Loan Agreement made in 31st January 2008
Exhibit 10.13
Loan Agreement made in 31st
January
2008
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Lender:
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Penflow
Technology (Asia) Limited, a company duly incorporated under the laws of
Hong Kong (SAR) and having its registered office at 000, Xxxxxxxx Xxxxx,
000 Xxxx'x Xxxx, Xxxx Xxxx (hereinafter
"Penflow")
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Borrower:
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Home
Touch Limited, a company duly incorporated under the laws of Hong Kong
(SAR) and having its registered office at 000, Xxxxxxxx Xxxxx, 000 Xxxx'x
Xxxx, Xxxx Xxxx (hereinafter "HT")
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Regarding
the loan for Xxxxxxx Street project, Penflow agreed to borrow H1(1)3,000,000 to
HT by following terms:
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1.
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Total
Amount:
HKD3,000,000
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2.
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Interest
Amount: HKD
100,000
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3.
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Loan
Period:
From 1" Feb 2008 to 31' Jan 2010
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4.
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Collateral:
No need
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IN
WITNESS WHEREOF the parties hereto have caused this Agreement to be executed by
their authorized representatives on the day and year first above
written.
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For
and on behalf of
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For
and on behalf of
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Penflow
Technology (Asia) Limited
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Home
Touch Limited
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By:
Xxxxxx Xxx
/s/ Xxxxxx
Xxx
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By:
Xxxxx Xx
/s/ Xxxxx
Xx
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