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EXHIBIT 10.1
REDACTED FOR CONFIDENTIALITY
Dated 31 July 2000
LUCENT TECHNOLOGIES INC.
- and -
CHARTERED SEMICONDUCTOR MANUFACTURING LTD
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AMENDMENT AGREEMENT (NO. 1)
TO
TECHNOLOGY TRANSFER AGREEMENT
DATED 17 FEBRUARY 1998
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CONFIDENTIAL TREATMENT REQUESTED
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THE ASTERISKED PORTIONS OF THIS DOCUMENT
HAVE BEEN OMITTED AND ARE FILED SEPARATELY
WITH THE SECURITIES AND EXCHANGE COMMISSION
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AMENDMENT AGREEMENT (NO. 1)
THIS AMENDMENT AGREEMENT (NO. 1) is made on 31 July 2000
BETWEEN :-
(1) LUCENT TECHNOLOGIES INC. ("Lucent"), a Delaware corporation having an
office at 000 Xxxxxxxx Xxxxxx, Xxxxxx Xxxx, Xxx Xxxxxx 00000, Xxxxxx Xxxxxx
of America; and
(2) CHARTERED SEMICONDUCTOR MANUFACTURING LTD ("CSM"), a company incorporated
in Singapore with its registered office at 00, Xxxxxxxxx Xxxxxxxxxx Xxxx X,
Xxxxxx 0, Xxxxxxxxx 000000;
Lucent and CSM are collectively referred to herein as "Parties" and individually
referred to herein as a "Party".
WHEREAS:-
(A) The Parties have entered into a Technology Transfer Agreement dated 17
February 1998 (the "Technology Transfer Agreement").
(B) The Parties are entering into this Amendment Agreement (No. 1) to vary the
Technology Transfer Agreement with effect from the date hereof.
IT IS AGREED as follows:-
1. INTERPRETATION
All terms and references used in the Technology Transfer Agreement and
which are defined or construed in the Technology Transfer Agreement but are
not defined or construed in this Amendment Agreement (No. 1) shall have the
same meaning and construction in this Amendment Agreement (No. 1).
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2. AMENDMENT TO THE TECHNOLOGY TRANSFER AGREEMENT
The Parties agree that with effect from the date of this Amendment
Agreement (No. 1), the following exhibits of the Technology Transfer
Agreement
- Exhibit A Lucent's Technical Information
- Exhibit B CSM's Technical Information
- Exhibit C List of Subsidiaries
- Exhibit D Technical Information Which May Be Disclosed To Customers
shall be amended by deleting the said exhibits in their entirety and
replacing therewith, the exhibits attached to this Amendment Agreement (No.
1) and marked as
- "Exhibit A Lucent's Technical Information"
- "Exhibit B CSM's Technical Information"
- "Exhibit C List of Subsidiaries"
- "Exhibit D Technical Information Which May Be Disclosed to Customers"
respectively.
3. SAVING AND INCORPORATION
(A) Save as expressly amended by this Amendment Agreement (No. 1), the terms
and conditions of the Technology Transfer Agreement shall continue to be in
full force and effect in all other respects.
(B) The Technology Transfer Agreement and this Amendment Agreement (No. 1)
shall be construed as one document and this Amendment Agreement (No. 1)
shall be deemed to be part of the Technology Transfer Agreement. Where the
context so permits, references in the Technology Transfer Agreement and in
this Amendment Agreement (No. 1) to "the Technology Transfer Agreement" or
"this Agreement" shall be read and construed as references to the
Technology Transfer Agreement as amended and supplemented this Amendment
Agreement (No. 1).
4. GOVERNING LAW
This Amendment Agreement (No. 1) shall be interpreted in accordance with
the law of the State of New York, United States of America, without regard
to conflicts of laws provisions.
I N W I T N E S S W H E R E O F the parties have entered into this Amendment
Agreement (No. 1) as of the later date stated below.
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LUCENT TECHNOLOGIES INC.
By: /s/ Xxx XxXxxxx
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Xxx XxXxxxx
President - Intellectual Property Business
Date: 31 July 2000
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CHARTERED SEMICONDUCTOR MANUFACTURING LTD
By: /s/ Xxxxx Xxxxx
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Xxxxx Xxxxx
President & Chief Executive Officer
Date: 21 June 2000
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EXHIBIT A
LUCENT'S TECHNICAL INFORMATION
Lucent's ***** and ****** and ****** Digital and Linear Process Technologies
1. Process Flow
2. Process Log
3. Process recipes and tool set-ups
4. Target film thicknesses
5. Schematic cross-sections
6. Electrical specifications
7. Layout rules
8. Transistor spice files
9. Device characterization data
10. Process characterization data
11. Process capability data
12. Yield and Defect Density Trend data
13. Reliability Characterisation data and Qualification Reports
14. FMA results
15. Equipment and Materials specifications
Lucent's Technical Information shall not include Lucent's BiCMOS, FLASH and
embedded DRAM modules.
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EXHIBIT B
CSM'S TECHNICAL INFORMATION
(A) For the following Process Modules,
(1) CSM's ******** Process Technology;
(2) CSM's ********* Process Technology;
(3) CSM's ******** Process Technology;
(4) CSM's ******** Process Module;
(5) CSM's ******** Process Technology and derivatives;
(6) CSM's *********** Process Technology;
(7) CSM's *********** Process Technology; and
(8) CSM's *********** Process Technology.
CSM will provide the following Technical Information:
1. Process Flow
2. Process Log
3. Process recipes and tool set-ups
4. Target film thicknesses
5. Schematic cross-sections
6. Electrical specifications
7. Layout rules
8. Transistor spice files
9. Device characterization data
10. Process characterization data
11. Process capability data
12. Yield and Defect Density Trend data
13. Reliability Characterisation data and Qualification Reports
14. FMA results
15. Equipment and Materials specifications
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(B) CSM's Technical Information shall not include :-
(1) any of CSM's customer specific derivative process technologies based on any
of CSM's baseline Process Technologies listed above in Section A of this
Exhibit C;
(2) CSM's ********* Process Technologies;
(3) CSM's ********* Process Technologies; and
(4) CSM's ********* Process Technologies.
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EXHIBIT C
LIST OF SUBSIDIARIES
LUCENT'S SUBSIDIARIES
Cirent Semiconductor
Silicon Manufacturing Partners Pte Ltd
CSM'S SUBSIDIARIES
Chartered Silicon Partners Pte Ltd
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EXHIBIT D
TECHNICAL INFORMATION WHICH MAY BE DISCLOSED TO CUSTOMERS
The following portions of Lucent's Technical Information (Exhibit A) and CSM's
Technical Information (Exhibit C) can be provided to customers under appropriate
confidentiality terms in accordance with the provisions of Article 4:
1. Process Information
Process Name
Technology
Process Type
Number of Poly Layers
Number of Metal Layers
Poly Type
Voltage Type
Module Addition
Process Description
Starting Material Type(s)
Non-EPI Layer
Epitaxial Layer
Process Runsheet Spec
Non-Proprietary Process Flow Spec
Schematic Cross-Sections
Topological Design Rule Spec
Mask Bias Table Spec
Number of Reticles
Number of Masking Layers
Frame Doc #
Frame Table #
Reliability Spec
CSM's ****** and ****** Bitcells
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2. Electrical Test Information
Spice Model Spec
Xxxxx - 00
Xxxxx - 00
Xxxxx - 00
Xxxxx - 53
BSIM3
Electrical Parameters Spec
Electrical Test Spec
Electrical Test Program Spec
3. Qualification Plan
Reliability Results Report (at QA)
Qual Report
4. Phase of Process
Engineering Prototype/ Pilot Production/ Production
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