of which
shall be delivered by XXXX to Fujitsu promptly after BridgePoint's execution
thereof.
(b) XXXX' Warranties. XXXX represents and warrants that (i) with the
exception of the Design Agreement, no sublicenses have been granted by XXXX
under any of the Surviving Agreements and (ii) except as set forth in the Asset
Purchase Agreement, XXXX has not received written notice from any third party
alleging the infringement, by technical information provided by Fujitsu to XXXX
under any of the Surviving Agreements, of any intellectual property rights of a
third party.
(c) Return of Confidential Information. For the avoidance of doubt,
notwithstanding the survival of the Surviving Agreements pursuant to this
Section 3, XXXX agrees that, upon the
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closing under the Asset Purchase Agreement and, in any event, no later than
October 15, 1998, it shall either return to Fujitsu or destroy all originals and
copies of any licensed technology and other proprietary and technical
information as well as all tangible materials embodying "Confidential
Information" (as such term is defined in each of the Surviving Agreements)
provided by Fujitsu to XXXX under any of the Surviving Agreements in XXXX'
possession or control, in accordance with Section 2(a) hereof. Upon the closing
under the Asset Purchase Agreement and, in any event, no later than October 15,
1998, XXXX shall forward to Fujitsu a certificate in the form and manner
required under Section 2(b) hereof certifying that all such items have been so
delivered or destroyed as provided herein.
(d) Fujitsu Technical Information. XXXX represents and warrants that it
has not provided PICCO with any materials embodying the Fujitsu Technical
Information, as such term is defined in the Design Agreement, including the
Fujitsu Technical Information expressly described in Exhibit C.
(e) Confirmation of Joint Ownership. XXXX hereby confirms the joint
ownership rights of Fujitsu in any modifications to circuits adopted in the
MB86751 (125 MHz SSRAM) and the Resulting Technical Information, as such terms
are defined in the Design Agreement and as such rights are more particularly
described in Section 2 of the Design Agreement.
4. Warranties.
(a) XXXX' Warranties. XXXX represents and warrants that (a) it has the
full corporate power and authority to enter into this Termination Agreement and
to perform its obligations hereunder and under the respective surviving
provisions of each of the Agreements; and (b) this Termination Agreement has
been duly executed and delivered by XXXX and constitutes a legally valid and
binding obligation of XXXX, enforceable against XXXX in accordance with its
terms, except to the extent that enforceability may be limited by applicable
bankruptcy, insolvency or similar laws affecting the enforcement of creditors'
rights generally and subject to general principles of equity (regardless of
whether such enforcement is considered in a proceeding at law or at equity).
XXXX shall not settle any claim, suit, proceeding or action arising out of or
relating to any breach (or any claim that, if true, would be a breach) of the
foregoing warranties without the prior written consent of Fujitsu, which shall
not be unreasonably withheld.
(b) Fujitsu's Warranties. Fujitsu represents and warrants that (a) it has
the full corporate power and authority to enter into this Termination Agreement
and to perform its obligations hereunder, and (b) this Termination Agreement
constitutes a legally valid and binding obligation of Fujitsu, enforceable
against Fujitsu in accordance with its terms, except to the extent that
enforceability may be limited by applicable bankruptcy, insolvency or similar
laws affecting the enforcement of creditors' rights generally and subject to
general principles of equity (regardless of whether such enforcement is
considered in a proceeding at law or at equity).
(c) NO OTHER WARRANTIES. EXCEPT AS PROVIDED IN THIS SECTION 4 OR OTHERWISE
EXPRESSLY STATED IN THIS TERMINATION AGREEMENT, NEITHER PARTY IS MAKING ANY
REPRESENTATIONS OR WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT
LIMITATION, ANY WARRANTY OF
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MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. NEITHER PARTY SHALL BE
LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES,
INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFIT OR LOSS OF USE, WITH RESPECT TO
ANY CLAIMS ARISING OUT OF OR IN CONNECTION WITH THIS TERMINATION AGREEMENT, EVEN
IF SUCH PARTY HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
5. LIMITATION OF LIABILITY.
NEITHER PARTY SHALL BE LIABLE FOR DAMAGES OF ANY NATURE WHATSOEVER, WHETHER
DIRECT OR INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL, INCLUDING BUT NOT
LIMITED TO LOSS OF PROFIT OR LOSS OF USE, DUE TO THE EXPIRATION OR TERMINATION
OF ANY AGREEMENT PURSUANT TO THIS TERMINATION AGREEMENT, EVEN IF SUCH PARTY HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EACH PARTY WAIVES AND RELEASES
THE OTHER FROM ANY CLAIM TO COMPENSATION OR INDEMNITY FOR TERMINATION OF THE
BUSINESS RELATIONSHIP EMBODIED IN THE AGREEMENTS.
6. Further Assurances.
Each Party shall, promptly upon request by the other Party, take such
further actions, and execute, acknowledge and deliver such further assignments,
certificates, and other instruments, as the other Party may reasonably request
from time to time in order to effectuate the purposes of this Termination
Agreement.
7. Confidentiality.
(a) Confidential Information. All discussions relating to this Termination
Agreement are confidential information and are to be disclosed only to employees
of a Party who have a need to know; provided, however, that "confidential
information" shall not include any information which (i) at the time of
disclosure, is available to the general public; or (ii) at a later date, becomes
available to the general public through no fault of the receiving Party and then
only after such later date; or (iii) the receiving Party can demonstrate was
known to it prior to disclosure to it by the disclosing Party. Neither Party
will disclose to third parties the other Party's confidential information,
except to the extent specified in the prior written consent of the other Party
or necessary to comply with applicable law, the order of any court or the order
or regulations of any governmental agency; provided that such Party will
promptly inform the other Party of such obligation to disclose and cooperate
with the other Party in minimizing the disclosure, including seeking a
protective order.
(b) Public Announcements. The Parties shall consult with each other
regarding the wording and substance of any and all press releases, announcements
or other public statements with respect to the transactions contemplated hereby.
The Parties further agree to use good faith to comply with reasonable requests
of the other Party relating to any such press release, announcement or public
statement.
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8. Governing Law.
This Termination Agreement is to be construed in accordance with and
governed by the internal laws of the State of California (as permitted by
Section 1646.5 of the California Civil Code or any similar successor provision)
without giving effect to any choice of law rule that would cause the application
of the laws of any jurisdiction other than the internal laws of the State of
California to the rights and duties of the Parties.
9. Successors and Assigns.
This Termination Agreement shall be binding upon and inure to the benefit
of each of the Parties and their respective successors and assigns; provided,
however, that neither Party may assign its rights and obligations hereunder
without the prior written consent of the other Party.
10. Entire Agreement.
This Termination Agreement, together with those provisions of the
Agreements which expressly survive the Termination Date in accordance with the
terms of this Termination Agreement, constitutes and contains the entire
agreement between the Parties and supersedes all prior agreements, negotiations,
correspondence, understandings and communications between the Parties, whether
written or oral, respecting the subject matter hereof.
11. Amendments and Waivers.
This Termination Agreement may be amended only by a written agreement
signed by each of the Parties. No failure to exercise and no delay in
exercising, on the part of any Party, any right, remedy or power or privilege
hereunder shall operate as a waiver thereof; nor shall any single or partial
exercise of any right, remedy, power or privilege hereunder preclude any other
or further exercise thereof or the exercise of any other right, remedy, power or
privilege. The rights, remedies, power and privileges herein provided are
cumulative and not exclusive of any rights, remedies, power and privileges
provided by law.
12. Construction.
This Termination Agreement is the result of negotiations between and has
been reviewed by each of the Parties and their respective counsel; accordingly,
this Termination Agreement shall be deemed to be the product of the Parties
hereto, and no ambiguity shall be construed in favor of or against either of the
Parties. Each Party agrees that it intends the literal words of this Termination
Agreement and that no parole evidence shall be necessary or appropriate to
establish the Parties' actual intentions.
13. Counterparts.
This Termination Agreement may be executed in any number of counterparts,
and by different parties hereto in separate counterparts, each of which when so
executed and delivered shall be deemed an original, but all such counterparts
together shall constitute but one and the same instrument.
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14. Arbitration.
Any dispute, controversy or claim arising out of or relating to this
Termination Agreement or any of the Agreements or the subject matter hereof or
thereof, or the interpretation, enforceability, validity, performance, breach or
termination hereof or thereof, including, without limitation, this arbitration
clause, shall be solely and finally settled by arbitration in Los Angeles,
California in accordance with the commercial arbitration rules of the American
Arbitration Association, as modified by the provisions of this Section 14. Each
Party waives any rights to bring any such dispute, controversy or claim in any
other forum or proceeding, including, without limitation, the International
Trade Commission of the United States or any other administrative or judicial
forum. The arbitration shall be conducted in accordance with such rules by three
arbitrators selected by the Parties (if the Parties are able to agree within
thirty (30) days) and otherwise selected in accordance with such rules. Each of
the arbitrators appointed shall have at least five (5) years' experience in the
field that is the principal subject matter of the dispute. After soliciting the
views of the Parties, the arbitrators shall order such discovery as they may
deem reasonable for a full and fair understanding of the facts and issues raised
in the arbitration. The arbitration, including the proceeding, pleadings and
evidence in connection therewith, shall be maintained as confidential. An award
rendered in connection with the arbitration shall be final and binding on the
Parties, and any judgment upon such an award may be entered in any court of
competent jurisdiction. The award shall be in writing and shall provide written
reasons in detail or the award unless the Parties agree otherwise. The award
shall also provide for the fees and expenses of the arbitrators and for the
reasonable attorneys' fees and expenses of the prevailing Party, as determined
by the arbitrators, all to be borne by the non-prevailing Party.
15. No Third Party Benefits.
Nothing in this Termination Agreement shall be construed to confer on any
person or entity not a party hereto any right, remedy or claim hereunder.
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IN WITNESS WHEREOF, each Party has caused its duly authorized
representative to execute this Termination Agreement as of the date first
written above.
FUJITSU LIMITED
By: /s/ XXXXXXX XXXXXXXX
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Name: Xxxxxxx Xxxxxxxx
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Title: Senior Vice President
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XXXX TECHNOLOGY, INC.
By: /s/ XXXX X. XXXXXXX 8/31/98
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Name: Xxxx X. Xxxxxxx
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Title: President and Chief Executive Officer
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EXHIBIT A
List of Agreements
1. Development Agreement dated June 25, 1997 between Fujitsu and XXXX (the
"Viper Development Agreement")
2. UPA Sublicense Agreement dated July 30, 1997 between Fujitsu and XXXX (the
"UPA Sublicense Agreement")
3. Software License Agreement dated February 19, 1997 between Fujitsu and XXXX
(the "OBP/Post License Agreement")
4. Non-Disclosure Agreement dated December 5, 1997 between XXXX and Fujitsu
(the "VIS Non-Disclosure Agreement")
5. CS70 SRAM Cell License Agreement dated as of April 10, 1997 between Fujitsu
and XXXX (the "CS70 Agreement")
6. Software License Agreement dated as of April 7, 1995 between XXXX and
Fujitsu (the "Solaris License Agreement")
7. License Agreement dated July 30, 1997 between XXXX and Fujitsu (the "RDB-II
License Agreement")
8. Letter Agreement dated March 17, 1995 between Fujitsu and XXXX (the "Letter
Agreement") attaching the SunSoft, Inc. Master Support Agreement executed
December 9, 1993 between SunSoft, Inc. and Fujitsu (the "SunSoft Support
Agreement")
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EXHIBIT B
List of Surviving Agreements
1. Non-Disclosure Agreement executed July 1, 1993 between Fujitsu and XXXX
2. Contractor Design Agreement dated July 15, 1995 between Puyallup Integrated
Circuit Company, Inc., XXXX and Fujitsu (the "Design Agreement")
3. CM50A+ SRAM Cell License Agreement dated as of September 30, 1996 between
Fujitsu and XXXX
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EXHIBIT C
Fujitsu Technology and Other Proprietary and Technical Information
I. VIPER DEVELOPMENT AGREEMENT
Attached.
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Viper Development Agreement
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date Doc. No. Title Tech. Rev. Attn.
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4/28/97 CL115123 PROCESS PARAMETER for CS70(for VIPER)(Revision 0.1) CS70(for VIPER) 0.1 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------------------
9/24/97 CL115122 MASK DESIGN RULE for CS70(for VIPER)(Revision 1.0) CS70(for VIPER) 1.0 X. Xxxxx
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9/24/97 CL115123-1 PROCESS PARAMETER for CS70(for VIPER)(Revision 1.0) CS70(for VIPER) 1.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------------------
10/6/97 CL115122-1 MASK DESIGN RULE for CS70(for VIPER)(Revision 1.1) CS70(for VIPER) 1.1 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------------------
10/6/97 CL115123-2 PROCESS PARAMETER for CS70(for VIPER)(Revision 1.1) CS70(for VIPER) 1.1 X. Xxxxx
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10/6/97 CL115125-1 PERMITTED CURRENT for CS70(for VIPER)(Revision 1.1) CS70(for VIPER) 1.1 X. Xxxxx
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10/6/97 CL115142 MASK DESIGN RULE(for FUSE) for CS70(for VIPER)(Revision 1.0) CS70(for VIPER) 1.0 X. Xxxxx
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12/26/97 CL100201 MASK DESIGN RULE for CS75(Revision 0.1) CS75 0.1
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12/26/97 CL100203 PERMITTED CURRENT for CS75(Revision 0.1) CS75 0.1
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12/26/97 CL100202-1 PROCESS PARAMETER for CS75(Revision 0.2) CS75 0.2
----------------------------------------------------------------------------------------------------------------------------------
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I. UPA SUBLICENSE AGREEMENT
(a) UPA Architecture Spec (Rev 2.0 + alpha (timing, update))
(b) UPA Mechanical Spec (STP5110A Module Data Sheet (7/96))
(c) UPA Thermal Guideline (STP5110A Module Data Sheet (7/96))
(d) UPA Electrical Spec (Part of STP5110A Module Data Sheet (7/96))
(e) UPA SPICE models
- UDB
- UltraSparc-I
- RIC
- U2S
- USC
- XB1
(f) UPA Simulation Information (UPA transaction traces)
(g) UPA Behavioral Models
(g-1) UPA Master/Slave (UPA64M)
(g-2) UPA Slave (UPA64S)
(g-3) System Controller (SC)
(g-4) Partial CPU (UPA128M): provided as Esluster
(g-5) UPA Bus Arbiter
(g-6) Program Language Interface
(h) UPA Monitor(s) (provided as part of g-1.2.3.4)
(i) Sun4U (System Spec)
(j) RTL interconnect (for connecting G)
(k) UltraSPARC User's Manual
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(l) US-11 Extension (provided as UltraSPARC-11 Data Sheet (STP1031) and
some UltraSPARC-1 Data Sheets)
(m) All other materials relating to Licensed Technology in the possession
or control of XXXX and for any XXXX subcontractor(s), and all copies
thereof (in whatever form)
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III. OBP/POST LICENSE AGREEMENT
(a) Licensed Software
OBP 3.1.3 for Ultra AX (Photon)
OBP 3.1.5 for Ultra AX (Photon)
OBP 3.1.9 for Ultra AX (Photon)
OBP 3.5 for UltraSPARC-I (Neutron)
OBP 3.7 for UltraSPARC-I Creater 3D (Electron)
OBP 3.7 for UltraSPARC-II (Pulsar)
OBP 3.10.3 for Ultra AXi (Panther)
OBP 3.10.4 for Ultra AXi (Panther)
OBP 3.11 for Ultra1, Xxxxx0 0X, Xxxxx0
POST 1.7 for Ultra AXi (Panther)
POST 1.8 for Ultra AXI
POST 2.3 for Ultra AX (Photon)
POST 2.3 for UltraSPARC-II (Pulsar)
POST 2.4 for Ultra AX (Photon)
POST 2.5 for Ultra AX (Photon)
POST 3.10.6 for UltraSPARC-I (Neutron)
POST 3.11.4 for UltraSPARC-I Creater 3D (Electron)
POST sb3.2.1 for UltraSPARC-II (Pulsar)
POST sb3.3.7 for Ultra2
Documentation
OBP Build Procedures
Training Materials
(b) All other materials relating to Licensed Software and Documentation,
and all copies thereof (in whatever form)
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IV. VIS NON-DISCLOSURE AGREEMENT
(a) Delivered Materials
Paper Documents
(1) VIS Hardware Developer's Kit Deliverables: the list of the
Deliverables
(2) VIS Instruction Set User's Manual
(3) VIS2.0 Interface Specification (V1.2)
(4) VIS2.0 C Reference Specification (V1.2)
Tape: electronic files
(1) DOC/ VIS 2.0 Documents
(2) include/ include files
(3) scripts/ scripts to run test programs
(4) test_src/ 1 C test program for each instruction
(5) test_bin/ executables for each test program
(6) test_bin_user/ executables for user input test program
(7) test_input input test vectors
(8) test_output output for each test vector
(9) vis_c_ref/ VIS 2.0 Reference Implementation
(10) sample/ sample VIS2.0 pseudo code
(b) All materials relating to the Delivered Materials, and all copies
thereof (in whatever form).
C-5
19
V. CS70 SRAM CELL LICENSE AGREEMENT
Attached.
C-6
20
CS70 SRAM Cell License Agreement
------------------------------------------------------------------------------------------------------------------------------
date Doc. No. Title Tech. Rev. Attn.
------------------------------------------------------------------------------------------------------------------------------
2/2/98 Erdlme313.cdl (netlist of SRAM Cell) Viper
------------------------------------------------------------------------------------------------------------------------------
2/2/98 Erdlme13.gds (GDS data of SRAM Cell) Viper X. Xxxxxx
------------------------------------------------------------------------------------------------------------------------------
21
VI. SOLARIS LICENSE AGREEMENT
(a)
(1) SOFTWARE PRODUCT
NAME OF PRODUCT VERSION RELEASE
-----------------------------------------------------------
SOLARIS 2.4, 2.5, 2.5.1, 2.6
SOLARIS 1.1.1 (Version B), 1.1.2
OPENBOOT 2
(2) SOFTWARE PRODUCT
NAME OF PRODUCT VERSION RELEASE
-----------------------------------------------------------
Early Access Version and
Quick Source Product for 2.X
(b) All materials downloaded from Access1 Database Server
(c) Documentation (manuals in the form of CD-ROM)
(d) Secondary Works
(e) Error Corrections
(f) All materials relating to the Software Products, Documentation,
Secondary Works, and Error Corrections in the possession or control of
XXXX and/or any XXXX subcontractor(s) and all copies thereof (in
whatever form).
C-7
22
VII. RDB-II LICENSE AGREEMENT
(a) memory map information of RDB-II (database program) address space
identified as:
"rdbmap.134".
(b) RDB-II program address traces under user-mode in "PC" format
identified as:
"kt.970402.pc.u.cs".
(c) RDB-II program address traces under supervisor-mode in "PC" format
identified as:
"kt.970408.pc.s.cs".
(d) RDB-II program address traces in mixed user-mode and supervisor mode
in "Data" format identified as:
"xx.000000.x_x.x.xx".
(e) RDB-II program or UNIX load modules those correspond to the address
traces b) - d) identified as the following:
"rdb2base2.970402.pc.u.cs":
(corresponds to kt.970402.pc.u.cs)
"unix.970408.kt":
(corresponds to kt.970408.pc.s.cs)
"rdb2base3.0402.rRjspbBo.BcmIOProc"
(corresponds to xx.000000.x_x.x.xx)
"unix.0418.kt.data.nocab"
(corresponds to xx.000000.x_x.x.xx)
(f) The OS libraries used by RDB-II identified as the following:
"xxxx.xx"
"xxxxxxxxx.xx"
"xxxxxxxxxxx.xx"
(g) Brief description on the format of Instruction trace data identified
as "Instruction Trace Data".
(h) All materials relating to (a) through (g) above, and all copies
thereof (in whatever form)
C-8
23
VIII. LETTER AGREEMENT
(a)
(1) SOFTWARE PRODUCT
NAME OF PRODUCT VERSION RELEASE
------------------------------------------------------
SOLARIS 2.4, 2.5, 2.5.1, 2.6
SOLARIS 1.1.1 (Version B), 1.1.2
OPENBOOT 2
(2) SOFTWARE PRODUCT
NAME OF PRODUCT VERSION RELEASE
------------------------------------------------------
Early Access Version and
Quick Source Product for 2.X
(b) All materials downloaded from Access1 Database Server
(c) Documentation (manuals in the form of CD-ROM)
(d) Secondary Works
(e) Error Corrections
(f) All materials relating to the Software Products, Documentation,
Secondary Works, and Error Corrections in the possession or control of
XXXX and/or any XXXX subcontractor(s) and all copies thereof (in
whatever form).
C-9
24
IX. COLORADO NON-DISCLOSURE AGREEMENT
Attached.
C-10
25
Colorado Non-Disclosure Agreement
----------------------------------------------------------------------------------------------------------------------
Date Doc. No. Title Tech. Rev. Attn.
----------------------------------------------------------------------------------------------------------------------
5/28/93 CL100017-10 SPICE MOSFET MODEL PARAMETER CS50 4.0e
----------------------------------------------------------------------------------------------------------------------
3/11/93 CL100018-5 MASK DESIGN RULE CS50 5.8
----------------------------------------------------------------------------------------------------------------------
12/17/93 CL100018-9 MASK DESIGN RULE for CS50 version (Revision 6.1) CS50 6.1 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
5/17/93 CL100021-6 LEVEL CODE TABLE CS50 4.3
----------------------------------------------------------------------------------------------------------------------
12/14/93 CL100021-8 LEVEL CODE TABLE for CS50/CS52 version (Revision 4.5) CS50/CS52 4.5
----------------------------------------------------------------------------------------------------------------------
5/28/93 CL100024-2 PROCESS PARAMETER CS50 2.0
----------------------------------------------------------------------------------------------------------------------
3/11/93 CL100025-1 PERMITTED CURRENT CS50 2.3
----------------------------------------------------------------------------------------------------------------------
10/25/93 CL100025-2 PERMITTED CURRENT CS50 3.0
----------------------------------------------------------------------------------------------------------------------
5/17/93 CL100027-1 ROUTING LAYER CAPACITANCE (detailed information) CS50 2.0
----------------------------------------------------------------------------------------------------------------------
3/30/93 CL100029-1 MASK DESIGN RULE (for FUSE) CS50 1.1
----------------------------------------------------------------------------------------------------------------------
10/25/93 CL100029-2 MASK DESIGN RULE (for FUSE) CS50 1.2
----------------------------------------------------------------------------------------------------------------------
5/18/93 CL100030 MASK DATA RELEASE FORM CS50 0.1
----------------------------------------------------------------------------------------------------------------------
5/28/93 CL100033 FTDL-E User's Manual for Fujitsu CMOS COT 1.0
----------------------------------------------------------------------------------------------------------------------
11/1/93 CL100037-2 Generation Method of Dummy Metal-1 pattern by DRACULA CS50 3.20
----------------------------------------------------------------------------------------------------------------------
9/28/93 CL100048-3 SPICE MOSFET MODEL PARAMETER for CMOS 0.35 (population mean)
process (Revision 1.10) 1.10 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
3/10/94 CL100048-6 SPICE MOSFET MODEL PARAMETER for CS60 (0.35 population mean)
process (Revision 2.01) PRELMINARY CS60 2.01 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
6/19/94 CL100048-7 SPICE MOSFET MODEL PARAMETER for 0.35 (population mean) process
(Revision 4.10) 4.10 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
3/30/93 CL100055 DRACULA DRC RULE FILE CS50 3.01
----------------------------------------------------------------------------------------------------------------------
3/30/93 CL100056 Process Control Monitor CS50 1.0
----------------------------------------------------------------------------------------------------------------------
2/15/95 CL100060-4 MASK DESIGN RULE for CS60 version (Revision 2.2) CS60 2.2 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
4/20/95 CL100060-5 MASK DESIGN RULE for CS60 (Revision 2.3) CS60 2.3 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
8/10/94 CL100061-3 PROCESS PARAMETER for CS60 (Revision 3.0) CS60 3.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
12/14/94 CL100061-4 PROCESS PARAMETER for CS60 (Revision 3.1) CS60 3.1 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
5/28/93 CL100064-1 P.C.M. Measurement Condition CS50 1.1
----------------------------------------------------------------------------------------------------------------------
10/5/93 CL100073 SCRIBE STRUCTURE CS50 1.0
----------------------------------------------------------------------------------------------------------------------
12/1/93 CL100077 Hot Carrier Condition under AC Stressing CS50 1.0
----------------------------------------------------------------------------------------------------------------------
12/1/93 CL100078 Hot Carrier Condition under AC Stressing for CS50/
CS52 version (Revision 1.0) CS50/CS52 1.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
12/21/93 CL100079 SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean)
process (Revision 0.3) CS55 0.3 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
8/22/94 CL100079-1 SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean)
process (Revision 0.3a) CS55 0.3a X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
12/1/94 CL100079-2 SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean)
process (Revision 0.5) CS55 0.5 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
2/15/94 CL100081 MASK DESIGN RULE for CS55 version (Revision 1.0) CS55 1.0 X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------
2/15/94 CL100082-1 PROCESS PARAMETER for CS55 version (Revision 1.1) CS55 1.1
----------------------------------------------------------------------------------------------------------------------
3/1/93 CL100083 Hot Carrier Condition under AC Stressing for CS55
version (Revision 1.0) CS55 1.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
3/1/94 CL100083 Hot Carrier Condition under AC stressing for CS55
version (Revision 1.0) CS55 1.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
7/21/95 CL100089-2 MASK DESIGN RULE (for FUSE) for CS60 version
(Revision 2.1) CS60 2.1 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
12/14/94 CL100089-3 MASK DESIGN RULE (for FUSE) for CS60 version
(Revision 3.0) CS60 3.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
7/21/95 CL100092 FUSE CELL PLACEMENT RULE for CS60 version
(Revision 1.0) CS60 1.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
12/14/94 CL100093 MASK DESIGN RULE for CS60ALE version (Revision 0.1) CS60ALE 0.1 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
6/26/94 CL100093-3 MASK DESIGN RULE for CS60ALE version (Revision 1.0) CS60ALE 1.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
9/14/95 CL100093-5 MASK DESIGN RULE for CS60ALE version (Revision 1.2) CS60ALE 1.2 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100093-6 MASK DESIGN RULE for CS60ALE version (Revision 1.3) CS60ALE 1.3 X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------
6/26/94 CL100101-1 PROCESS PARAMETER for CS60ALE (Revision 0.2) CS60ALE 0.2 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
10/11/95 CL100101-2 PROCESS PARAMETER for CS60ALE (Revision 0.3) CS60ALE 0.3 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100101-3 PROCESS PARAMETER for CS60ALE (Revision 1.0) CS60ALE 1.0
----------------------------------------------------------------------------------------------------------------------
10/11/95 CL100102-1 MASK DESIGN RULE (for FUSE) for CS60ALE version
(Revision 1.0) CS60ALE 1.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
6/26/94 CL100103-1 LEVEL CODE TABLE for CS60ALE (Revision 0.2) CS60ALE 0.2 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
9/28/95 CL100103-3 LEVEL XXXX TABLE for CS60ALE (Revision 2.0) CS60ALE 2.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100103-4 LEVEL CODE TABLE for CS60ALE (Revision 3.0) CS60ALE 3.0
----------------------------------------------------------------------------------------------------------------------
6/26/94 CL100104 PERMITTED CIRRENT for CS60ALE (Revision 0.1) CS60ALE 0.1 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
10/11/95 CL100104-1 PERMITTED CIRRENT for CS60ALE (Revision 0.2) CS60ALE 0.2 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100104-2 PERMITTED CIRRENT for CS60ALE (Revision 1.0) CS60ALE 1.0
----------------------------------------------------------------------------------------------------------------------
4/20/95 CL100106 ESD/Latch Up Guide Line for CS60 (Revision 0.1)
Preliminary CS60 0.1 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
4/20/95 CL100107 Hot Carrier Degradation Simulation Method for CS60
(Revision 0.5) Preliminary CS60 0.5 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
4/28/95 CL100107-1 Hot Carrier Degradation Simulation Method for CS60
(Revision 0.6) Preliminary CS60 0.6 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
8/10/94 CL100108 METAL ANTENNA RATIO DESIGN RULE for CS60/CS60ALE
(Revision 0.1) CS60/CS60ALE 0.1 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100108-1 METAL ANTENNA RATIO DESIGN RULE for CS60/CS60ALE
(Revision 1.0) CS60ALE 1.0
----------------------------------------------------------------------------------------------------------------------
2/15/96 CL100122 MASK DESIGN RULE for CS70 version CS70 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100122-1 MASK DESIGN RULE for CS70 (Revision 0.3) PRELIMINARY CS70 0.3
----------------------------------------------------------------------------------------------------------------------
7/26/96 CL100122-3 MASK DESIGN RULE for CS70 (Revision 0.4) PRELIMINARY CS70 0.4 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
4/3/97 CL100122-6 MASK DESIGN RULE for CS70 (Revision 1.2) CS70 1.2
----------------------------------------------------------------------------------------------------------------------
7/17/97 CL100122-7 MASK DESIGN RULE for CS70 (Revision 1.3) CS70 1.3
----------------------------------------------------------------------------------------------------------------------
2/15/96 CL100123 PROCESS PARAMETER for CS70 version CS70
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100123-1 PROCESS PARAMETER for CS70 (Revision 0.2) PRELIMINARY CS70 0.2
----------------------------------------------------------------------------------------------------------------------
9/5/96 CL100123-2 PROCESS PARAMETER for CS70 (Revision 0.3) PRELIMINARY CS70 0.3 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
4/3/97 CL100123-3 PROCESS PARAMETER for CS70 (Revision 1.0) CS70 1.0
----------------------------------------------------------------------------------------------------------------------
8/26/97 CL100123-4 PROCESS PARAMETER for CS70 (Revision 2.0) CS70 2.0 X. Xxxxx
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100124-1 LEVEL CODE TABLE for CS70 (Revision 0.2) PRELIMINARY CS70 0.2
----------------------------------------------------------------------------------------------------------------------
9/5/96 CL100124-2 LEVEL CODE TABLE for CS70 (Revision 0.3) PRELIMINARY CS70 0.3
----------------------------------------------------------------------------------------------------------------------
4/3/97 CL100124-4 LEVEL CODE TABLE for CS70 (Revision 1.1) CS70 1.1
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100125 PERMITTED CURRENT for CS70 (Revision 0.1) PRELIMINARY CS70 0.1
----------------------------------------------------------------------------------------------------------------------
4/3/97 CL100125-1 PERMITTED CURRENT for CS70 (Revision 1.0) CS70 1.0
----------------------------------------------------------------------------------------------------------------------
5/22/96 CL100132 LAYOUT GUIDE for CS70 (Revision 0.1) PRELIMINARY CS70 0.1
----------------------------------------------------------------------------------------------------------------------
4/3/97 CL100132-1 LAYOUT GUIDE for CS70 (Revision 1.0) CS70 1.0
----------------------------------------------------------------------------------------------------------------------
26
------------------------------------------------------------------------------------------------------------------------------------
date Doc. No. Title Tech Rev. Attn.
------------------------------------------------------------------------------------------------------------------------------------
5/22/96 CL100139 METAL ANTENNA RATIO DESIGN RULE for CS70
(Revision 0.1) PRELIMINARY CS70 0.1
------------------------------------------------------------------------------------------------------------------------------------
4/3/97 CL100139-1 METAL ANTENNA RATIO DESIGN RULE for CS70 (Revision 1.0) CS70 1.0
------------------------------------------------------------------------------------------------------------------------------------
7/17/97 CL100139-2 METAL ANTENNA RATIO DESIGN RULE for CS70 (Revision 1.1) CS70 1.1
------------------------------------------------------------------------------------------------------------------------------------
5/22/96 CL100142 MASK DESIGN RULE (for FUSE) for CS70
(Revision 0.1) PRELIMINARY CS70 0.1
------------------------------------------------------------------------------------------------------------------------------------
4/3/97 CL100142-3 MASK DESIGN RULE (for FUSE) for CS70 (Revision 1.0) CS70 1.0
------------------------------------------------------------------------------------------------------------------------------------
7/10/96 CL100147 Hot Carrier Degradation Simulation Method for CS70
(Revision 0.1) PRELIMINARY CS70 0.1 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
7/17/97 CL100147-1 Hot Carrier Degradation Simulation Method for CS70
(Revision 1.0) CS70 1.0
------------------------------------------------------------------------------------------------------------------------------------
1/7/98 CL100160 Mask Data Release Form Fujitsu COT (Revision 1.0) 1.0 X. Xxxxxx
------------------------------------------------------------------------------------------------------------------------------------
5/28/93 CL115018-2 MASK DESIGN RULE for XXXX Technology, Inc. CS50 5.82
------------------------------------------------------------------------------------------------------------------------------------
11/2/93 CL115018-3 MASK DESIGN RULE for XXXX Technology, Inc. CS50 6.0C
------------------------------------------------------------------------------------------------------------------------------------
12/14/93 CL115018-4 MASK DESIGN RULE CS50 version for XXXX Technology,
Inc. (Revision 6.1C) CS50 6.1C X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
10/15/93 CL115029 MASK DESIGN RULE (for FUSE) CS50 version for XXXX
Technology, INC. (Revision 0.1) CS50 0.1 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
4/28/94 CL115065 TEST DATA RELEASE FORM for XXXX Technology, inc.
(CS50 VERSION) CS50 X. Xxxxxx
------------------------------------------------------------------------------------------------------------------------------------
9/5/96 CL115153 MASK DESIGN RULE for Colorado5 (Revision 0.1) PRELIMINARY Colorado-5
------------------------------------------------------------------------------------------------------------------------------------
9/5/96 CL115155 PROCESS PARAMETER for Colorado5 (Revision 0.1) PRELIMINARY Colorado-5
------------------------------------------------------------------------------------------------------------------------------------
12/6/96 CL115155-1 PROCESS PARAMETER for Colorado5 (Revision 0.2) PRELIMINARY Colorado5 0.2 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
11/27/96 CL115165 FUSE CELL PLACEMENT RULE for Colorado5 Rev1.0 Colorado5 1.0 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
6/24/93 CS50-1519-200 List of I/O cells for XXXX Technology CS50 1.1
------------------------------------------------------------------------------------------------------------------------------------
5/24/93 CS50-1575-200 I/O CIRCUIT DIAGRAM CS50 1.1
------------------------------------------------------------------------------------------------------------------------------------
3/30/93 data DRACULA DRC RULE FILE CS50 3.01
------------------------------------------------------------------------------------------------------------------------------------
5/18/93 data CS50 sample chip (4 pieces) CS50
------------------------------------------------------------------------------------------------------------------------------------
5/18/93 data GDSII of I/O cells for XXXX Technology CS50 0.01
------------------------------------------------------------------------------------------------------------------------------------
5/28/93 data SPICE MOSFET MODEL PARAMETER CS50 4.0c
------------------------------------------------------------------------------------------------------------------------------------
11/5/93 data program 'yohko'
------------------------------------------------------------------------------------------------------------------------------------
12/21/93 data SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean)
process (Revision 0.3) CS55 0.3
------------------------------------------------------------------------------------------------------------------------------------
3/10/94 data SPICE MOSFET MODEL PARAMETER for CS60 (30.35 population mean)
process (Revision 2.01) PRELIMINARY CS60 2.01 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
6/19/94 data SPICE MOSFET MODEL PARAMETER for 0.35 (population mean)
process (Revision 4.10) 4.10 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
8/8/94 data DRACULA DRC RULE FILE for CS60 Revision 3.00 CS60 3.00 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
8/22/94 data SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean)
process (Revision 0.3a) CS55 0.3a X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
12/1/94 data SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean)
process (Revision 0.5) CS55 0.5 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
12/9/94 data DRACULA DRC RULE FILE for CS60 Revision 1.11 CS60 1.11 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
12/14/94 data FUSE CELL GDS2 data for CS60 version (Revision 3.0) CS60 3.0 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
2/9/95 data CS60 I/O cell GDS2 CS60 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
7/21/95 data FUSE CELL GDS2 data for CS60 version (Revision 2.1) CS60 2.1 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
9/28/95 data CS60ALE DRC card (Revision 1.21) CS60ALE 1.21
------------------------------------------------------------------------------------------------------------------------------------
5/22/96 data CS60ALE DRC card (Revision 1.31) CS60ALE 1.31
------------------------------------------------------------------------------------------------------------------------------------
5/22/96 data SPICE MOSFET MODEL PARAMETER for CS70 process
(Revision 1.11) PRELIMINARY CS70 1.11 X. Xxxxxx
------------------------------------------------------------------------------------------------------------------------------------
7/10/96 data SPICE MOSFET MODEL PARAMETER for CS70 process
(Revision 1.20) PRELIMINARY CS70 1.20 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
8/27/96 data SPICE MOSFET MODEL PARAMETER for CS70 process
(Revision 1.22) PRELIMINARY CS70 1.22 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
8/29/96 data SPICE MOSFET MODEL PARAMETER for CS70 process
(Revision 1.23) PRELIMINARY CS70 1.23 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
9/24/96 data HSPICE Parameter for CS70 SRAM CELL R1.00 CS70 1.0 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
11/27/96 data FUSE CELL GDS for Colorado5 Rev. 1.0 Colorado5 1.0 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
4/3/97 data SPICE MOSFET MODEL PARAMETER for CS70 process
(Revision 1.24) PRELIMINARY CS70 1.24 X. Xxxxxx
------------------------------------------------------------------------------------------------------------------------------------
7/17/97 data SPICE MOSFET MODEL PARAMETER for CS70 process
(Revision 2.00) CS70 2.0 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
9/28/93 data SPICE MOSFET MODEL PARAMETER for CMOS 0.35 (population mean)
process (Revision 1.10) 1.10 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
10/21/97 EX115006 XX00 XXXXX PROCESS FLOW for XXXX TECHNOLOGY, INC. (REV.1.0) CS55 1.0 X. Xxxxxxx
------------------------------------------------------------------------------------------------------------------------------------
10/21/97 EX115007 CS60 WAFER PROCESS FLOW for XXXX TECHNOLOGY, INC. (REV.1.0) CS60 1.0 X. Xxxxxxx
------------------------------------------------------------------------------------------------------------------------------------
10/27/97 EX115008 Wafer Packing Specifications for XXXX TECHNOLOGY, INC.
------------------------------------------------------------------------------------------------------------------------------------
4/28/94 GAT10379 Pin Code Table for Fujitsu CMOS COT X. Xxxxxx
------------------------------------------------------------------------------------------------------------------------------------
12/10/93 S93/T00-0852/005 MB82VC32 TARGET SPEC V1.4 CM50A X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
2/17/95 T15B5025 Pysical Construction Analysis of CS55 CS55 X. Xxxxxx
------------------------------------------------------------------------------------------------------------------------------------
12/14/95 T15D5017 Pull Strength Test Results of CS60 New Bonding Pad Structure CS60
------------------------------------------------------------------------------------------------------------------------------------
12/14/95 T15D5018 CS60 Bonding Pad CS60
------------------------------------------------------------------------------------------------------------------------------------
11/5/93 EXECUTION EXAMPLE
------------------------------------------------------------------------------------------------------------------------------------
11/5/93 YOHKO General Description
------------------------------------------------------------------------------------------------------------------------------------
11/5/93 YOHKO Installation/Operating Instructions
------------------------------------------------------------------------------------------------------------------------------------
11/5/93 YOHKO User's Guide Release Notes October 18th 1991
------------------------------------------------------------------------------------------------------------------------------------
11/5/93 YOHKO Version 1.0 User's Guide
------------------------------------------------------------------------------------------------------------------------------------
1/20/94 Quality and Reliability Assurance X. Xxxxxx
------------------------------------------------------------------------------------------------------------------------------------
5/13/94 Quality and Reliability Assurance (MB86904) CS50 X. Xxxxxx
------------------------------------------------------------------------------------------------------------------------------------
11/24/95 Quality and Reliability Assurance CS55 Series CS55 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
11/24/95 Quality and Reliability Assurance CS60 Series CS60 X. Xxxxx
------------------------------------------------------------------------------------------------------------------------------------
12/26/97 Quality and Reliability Assurance (CS60) CS60 X. Xxxxxxx
------------------------------------------------------------------------------------------------------------------------------------
27
X. DESIGN AGREEMENT
Attached.
C-11
28
Design Agreement
----------------------------------------------------------------------------------------------------------------------------
date Xxx.Xx. Title Tech. Rev. Attn>
----------------------------------------------------------------------------------------------------------------------------
6/16/95 S95/B751-004 ./C32/ms4rev4_FJ-metal1 (GDS data of C32 (ms4rev4-FJmetal1)) CM50/\ X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------
6/16/95 S95/B751-004 ./C32/xxxxxx.xx (Schematics of C32) CM50/\
----------------------------------------------------------------------------------------------------------------------------
29
XI. CM50A+ SRAM CELL LICENSE AGREEMENT
Attached.
C-12
30
CM50A + SRAM Cell License Agreement
----------------------------------------------------------------------------------------------------------------------------------
date Doc. No. Title Rev. Attn.
----------------------------------------------------------------------------------------------------------------------------------
11/13/96 EX1150002 Level Code Table 1.0 X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
11/13/96 EX1150001-1 Mask Design Rule 2.0 X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
11/13/96 Process Parameter 1.0 X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
11/13/96 EX1150003 Process Parameter 1.0 X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
11/13/96 SRAM size X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
12/5/96 XX0000000 CM50A + SRAM cell library (GDS data "C64cell.strm") X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
12/5/96 XX0000000 CM50A + SRAM cell library (Edge data "C64cell.current") X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
12/5/96 XX0000000 CM50A + SRAM cell library ("strm_1yr_file") X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
12/5/96 XX0000000 CM50A + SRAM cell library (Memory cell design for CM50A + "C64 cell.doc") X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
4/3/97 data SPICE MOSFET MODEL PARAMETER for CS50A + (0.4 u m) process (Revision 0.10) 0.1 X. Xxxxxx
----------------------------------------------------------------------------------------------------------------------------------
4/10/98 CL115003-1 PROCESS PARAMETER CM50A + version for XXXX - C64 REV. 2.0 2.0 X. Xxxxxxx
----------------------------------------------------------------------------------------------------------------------------------
31
XII. FUJITSU TECHNICAL INFORMATION
C-13
32
VIPER DEVELOPMENT AGREEMENT
DOCUMENT/DATA# TITLE
1. CL115123 PROCESS PARAMETER for CS70 (for VIPER) (Revision 0.1)
2. CL115122 MASK DESIGN RULE for CS70 (for VIPER) (Revision 1.0)
3. CL115123-1 PROCESS PARAMETER for CS70 (for VIPER) (Revison 1.0)
4. CL115122-1 MASK DESIGN RULE for CS70 (for VIPER) (Revision 1.1)
5. CL115123-2 PROCESS PARAMETER for CS70 (for VIPER) (Revision 1.1)
6. CL115125-1 PERMITTED CURRENT for CS70 (for VIPER) (Revision 1.1)
7. CL115142 MASK DESIGN RULE (for FUSE) for CS70 (for VIPER) (Revision 1.0)
8. CL100201 MASK DESIGN RULE for CS75 (Revision 0.1)
9. CL100203 PERMITTED CURRENT for CS75 (Revision 0.1)
10. CL100202-1 PROCESS PARAMETER for CS75 (Revision 0.2)
C-13A
33
CM50A+ LICENSE AGREEMENT
DOCUMENT/DATA# TITLE
1. EX115002 Level Code Table
2. EX115001 Mask Design Rule
3. EX115003 Process Parameter
4. none SRAM size
5. EX115005 CM50A + SRAM cell library (GDS data "C64cell.strm")
6. EX115005 CM50A + SRAM cell library (Edge data "C64.current")
7. EX115005 CM50A + SRAM cell library ("strm_lyr_file")
8. EX115005 CM50A + SRAM cell library
(Memory dell design for CM50A + "C64cell.doc")
9. data SPICE MOSFET MODEL PARAMETER"
for CS50A + (0.4 i m) process (Revision 0.10)
10. CL115003-1 PROCESS PARAMETER CM50A + version for XXXX-C64 REV.2.0
11. EX115001-1 Mask Design Rule
C-13B
34
DESIGN AGREEMENT
DOCUMENT/DATA# TITLE
1. S95/B751-004 ./C32/ms4rev4_FJ-metal1 (GDS data of C32 (ms4rev4-FJmetal1))
2. S95/B751-004 ./C32/xxxxxx.xx (Schematics of C32)
C-13C
35
CS70 LICENSE AGREEMENT
TITLE
1. Erd1met3.cdl (netlist of SRAM Cell)
2. Erd1met3.gds (GDS data of SRAM Cell)
C-13D
36
COLORADO NON-DISCLOSURE AGREEMENT
Attached.
C-13E
37
---------------------------------------------------------------------------------------------------------------------
Document # Title Remarks
---------------------------------------------------------------------------------------------------------------------
1 CL100017-10 SPICE MOSFET MODEL PARAMETER Deleted
---------------------------------------------------------------------------------------------------------------------
2 CL100018-5 MASK DESIGN RULE Deleted
---------------------------------------------------------------------------------------------------------------------
3 CL100018-9 MASK DESIGN RULE for CS50 version (Revision 6.1) Deleted
---------------------------------------------------------------------------------------------------------------------
4 CL100021-6 LEVEL CODE TABLE Deleted
---------------------------------------------------------------------------------------------------------------------
5 CL100021-8 LEVEL CODE TABLE FOR CS50/CS52 version (Revision 4.5) Deleted
---------------------------------------------------------------------------------------------------------------------
6 CL100024-2 PROCESS PARAMETER Deleted
---------------------------------------------------------------------------------------------------------------------
7 CL100025-1 PERMITTED CURRENT Deleted
---------------------------------------------------------------------------------------------------------------------
8 CL100025-2 PERMITTED CURRENT Deleted
---------------------------------------------------------------------------------------------------------------------
9 CL100027-1 ROUTING LAYER CAPACITANCE (detailed information) Deleted
---------------------------------------------------------------------------------------------------------------------
10 CL100029-1 MASK DESIGN RULE (for FUSE) Deleted
---------------------------------------------------------------------------------------------------------------------
11 CL100029-2 MASK DESIGN RULE (for FUSE) Deleted
---------------------------------------------------------------------------------------------------------------------
12 CL100030 MASK DATA RELEASE FORM Deleted
---------------------------------------------------------------------------------------------------------------------
13 CL100033 FTDL-E User's Manual for Fujitsu CMOS COT Deleted
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14 CL100037-2 Generation Method of Dummy Metal-1 pattern by DRACULA Deleted
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15 CL100048-3 SPICE MOSFET MODEL PARAMETER for CMOS 0.35 (population mean) process Deleted
(Revision 1.10)
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16 CL100048-6 SPICE MOSFET MODEL PARAMETER for CS60 (0.35 population mean) process Deleted
(Revision 2.01) PRELIMINARY
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17 CL100048-7 SPICE MOSFET MODEL PARAMETER for 0.35 (population mean) process (Revision 4.10) Deleted
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18 CL100055 DRACULA DRC RULE FILE Deleted
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19 CL100056 Process Control Monitor Deleted
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20 CL100060-4 MASK DESIGN RULE for CS60 version (Revision 2.2) Deleted
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21 CL100060-5 MASK DESIGN RULE for CS60 (Revision 2.3) Deleted
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22 CL100061-3 PROCESS PARAMETER for CS60 (Revision 3.0) Deleted
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23 CL100061-4 PROCESS PARAMETER for CS60 (Revision 3.1) Deleted
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24 CL100064-1 P.C.M. Measurement Condition Deleted
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25 CL100073 SCRIBE STRUCTURE Deleted
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26 CL100077 Hot Carrier Condition under AC Stressing Deleted
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27 CL100078 Hot Carrier Condition under AC Stressing for CS50/CS52 version (Revision 1.0) Deleted
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28 CL100079 SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean) process (Revision 0.3) Deleted
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29 CL100079-1 SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean) process (Revision 0.3a) Deleted
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30 CL100079-2 SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean) process (Revision 0.5) Deleted
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31 CL100081 MASK DESIGN RULE for CS55 version (Revision 1.0) Deleted
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32 CL100082-1 PROCESS PARAMETER FOR CS55 version (Revision 1.1) Deleted
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33 CL100083 Hot Carrier Condition under AC Stressing for CS55 version (Revision 1.0) Deleted
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34 CL100083 Hot Carrier Condition under AC Stressing for CS55 version (Revision 1.0) Deleted
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35 CL100089-2 MASK DESIGN RULE (for FUSE) for CS60 version (Revision 2.1) Deleted
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36 CL100089-3 MASK DESIGN RULE (for FUSE) for CS60 version (Revision 3.0) Deleted
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37 CL100092 FUSE CELL PLACEMENT RULE for CS60 version (Revision 1.0) Deleted
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38 CL100093 MASK DESIGN RULE for CS60ALE version (Revision 0.1) Deleted
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39 CL100093-3 MASK DESIGN RULE for CS60ALE version (Revision 1.0) Deleted
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40 CL100093-5 MASK DESIGN RULE for CS60ALE (Revision 1.2) Deleted
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41 CL100093-6 MASK DESIGN RULE for CS60ALE (Revision 1.3) Deleted
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42 CL100101-1 PROCESS PARAMETER for CS60ALE (Revision 0.2) Deleted
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43 CL100101-2 PROCESS PARAMETER for CS60ALE (Revision 03) Deleted
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44 CL100101-3 PROCESS PARAMETER for CS60ALE (Revision 1.0) Deleted
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45 CL100102-1 MASK DESIGN RULE (for FUSE) for CS60ALE version (Revision 1.0) Deleted
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46 CL100103-1 LEVEL CODE TABLE for CS60ALE (Revision 0.2) Deleted
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47 CL100103-3 LEVEL CODE TABLE for CS60ALE (Revision 2.0) Deleted
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48 CL100103-4 LEVEL CODE TABLE for CS60ALE (Revision 3.0) Deleted
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49 CL100104 PERMITTED CIRRENT for CS60ALE (Revision 0.1) Deleted
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50 CL100104-1 PERMITTED CIRRENT for CS60ALE (Revision 0.2) Deleted
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51 CL100104-2 PERMITTED CIRRENT for CS60ALE (Revision 1.0) Deleted
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52 CL100106 ESD/Latch Up Guide Line for CS60 (Revision 0.1) Preliminary Deleted
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53 CL100107 Hot Carrier Degradation Simulation Meyhod for CS60 (Revision 0.5) Preliminary Deleted
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54 CL100107-1 Hot Carrier Degradation Simulation Method for CS60 (Revision 0.6) Preliminary Deleted
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55 CL100108 METAL ANTENNA RATIO DESIGN RULE for CS60/CS60ALE (Revision 0.1) Deleted
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56 CL100108-1 METAL ANTENNA RATIO DESIGN RULE for CS60/CS60ALE (Revision 1.0) Deleted
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57 CL100122 MASK DESIGN RULE for CS70 version Destroyed & Erased
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58 CL100122-1 MASK DESIGN RULE for CS70 (Revision 0.3) PRELIMINARY Destroyed & Erased
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59 CL100122-3 MASK DESIGN RULE for CS70 (Revision 0.4) PRELIMINARY Destroyed & Erased
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60 CL100122-6 MASK DESIGN RULE for CS70 (Revision 1.2) Destroyed & Erased
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61 CL100122-7 MASK DESIGN RULE for CS70 (Revision 1.3) Destroyed & Erased
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62 CL100123 PROCESS PARAMETER for CS70 version Destroyed & Erased
---------------------------------------------------------------------------------------------------------------------
63 CL100123-1 PROCESS PARAMETER for CS70 (Revision 0.2) PRELIMINARY Destroyed & Erased
---------------------------------------------------------------------------------------------------------------------
64 CL100123-2 PROCESS PARAMETER for CS70 (Revision 0.3) PRELIMINARY Destroyed & Erased
---------------------------------------------------------------------------------------------------------------------
38
--------------------------------------------------------------------------------------------------------------------------------
Document# Title Remarks
--------------------------------------------------------------------------------------------------------------------------------
65 CL100123-3 PROCESS PARAMETER for CS70 (Revision 1.0) Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
66 CL100123-4 PROCESS PARAMETER for CS70 (Revision 2.0) Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
67 CL100124-1 LEVEL CODE TABLE for CS70 (Revision 0.2) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
68 CL100124-2 LEVEL CODE TABLE for CS70 (Revision 0.3) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
69 CL100124-4 LEVEL CODE TABLE for CS70 (Revision 1.1) Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
70 CL100125 PERMITTED CURRENT for CS70 (Revision 0.1) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
71 CL100125-1 PERMITTED CURRENT for CS70 (Revision 1.0) Destroyed & Erased
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72 CL100132 LAYOUT GUIDE for CS70 (Revision 0.1) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
73 CL100132-1 LAYOUT GUIDE for CS70 (Revision 1.0) Destroyed & Erased
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74 CL100139 METAL ANTENNA RATIO DESIGN RULE for CS70 (Revision 0.1) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
75 CL100139-1 METAL ANTENNA RATIO DESIGN RULE for CS70 (Revision 1.0) Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
76 CL100139-2 METAL ANTENNA RATIO DESIGN RULE for CS70 (Revision 1.1) Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
77 CL100142 MASK DESIGN RULE (for FUSE) for CS70 (Revision 0.1) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
78 CL100142-3 MASK DESIGN RULE (for FUSE) for CS70 (Revision 1.0) Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
79 CL100147 Hot Carrier Degradation Simulation Method for CS70 (Revision 0.1) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
80 CL100147-1 Hot Carrier Degradation Simulation Method for CS70 (Revision 1.0) Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
81 CL100160 Mask Data Release Form Fujitsu COT (Revision 1.0) Deleted
--------------------------------------------------------------------------------------------------------------------------------
82 CL115018-2 MASK DESIGN RULE for XXXX Technology, Inc. Deleted
--------------------------------------------------------------------------------------------------------------------------------
83 CL115018-3 MASK DESIGN RULE for XXXX Technology, Inc. Deleted
--------------------------------------------------------------------------------------------------------------------------------
84 CL115018-4 MASK DESIGN RULE CS50 version for XXXX Technology, Inc. (Revision 6.1C) Deleted
--------------------------------------------------------------------------------------------------------------------------------
85 CL115029 MASK DESIGN RULE (for FUSE) CS50 version for XXXX Technology, INC. (Revision 0.1) Deleted
--------------------------------------------------------------------------------------------------------------------------------
86 CL115065 TEST DATA RELEASE FORM for XXXX Technology, Inc. (CS50 version) Deleted
--------------------------------------------------------------------------------------------------------------------------------
87 CL115153 MASK DESIGN RULE for Colorado5 (Revision 0.1) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
88 CL115155 PROCESS PARAMETER for Colorado5 (Revision 0.1) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
89 CL115155-1 PROCESS PARAMETER for Colorado5 (Revision 0.2) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
90 CL115165 FUSE CELL PLACEMENT RULE for Colorado5 Rev 1.0 Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
91 CS50-1519-200 List of I/O cells for XXXX Technology Deleted
--------------------------------------------------------------------------------------------------------------------------------
92 CS50-1575-200 I/O CIRCUIT DIAGRAM Deleted
--------------------------------------------------------------------------------------------------------------------------------
93 data DRACULA DRC RULE FILE Deleted
--------------------------------------------------------------------------------------------------------------------------------
94 data CS50 sample chip (4 pieces) Deleted
--------------------------------------------------------------------------------------------------------------------------------
95 data GDSII of I/O cells for XXXX Technology Deleted
--------------------------------------------------------------------------------------------------------------------------------
96 data SPICE MOSFET MODEL PARAMETER Deleted
--------------------------------------------------------------------------------------------------------------------------------
97 data program 'yohko' Deleted
--------------------------------------------------------------------------------------------------------------------------------
98 data SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean) process (Revision 0.3) Deleted
--------------------------------------------------------------------------------------------------------------------------------
99 data SPICE MOSFET MODEL PARAMETER for CS60 (0.35 population mean) process
(Revision 2.01) PRELIMINARY Deleted
--------------------------------------------------------------------------------------------------------------------------------
100 data SPICE MOSFET MODEL PARAMETER for 0.35 (population mean) process (Revision 4.10) Deleted
--------------------------------------------------------------------------------------------------------------------------------
101 data DRACULA DRC RULE FILE for CS60 Revision 3.00 Deleted
--------------------------------------------------------------------------------------------------------------------------------
102 data SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean) process (Revision 0.3a) Deleted
--------------------------------------------------------------------------------------------------------------------------------
103 data SPICE MOSFET MODEL PARAMETER for CS55 (0.4 population mean) process (Revision 0.5) Deleted
--------------------------------------------------------------------------------------------------------------------------------
104 data DRACULA DRC RULE FILE for CS60 Revision 1.11 Deleted
--------------------------------------------------------------------------------------------------------------------------------
105 data FUSE CELL GDS2 data for CS60 version (Revision 3.0) Deleted
--------------------------------------------------------------------------------------------------------------------------------
106 data CS60 I/O cell GDS2 Deleted
--------------------------------------------------------------------------------------------------------------------------------
107 data FUSE CELL GDS2 data for CS60 version (Revision 2.1) Deleted
--------------------------------------------------------------------------------------------------------------------------------
108 data CS60ALE DRC card (Revision 1.21) Deleted
--------------------------------------------------------------------------------------------------------------------------------
109 data CS60ALE DRC card (Revision 1.31) Deleted
--------------------------------------------------------------------------------------------------------------------------------
110 data SPICE MOSFET MODEL PARAMETER for CS70 process (Revision 1.11) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
111 data SPICE MOSFET MODEL PARAMETER for CS70 process (Revision 1.20) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
112 data SPICE MOSFET MODEL PARAMETER for CS70 process (Revision 1.22) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
113 data SPICE MOSFET MODEL PARAMETER for CS70 process (Revision 1.23) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
114 data HSPICE Parameter for CS70 SRAM CELL R1.00 Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
115 data FUSE CELL GDS for Colorado5 Rev.1.0 Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
116 data SPICE MOSFET MODEL PARAMETER for CS70 process (Revision 1.24) PRELIMINARY Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
117 data SPICE MOSFET MODEL PARAMETER for CS70 process (Revision 2.00) Destroyed & Erased
--------------------------------------------------------------------------------------------------------------------------------
118 data SPICE MOSFET MODEL PARAMETER for CMOS 0.35 (population mean) process
(Revision 1.10) Deleted
--------------------------------------------------------------------------------------------------------------------------------
119 EX115006 XX00 XXXXX PROCESS FLOW for XXXX TECHNOLOGY, INC. (Rev. 1.0) Deleted
--------------------------------------------------------------------------------------------------------------------------------
120 EX115007 XX00 XXXXX PROCESS FLOW for XXXX TECHNOLOGY, INC. (Rev. 1.0) Deleted
--------------------------------------------------------------------------------------------------------------------------------
121 EX115008 Wafer Packing Specifications for XXXX TECHNOLOGY, INC. Deleted
--------------------------------------------------------------------------------------------------------------------------------
122 GAT10379 Pin Code Table for Fujitsu CMOS COT Deleted
--------------------------------------------------------------------------------------------------------------------------------
123 S93/T00-0852/00 MB82VC32 TARGET SPEC V1.4 Deleted
--------------------------------------------------------------------------------------------------------------------------------
124 T15B5025 Physical Construction Analysis of CS55 Deleted
--------------------------------------------------------------------------------------------------------------------------------
125 T15D5017 Pull Strength Test Results of CS60 New Bonding Pad Structure Deleted
--------------------------------------------------------------------------------------------------------------------------------
126 TI5D5018 CS60 Bonding Pad Deleted
--------------------------------------------------------------------------------------------------------------------------------
127 none EXECUTION EXAMPLE Returned
--------------------------------------------------------------------------------------------------------------------------------
128 none YOHKO General Description Returned
--------------------------------------------------------------------------------------------------------------------------------
39
Document # Title Remarks
129 none YOHKO Installation/Operating Instructions Returned
130 none YOHKO User's Guide Release Notes October 18th 1991 Returned
131 none YOHKO Version 1.0 User's Guide Returned
132 none Quality and Reliability Assurance Deleted
133 none Quality and Reliability Assurance (MB86904) Deleted
134 none Quality and Reliability Assurance CS55 Series Deleted
135 none Quality and Reliability Assurance CS60 Series Deleted
136 none Quality and Reliability Assurance (CS60) Deleted
40
APPENDIX I
8.1 OWNERSHIP RIGHTS AND LICENSE
(a) Joint Ownership and License
All right, title and interest in the Specifications, Deliverables and
Product to the extent created, conceived or developed by Xxxx pursuant to this
Agreement (including any discoveries created, conceived or developed by Xxxx in
consultation with Fujitsu) or by Fujitsu and/or HaL engineers working with Xxxx
pursuant to Section 3.3, including, but not limited to, (i) the Licensable Viper
Design Methodology (ii) all modifications and additions (including Error
corrections) to the Specifications, Deliverables and Product (including any
prototypes, work in progress, documentation or other materials related thereto)
made during the term of this Agreement, (iii) worldwide ownership of all
Intellectual Property Rights with respect to the Specifications, Deliverables
and Product (including any prototypes, work in progress, documentation or other
materials related thereto) and (iv) any ideas concepts, techniques, inventions,
creations, works, processes, designs or methods that are embodied therein or
that are necessary for the design, development, implementation, assembly,
testing, operation, modification or other use thereof, (but expressly excluding
the Non-Licensable Design Methodology, the Existing Viper Technology, the
Pre-Viper Technology, the Sun Technology and the Fujitsu
Technology)(collectively, the "New Technology"), is hereby vested equally in
Xxxx and Fujitsu as joint owners and each Party hereby assigns, and agrees to
assign, to the other Party an irrevocable, worldwide, nonexclusive, perpetual,
royalty-free undivided fifty percent (50%) interest in and to all of the New
Technology without any obligation to account to or obtain the consent of the
other Party for the exercise of any rights by a Party, the grant of any license
by a Party or otherwise with respect to the New Technology except as follows:
(i) Fujitsu's consent shall be required to the grant by Xxxx of a license
of the New Technology to any Person, provided that any licensees (including
Subsidiaries) shall be subject to the restrictions set forth in this Agreement
and shall not have the right to grant sublicenses; and
(ii) the consent of Fujitsu shall be required for the grant by Xxxx of a
license of the Viper Microprocessor Core (including all or any portion of the
Existing Viper Technology utilized in the Viper Microprocessor Core) to any
Person, including, without limitation, any Transferred Business, which consent
may be withheld by Fujitsu in its sole discretion; and
(iii) Xxxx shall not, without the prior written consent of Fujitsu, sell,
convey, transfer or assign, in whole or in part, its ownership interest in the
New Technology.
For the avoidance of doubt, Fujitsu shall have the unrestricted right to
grant licenses of the New Technology without any obligation to obtain Xxxx'
consent or provide payment to Xxxx in connection with any such license.
