FORM OF LIEN RELEASE AGREEMENT
Exhibit
10.3
THIS LIEN RELEASE AGREEMENT (this
“Agreement”) is made and entered
into this 18th
day
of March,
2009 by and between Irvine Sensors Corporation, a Delaware
corporation (the “Company”), and the
undersigned investor (the “Investor”).
Each of the Company and the Investor is sometimes referred to
herein as a “Party,” and collectively as
the “Parties.”
RECITALS
A. WHEREAS, the Company owes the Investor principal
and interest totaling approximately
$ as
of ,
2009 pursuant to that certain Secured Promissory Note dated as
of
in favor of the Investor
(the “Note”);
B. WHEREAS, the Investor is a party to, and the
Company’s assets are secured by liens (the
“Liens”) pursuant to, that certain
Security Agreement dated as of November 5, 2008 and
Intercreditor Agreement dated as of November 5, 2008;
C. WHEREAS, the Company has entered into an
agreement to sell most of its patent portfolio and related
assets (“Patent Assets”) to a patent
acquisition company (the “Patent Buyer”)
for up to a $9.5 million cash payment and it is anticipated
that the Company will be granted a perpetual, worldwide,
royalty-free, non-exclusive license to use the sold patents in
its business (the “Patent Sale and
License”), a condition to which is a requirement
that the Investor agrees to release its Liens relating to the
Patent Assets pursuant to the terms of this Agreement;
D. WHEREAS, the parties desire to effect such a
release of the Investor’s Liens relating to the Patent
Assets; and
E. WHEREAS, the Company, U.S. Bank National
Association (the “Escrow Agent”) and
certain holders of the bridge notes issued by the Company
pursuant to that certain Private Placement Memorandum, dated as
of September 29, 2008 and as supplemented on
January 26, 2009, (the “Bridge
Notes”) have entered into an Escrow Agreement,
pursuant to which the Company has agreed to deposit out of the
proceeds of the Patent Sale and License an amount equal to
$1,040,000 (the “Escrow Deposit”).
AGREEMENT
NOW THEREFORE, in consideration of the foregoing and the
agreements and covenants contained herein, the Parties agree as
follows:
1. Release of Liens. As
consideration for the Investor’s release of Liens relating
to the Patent Assets, the Investor agrees as follows (Please
Initial One):
a. (Initials)
Investor agrees to (i) upon receipt of the outstanding
principal and accrued interest owing under the Note, such amount
to be paid to Investor out of the Escrow Deposit promptly after
the closing of the Patent Sale and License, surrender the Note
to the Company for cancellation and (ii) upon the Escrow
Agent’s receipt of the Escrow Deposit, execute and deliver
the release of Liens relating to the Patent Assets attached
hereto as Exhibit A; or
b. (Initials)
Investor agrees to (i) upon receipt of the number of shares
of the Company’s common stock (the
“Shares”) set forth in this
Section 1(b), surrender the Note to the Company for
cancellation in exchange for the Company’s agreement to
issue to Investor, subject to approval of the Company’s
stockholders, the number of Shares equal to 125% of the value of
the outstanding principal and accrued interest under the Note,
based on the greater of (a) $0.40, (b) the last
reported closing sale price of the Company’s common stock
on the Nasdaq Capital Market immediately prior to the closing of
the Patent Sale and License and (c) the consolidated
closing bid price of the Company’s common stock on the
Nasdaq Capital Market immediately prior to the closing of the
Patent
1
Sale and License and (ii) upon the Escrow Agent’s
receipt of the Escrow Deposit, execute and deliver the release
of Liens relating to the Patent Assets attached hereto as
Exhibit A; or
c. (Initials)
Investor agrees to (i) upon receipt of the number of Shares
set forth in this Section 1(c) and the amount of principal
and accrued interest set forth in this Section 1(c),
surrender the Note to the Company for cancellation in exchange
for the Company’s agreement to (y) pay Investor
$ of
the outstanding principal and accrued interest under the Note in
cash out of the proceeds of the Patent Sale and License, such
amount to be paid to Investor out of the Escrow Deposit promptly
after the closing of the Patent Sale and License and
(z) issue to Investor, subject to approval of the
Company’s stockholders, the number of Shares equal to 125%
of the value of the remaining
$ of
the outstanding principal and accrued interest under the Note,
based on the greater of (1) $0.40, (2) the last
reported closing sale price of the Company’s Common Stock
on the Nasdaq Capital Market immediately prior to the closing of
the Patent Sale and License and (3) the consolidated
closing bid price of the Company’s Common Stock on the
Nasdaq Capital Market immediately prior to the closing of the
Patent Sale and License and (ii) upon the Escrow
Agent’s receipt of the Escrow Deposit, execute and deliver
the release of Liens relating to the Patent Assets attached
hereto as Exhibit A.
2. Equity Consideration. In the
event the Investor agrees to either Section 1(b) or 1(c) of
this Agreement, the Company shall use commercially reasonable
efforts to obtain stockholder approval for the issuance of the
Shares no later than the Company’s 2009 Annual Meeting of
Stockholders. The Company shall issue the Shares to the Investor
as soon as practicable after such issuance has been approved by
the Company’s stockholders. If the Company is unable to
obtain stockholder approval for the issuance of the Shares, the
Note shall remain outstanding in accordance with its terms.
3. Governing Law. This Agreement
shall be governed by, and construed in accordance with, the laws
of the State of California without regard to conflicts of laws
that would result in the application of the substantive laws of
another jurisdiction.
4. Attorneys’ Fees. If any
action or proceeding in contract or tort arising out of or
relating to this Agreement is commenced by any party to this
Agreement, the prevailing party shall be entitled to receive
from the other party, in addition to any other relief that may
be granted, the reasonable attorneys’ fees, costs and
expenses incurred in the action or proceeding by the prevailing
party, along with any reasonable attorneys’ fees, costs and
expenses incurred to collect any amount awarded in connection
with any such action or proceeding.
5. Waiver of Jury Trial and Setoff; Consent to
Jurisdiction; Etc. In any litigation in any
court with respect to, in connection with, or arising out of
this Agreement or any instrument or document delivered pursuant
to this Agreement, or the validity, protection, interpretation,
collection or enforcement hereof or thereof, or any other claim
or dispute howsoever arising, between the parties hereto WAIVES
TRIAL BY JURY IN CONNECTION WITH ANY SUCH LITIGATION AND ANY
RIGHT IT MAY HAVE TO CLAIM OR RECOVER IN ANY SUCH LITIGATION ANY
SPECIAL, EXEMPLARY, PUNITIVE OR CONSEQUENTIAL DAMAGES OR ANY
DAMAGES OTHER THAN, OR IN ADDITION TO, ACTUAL DAMAGES. EACH
INVESTOR AGREES THAT THIS SECTION 5 IS A SPECIFIC AND
MATERIAL ASPECT OF THIS AGREEMENT AND ACKNOWLEDGE THAT THE OTHER
PARTY WOULD NOT ENTER THIS AGREEMENT IF THIS SECTION 5 WERE
NOT PART OF THIS AGREEMENT. Each party irrevocably consents
to the exclusive jurisdiction of any State or Federal Court
located within the County of Orange, State of California, in
connection with any action or proceeding arising out of or
relating to this Agreement or any document or instrument
delivered pursuant to this Agreement or otherwise. In any such
litigation, each party waives, to the fullest extent it may
effectively do so, personal service of any summons, complaint or
other process and agree that the service thereof may be made by
certified or registered mail directed to such party at its
address for notice determined in accordance with this
Section 5. Each party hereby waives, to the fullest extent
it may effectively do so, the defenses of forum non conveniens
and improper venue.
6. Representation by Counsel. The
Parties acknowledge and agree that they have been represented or
have had the opportunity to be represented by counsel of their
own choice in the negotiations leading to their execution of
this Agreement and that they have read this Agreement. The
Parties further acknowledge that the waivers they made herein
are knowing, conscious and with full appreciation that they are
forever foreclosed from pursuing any of the rights so waived and
that they understand this Agreement and are signing it
voluntarily and without coercion.
2
7. Admissibility of this
Agreement. Each of the parties agrees that
any copy of this Agreement signed by it and transmitted by
facsimile for delivery to the other party shall be admissible in
evidence as the original itself in any judicial or
administrative proceeding, whether or not the original is in
existence.
8. Notices. All notices, demands,
requests, consents, approvals, and other communications required
or permitted hereunder shall be in writing and, unless otherwise
specified herein, shall be (i) personally served,
(ii) deposited in the mail, registered or certified, return
receipt requested, postage prepaid, (iii) delivered by
reputable overnight courier service with charges prepaid, or
(iv) transmitted by hand delivery, electronic mail, or
facsimile, addressed as set forth on the signature page hereto
or to such other address as such party shall have specified most
recently by written notice. Any notice or other communication
required or permitted to be given hereunder shall be deemed
effective (a) upon hand delivery or delivery by electronic
mail or facsimile, with accurate confirmation generated by the
transmitting facsimile machine, at the address or number
designated below (if delivered on a business day during normal
business hours where such notice is to be received), or the
first business day following such delivery (if delivered other
than on a business day during normal business hours where such
notice is to be received) or (b) on the second business day
following the date of mailing by express courier service, fully
prepaid, addressed to such address, or upon actual receipt of
such mailing, whichever shall first occur.
9. Amendments and Modification.
No provision hereof shall be modified, altered,
waived or limited except by written instrument expressly
referring to this Agreement and to such provision, and executed
by the parties hereto.
10. Counterparts/Execution. This
Agreement may be executed in any number of counterparts and by
the different signatories hereto on separate counterparts, each
of which, when so executed, shall be deemed an original, but all
such counterparts shall constitute but one and the same
instrument. This Agreement may be executed by facsimile
signature and delivered electronically.
11. Successors and
Assigns. Whenever in this Agreement reference
is made to any party, such reference shall be deemed to include
the successors, assigns, heirs and legal representatives of such
party. No party hereto may transfer any rights under this
Agreement, unless the transferee agrees to be bound by, and
comply with all of the terms and provisions of this Agreement,
as if an original signatory hereto on the date hereof.
12. Severability. In the event
that any term or provision of this Agreement shall be finally
determined to be superseded, invalid, illegal or otherwise
unenforceable pursuant to applicable law by an authority having
jurisdiction and venue, that determination shall not impair or
otherwise affect the validity, legality or enforceability
(i) by or before that authority of the remaining terms and
provisions of this Agreement, which shall be enforced as if the
unenforceable term or provision were deleted, or (ii) by or
before any other authority of any of the terms and provisions of
this Agreement provided each party is able to receive the
substantial benefit of this Agreement.
13. Entire Agreement. This
Agreement contains the entire agreement of the parties and
supersedes all other agreements and understandings, oral or
written, with respect to the matters contained herein.
[SIGNATURE
PAGE FOLLOWS]
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IN WITNESS WHEREOF, this Agreement has been executed to
be effective as of the date and year first above written. This
Agreement may be executed in counterparts, each of which shall
be deemed an original, but all of which together shall
constitute one and the same instrument. This Agreement may be
executed by facsimile signature, which signature shall be deemed
of the same legal effect as an original hard copy signature.
IRVINE
SENSORS CORPORATION
a Delaware corporation
a Delaware corporation
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By:
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Xxxx Xxxxxx,
President and Chief Executive Officer |
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Address:
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INVESTOR:
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By:
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Name:
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Title:
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Address:
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FORM OF RELEASE OF SECURITY INTEREST
This release of security interest is made and executed by
,
, (the “Secured Party”), in favor of Irvine Sensors Corporation, a
Delaware corporation (“Debtor”).
A. The Secured Party loaned money to Debtor, and Debtor granted the Secured Party a security
interest in all of Debtor’s intellectual property assets to secure indebtedness and obligations of
Debtor to the Secured Party.
B. The Secured Party recorded its security interest as follows:
| Secured | Execution | Recordation | ||||||
| Debtor | Party | Date | Reel/Frame | Date | ||||
Irvine Sensors
Corporation |
NOW, THEREFORE, for valuable consideration received, by its execution of this Release of
Security Interest, the Secured Party hereby irrevocably and unconditionally releases all right,
title and interest in all of the following:
(a) the patents and patent applications listed in Exhibit A (the “Patents”);
(b) all patents and patent applications (i) to which any of the Patents directly or indirectly
claims priority, (ii) for which any of the Patents directly or indirectly forms a basis for
priority, and/or (iii) that directly or indirectly incorporate by reference, or are directly or
indirectly incorporated by reference into, the Patents;
(c) all reissues, reexaminations, extensions, continuations, continuations in part, continuing
prosecution applications, requests for continuing examinations, divisions, registrations of any
item in any of the foregoing categories (a) and (b);
(d) all non-United States patents, patent applications, and counterparts relating to the
Patents or any item in any of the foregoing categories (a) through (c), including, without
limitation, certificates of invention, utility models, industrial design protection, design patent
protection, other governmental grants or issuances, and any rights to apply in any or all countries
of the world for patents, certificates of invention, utility models, industrial design protections,
design patent protections, or governmental grants or issuances of any type related to any of the
Patents and the inventions, invention disclosures, and discoveries therein;
(e) inventions, invention disclosures, and discoveries described in any of the Patents of any
item in the foregoing categories (a) though (d);
(f) all rights to apply in any or all countries of the world for patents, certificates of
invention, utility models, industrial design protections, design patent protections, or other
governmental grants or issuances of any type related to any item in any of the foregoing categories
(a) through (e), including, without limitation, under the Paris Convention for the Protection of
Industrial Property, the International Patent Cooperation Treaty, or any other convention, treaty,
agreement, or understanding;
(g) causes of action (whether known or unknown or whether currently pending, filed, or
otherwise) and other enforcement rights under, or on account of, any of the Patents and/or the
rights described in the above subparagraphs (a) through (f), including, without limitation, all
causes of action and other enforcement rights for
(i) damages,
(ii) injunctive relief, and
(iii) any other remedies of any kind
for past, current and future infringement; and
(h) all rights to collect royalties and other payments under or on account of any of the
Patents and/or any item in any of the foregoing categories (a) through (g).
If necessary or desired, the Secured Party hereby authorizes Debtor’s authorized
representative to file UCC Financing Statement Amendment(s) with the applicable filing office(s) in
order to memorialize the release of any security interest related to the items set forth in
categories (a) through (h) by the Secured Party.
This Release is governed by the law of the State of Delaware, excluding its choice of law
principles to the contrary. This Release shall be binding upon the Secured Party and its
successors and assigns and inures, to the benefit of, with respect to the Patents (including any
purchaser). The Secured Party acknowledges that it is aware that it may hereafter discover facts
different from or in addition to what it now knows, believes or suspects to be true with respect to
the matters herein released, that such facts may give rise to claims, causes of action, damages,
consequences or results that are unforeseen or unsuspected, and that the Secured Party is
nonetheless giving up its rights, and the releases in this Release Agreement will be and remain in
effect in all respects as complete, general releases, notwithstanding any such different or
additional facts.
IN WITNESS WHEREOF, the undersigned has executed this Release of Security Interest on this
day of 2009.
Secured Party
Name:
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Address:
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Title:
(If Applicable)
(If Applicable)
Exhibit A
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
5,235,672 (07/651,477) |
US | 8/10/1993 (2/6/1991) |
Hardware for electronic neural network | |||
| Xxxxxx, Xxxx X. | ||||||
6,389,404 (09/223,476) |
US | 5/14/2002 (12/30/1998) |
Neural processing module with input architectures that make maximal use of a weighted synapse array | |||
| Xxxxxx, Xxxx X.; Xxxxxxxx, Xxxxxx H. | ||||||
6,650,704 (09/427,384) |
US | 11/18/2003 (10/25/1999) |
Method of producing a high quality, high resolution image from a sequence of low quality, low resolution images that are undersampled and subject to jitter | |||
| Xxxxxxx, Xxxxxxxx X.; Xxxxxx, Xxxx X.; Xxxxxxx, Valentine G. | ||||||
6,829,237 (09/973,857) |
US | 12/7/2004 (10/9/2001) |
High speed multi-stage switching network formed from stacked switching layers Xxxxxx, Xxxx X.; Ozguz, Volkan H. | |||
7,082,591 (10/346,363) |
US | 7/25/2006 (1/17/2003) |
Method for effectively embedding various integrated circuits within field programmable gate arrays | |||
| Xxxxxxx, Xxxxxxxx X. | ||||||
6,856,167 (10/347,038) |
US | 2/15/2005 (1/17/2003) |
Field programmable gate array with a variably wide word width memory | |||
| Ozguz, Volkan H.; Xxxxxxx, Xxxxxxxx X.; Xxxx, Xxxxx X.; Xxxx, Xxxx X. | ||||||
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
7,265,579 (11/037,490) |
US | 9/4/2007 (1/18/2005) |
Field programmable gate array incorporating dedicated memory stacks | |||
| Xxxxxxx, Xxxxxxxx Xxxxxx; Ozguz, Volkan; Xxxx, Xxxxx X.; Xxxx, Xxxx X. | ||||||
5,508,836 (08/305,066) |
US | 4/16/1996 (9/13/1994) |
Infrared wireless communication between electronic system components XxXxxx, Xxxxxx; Xxxxxxxx, Xxxxxx H.; Xxxxxxx, Xxxx | |||
5,635,705 (08/526,415) |
US | 6/3/1997 (9/11/1995) |
Sensing and selecting observed events for signal processing | |||
| Xxxxxxxx, Xxxxxx H. | ||||||
6,195,268 (09/031,435) |
US | 2/27/2001 (2/26/1998) |
Stacking layers containing enclosed IC chips | |||
| Xxxx, Xxxxx X. | ||||||
5,045,685 (07/534,969) |
US | 9/3/1991 (6/6/1990) |
Analog to digital conversion on multiple channel IC chips | |||
| Wall, Xxxxxxxxx X. | ||||||
5,104,820 (07/720,025) |
US | 4/14/1992 (6/24/1991) |
Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
5,279,991 (07/996,794) |
US | 1/18/1994 (12/24/1992) |
Method for fabricating stacks of IC chips by segmenting a larger stack | |||
| Xxxxxxx, Xxxxxx X.; Xxxx, Xxxxx X. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
5,432,318 (08/178,923) |
US | 7/11/1995 (1/7/1994) |
Apparatus for segmenting stacked IC chips | |||
| Xxxxxxx, Xxxxxx X. | ||||||
5,304,790 (07/956,914) |
US | 4/19/1994 (10/5/1992) |
Apparatus and system for controllably varying image resolution to reduce data output | |||
| Xxxxxx, Xxxx | ||||||
5,347,428 (07/985,837) |
US | 9/13/1994 (12/3/1992) |
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor xxxx | |||
| Xxxxxx, Xxxx X.; Indin, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
5,406,701 (08/120,675) |
US | 4/18/1995 (9/13/1993) |
Fabrication of dense parallel solder bump connections | |||
| Xxxx, Xxxxx X.; Xxxxxxx, Xxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
5,424,920 (08/232,739) |
US | 6/13/1995 (4/25/1994) |
Non-conductive end layer for integrated stack of IC chips | |||
| Miyake, Xxxxxxx X. | ||||||
5,432,729 (08/255,465) |
US | 7/11/1995 (6/8/1994) |
Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stack | |||
| Xxxxxx, Xxxx X.; Some, Xxxxxxx X. | ||||||
5,581,498 (08/326,645) |
US | 12/3/1996 (10/20/1994) |
Stack of IC chips in lieu of single IC xxxx | |||
| Xxxxxx, Xxxxx X.; Xxxxxxxx, Xxxxxx H.; Some, Xxxxxxx X.; Xxxxxx, Xxxx X. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
5,688,721 (08/62,2671) |
US | 11/18/1997 (3/26/1996) |
3D stack of IC chips having leads reached by vias through passivation covering access plane | |||
| Xxxxxxx, Xxxx X. | ||||||
5,953,588 (08/777,747) |
US | 9/14/1999 (12/21/1996) |
Stackable layers containing encapsulated IC chips |
|||
| Xxxxxx, Xxxxxx N; Xxxxxxxxx, Xxxxx X. | ||||||
6,072,234 (09/316,740) |
US | 6/6/2000 (5/21/1999) |
Stack of equal layer neo-chips containing encapsulated IC chips of different sizes | |||
| Xxxxxx, Xxxxxx X.; Xxxxxxxxx, Xxxxx X. | ||||||
5,955,668 (09/166,458) |
US | 9/21/1999 (10/5/1998) |
Multi-element micro gyro | |||
| Xxx, Xxxx X.; Reeds, III, Xxxx X.; Xxxxxxxx, Xxxxxx H. | ||||||
6,089,089 (09/301,847) |
US | 7/18/2000 (4/29/1999) |
Multi-element micro gyro
Xxx, Xxxx X. |
|||
6,578,420 (09/604,782) |
US | 6/17/2003 (6/26/2000) |
Multi-axis micro gyro structure | |||
| Xxx, Xxxx Wen | ||||||
6,014,316 (09/095,416) |
US | 1/11/2000 (6/10/1998) |
IC stack utilizing BGA contacts | |||
| Xxxx, Xxxxx X. | ||||||
6,028,352 (09/095,415) |
US | 2/22/2000 (6/10/1998) |
IC stack utilizing secondary
leadframes Xxxx, Xxxxx X. |
|||
6,117,704 (09/282,704) |
US | 9/12/2000 (3/31/1999) |
Stackable layers containing encapsulated chips |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| Xxxxxxxxx, Xxxxx X.; Ozguz, Volkan H.; Xxxxxx, Xxxxxx X. | ||||||
6,476,392 (09/853,819) |
US | 11/5/2002 (5/11/2001) |
Method and apparatus for temperature compensation of an uncooled focal plane array | |||
| Xxxxxxx, Xxxxxxx X.; Xxxxxx, Xxxxxxxx X.; Xxxxxxxx, Xxxxxxx X. | ||||||
6,891,160 (10/281,393) |
US | 5/10/2005 (10/25/2002) |
Method and apparatus for temperature compensation of an uncooled focal plane array | |||
| Xxxxxxx, Xxxxxxx X.; Xxxxxx, Xxxxxxxx X.; Xxxxxxxx, Xxxxxxx X. | ||||||
7,235,785 (11/048,634) |
US | 6/26/2007 (1/31/2005) |
Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array | |||
| Xxxxxxxx, Xxxx; Xxxxxxx, Xxxx; Xxxx, W. Xxxx; Xxxxxxx, Xxxxx | ||||||
6,596,997 (09/921,525) |
US | 7/22/2003 (8/3/2001) |
Retro-reflector warm stop for uncooled thermal imaging cameras and method of using the same | |||
| Xxxxxxx, Xxxxxxx X. | ||||||
6,706,971 (10/142,557) |
US | 3/16/2004 (5/10/2002) |
Stackable microcircuit layer formed from a plastic encapsulated microcircuit | |||
| Xxxxxx, Xxxxxxx X.; Xxxx, Xxxxx X. | ||||||
7,174,627 (10/338,974) |
US | 2/13/2007 (1/9/2003) |
Method of fabricating known good dies from packaged integrated circuits |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| Xxxx, Xxxxx X. | ||||||
6,560,109 (09/949,024) |
US | 5/6/2003 (9/7/2001) |
Stack of multilayer modules with heat-focusing metal layer | |||
| Xxxxxxxxx, Xxxxx Satsuo; Xxxx, Xxxxx Antonio; Ozguz, Volkan H.; Camien, Xxxxxx Xxxxxx | ||||||
6,717,061 (09/949,512) |
US | 4/6/2004 (9/7/2001) |
Stacking of multilayer modules | |||
| Xxxxxxxxx, Xxxxx Satsuo; Xxxx, Xxxxx Xxxxxxx; Ozguz, Volkan H.; Camien, Xxxxxx Xxxxxx | ||||||
6,734,370 (09/948,950) |
US | 5/11/2004 (9/7/2001) |
Multilayer modules with flexible substrates | |||
| Xxxxxxxxx, Xxxxx Satsuo; Xxxx, Xxxxx Xxxxxxx; Ozguz, Volkan H.; Camien, Xxxxxx Xxxxxx | ||||||
7,127,807 (10/431,914) |
US | 10/31/2006 (5/7/2003) |
Process of manufacturing multilayer modules | |||
| Xxxxxxxxx, Xxxxx Satsuo; Xxxx, Xxxxx Xxxxxxx; Ozguz, Volkan H.; Camien, Xxxxxx Xxxxxx | ||||||
6,797,537 (09/938,686) |
US | 9/28/2004 (10/30/2001) |
Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers | |||
| Xxxx, Xxxxx Antonio; Xxxxxxxxx, Xxxxx Satsuo | ||||||
6,784,547 (10/302,680) |
US | 8/31/2004 (11/21/2002) |
Stackable layers containing encapsulated integrated circuit chips with one or more |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| overlying interconnect layers | ||||||
| Xxxx, Xxxxx Antonio; Xxxxxxxxx, Xxxxx Satsuo | ||||||
7,239,012 (10/951,990) |
US | 7/3/2007 (9/28/2004) |
Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers | |||
| Xxxx, Xxxxx; Xxxxxxxxx, Xxxxx | ||||||
6,806,559 (10/128,728) |
US | 10/19/2004 (4/22/2002) |
Method and apparatus for connecting
vertically stacked integrated circuit
chips Xxxx, Xxxxx X.; Xxxxxx, Xxxxxxx X. |
|||
6,912,862 (10/615,641) |
US | 7/5/2005 (7/8/2003) |
Cryopump piston position tracking Xxxxx, Xxxxxx | |||
6,967,411 (10/360,244) |
US | 11/22/2005 (2/7/2003) |
Stackable layers containing ball grid array packages Xxxx, Xxxxx X. | |||
7,242,082 (11/229,351) |
US | 6/10/2007 (9/15/2005) |
Stackable layer containing ball grid array package Xxxx, Xxxxx | |||
6,993,835 (10/726,888) |
US | 2/7/2006 (12/4/2003) |
Method for electrical interconnection
of angularly disposed conductive
patterns Xxxxxx, Xxxxxxx Xxxxxx |
|||
6,998,328 (10/701,783) |
US | 2/14/2006 (11/5/2003) |
Method for creating neo-wafers from
singulated integrated circuit die and
a device made according to the method Xxxxx, Xxxxxxxx Xxxxxxx |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
7,417,323 (10/703,177) |
US | (11/6/2003) | Neo-wafer device and
method Sambo S. He |
|||
7,198,965 (11/354,370) |
US | 4/3/2007 (2/14/2006) |
Method for making a neo-layer comprising embedded discrete components | |||
| He, Sambo | ||||||
7,180,579 (10/806,037) |
US | 2/20/2007 (3/22/2004) |
Three-dimensional imaging processing module incorporating stacked layers containing microelectronic circuits | |||
| Xxxxxx, Xxxxx X.; Xxxxxxx, Xxxx X.; Xxxxxxxxx, Xxxxxxx; Xxx, Xxxx; Xxxxxxx, Xxxxxxxxx | ||||||
7,436,494 (11/706,724) |
US | 10/14/2008 (2/15/2007) |
Three-dimensional lanar
module with alignment
refernce insert circuitry
Xxxxxx, Xxxxx X.; Xxxxxxx, Xxxx X.; Xxxxxxxxx, Xxxxxxx; Xxx, Xxxx; Xxxxxxx, Xxxxxxxxx |
|||
7,335,576 (11/197,828) |
US | 2/26/2008 (8/5/2005) |
Method for precision integrated circuit die singulation using differential etch rates | |||
| Xxxxx, Xxxxxx; Xxxxxxxxx, Xxxxx; Xxxxx, Xxxxxx; Xxxx, W. Xxxx | ||||||
7,380,459 (11/654,292) |
US | 6/3/2008 (1/16/2007) |
Absolute pressure sensor | |||
| Xxxxx, Xxxxxx | ||||||
09/949,203
|
US | 9/7/2001 | Method of manufacturing multilayer modules | |||
| Xxxxx Satsuo Yamaguchi; Angel Xxxxxxx Xxxx; Volkan |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| H. Ozguz; Xxxxxx Xxxxxx Xxxxxx | ||||||
10/968,572
|
US | 10/19/2004 | Vertically stacked pre-packaged integrated circuit chips | |||
| Xxxxx Xxxx; Xxxxxxx X. Xxxxxx | ||||||
7,440,449 (10/960,712) |
US | 10/6/2004 | High speed switching module comprised of stacked layers incorporating T-connect structures | |||
| Xxxx X. Xxxxxx; Volkan H. Orguz | ||||||
11/977,447
|
US | Inventorship not available | ||||
11/897,938
|
US | Inventorship not available | ||||
11/825,643
|
US | 7/7/2007 | Inventorship not available | |||
11/807,671
|
US | Inventorship not available | ||||
11/731,154
|
US | Inventorship not available | ||||
11/644,438
|
US | 12/22/2006 | Method for making stacked integrated circuits (ICs) using prepackaged parts | |||
| Xxxxx X. Xxxx | ||||||
11/524,090
|
US | 9/20/2006 | Stackable tier structure comprising high density feedthrough | |||
| Volkan Ozguz; Xxxxxxxx Xxxxx | ||||||
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
11/511117
|
US | 8/26/2006 | MEMS cooling device | |||
| Xxxxxx Xxxxx | ||||||
11/499,403
|
US | 8/4/2006 | High density interconnect assembly comprising stacked electronic module | |||
| Xxxx X. Xxxxxxx | ||||||
11/441908
|
US | 5/26/2006 | Stackable tier structure comprising prefabricated high density feedthrough | |||
| Volkan Ozguz; Xxxxxxxx Xxxxx | ||||||
11/429,468
|
US | Inventorship not available | ||||
11/415,891
|
US | 5/1/2006 | Low power electronic circuit incorporating real time clock | |||
| Xxxx Xxxxxxxx | ||||||
10/339,023
|
US | 1/9/2003 | Method for making stacked
integrated circuits (ICs)
using prepackaged
parts Xxxxx X. Xxxx |
|||
11/350,974
|
US | 2/8/2006 | Stacked ball grid array package module utilizing one or more interposer layers | |||
| Xxxxxxx X. Xxxx; Xxxxxx Xxxxxxxx | ||||||
11/302,480
|
US | 12/12/2005 | Neo-wafer device comprised of multiple singulated integrated circuit die | |||
| Xxxxx Xxxxxxxx | ||||||
11/301645
|
US | 12/12/2005 | Cornerbond assembly comprising three-dimensional electronic modules |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| Xxxxxx Xxxxxxx | ||||||
11/259,683
|
US | 10/25/2005 | Stacked microelectronic layer and module with three-axis channel T-connects | |||
| Xxxxx X. Xxxx; W. Xxxx Xxxx | ||||||
11/248,659
|
US | 10/11/2005 | Anti-tamper module | |||
| Xxxxxx X. Xxxxx; Xxxx Xxxx | ||||||
10/178,390
|
US | 6/24/2002 | Video event capture, storage and processing method and apparatus | |||
| Xxxxxxxx X. Xxxxxxx | ||||||
60/993,689
|
US | Inventorship not available | ||||
11/150712
|
US | 6/10/2005 | Stackable semiconductor chip layer comprising prefabricated trench interconnect vias | |||
| W. Xxxx Xxxx; Xxxxx Xxxx; Xxxxx Xxxxxxxxx; Xxxxxx Xxxxx; Xxxxxx Xxxxxx; Xxxxxxx Xxxxxx | ||||||
11/062,507
|
US | 2/22/2005 | BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same | |||
| Xxxx Xxxxx; Xxxxxxx X. Xxxx | ||||||
12/008,253
|
US | Inventorship not available | ||||
61/007,497
|
US | Inventorship not available |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
TR1596433 (TR04394026.1) |
TR | 1/2/2008 (5/12/2004) |
A method for creating neo-wafers from singulated integrated circuit die and a device made according to the method | |||
| Xxxxx, Xxxxxxxx Xxxxxxx | ||||||
SK1596433 (SK04394026.1) |
SK | 1/2/2008 (5/12/2004) |
A method for creating neo-wafers from singulated integrated circuit die and a device made according to the method | |||
| Xxxxx, Xxxxxxxx Xxxxxxx | ||||||
SE0570479 (SE92905662.0) |
SE | 10/10/2001 (1/29/1992) |
Hardware for electronic neural network | |||
| Xxxxxx, Xxxx X. | ||||||
SE83902618.4
|
SE | 7/25/1983 | Multiplexer circuitry for
high density analog signals Inventorship not available |
|||
NL0570479 (NL92905662.0) |
NL | 10/10/2001 (1/29/1992) |
Hardware for electronic neural network | |||
| Xxxxxx, Xxxx X. | ||||||
NL83902618.4
|
NL | 7/25/1983 | Multiplexer circuitry for
high density analog signals Inventorship not available |
|||
JP2098125 (JP12-505387) |
JP | 11/20/1985 | Apparatus and method for
fabricating modules Inventorship not available |
|||
JP2098125 (JP12-2098125) |
JP | 10/20/1987 | High-density electronic modules, process and product |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| Inventorship not available | ||||||
JP2005-507894
|
JP | 1/16/2006 | Stackable layers containing
ball grid array packages Inventorship not available |
|||
JP2006-286556
|
JP | 10/20/2006 | Stackable tier structure
comprising high density
feedthrough Volkan Ozguz; Xxxxxxxx Xxxxx |
|||
JP2000-591490
|
JP | 12/30/1999 | Neural processing module with
input architectures that make
maximal use of a weighted
synapse array Xxxxxx, Xxxx X.; Xxxxxxxx, Xxxxxx H. |
|||
JP3308265 (JP12-554175) |
JP | 6/10/1999 | IC stack utilizing flexible
circuits with BGA contacts Xxxx, Xxxxx X. |
|||
XX0000000 (JP12-553982) |
JP | 6/10/1999 | IC stack utilizing secondary
leadframes Xxxx, Xxxxx X. |
|||
JP3544974 (JP06-0502691) |
JP | 5/5/1993 | Non-conductive end layer for
integrated stack of IC chips Miyake, Xxxxxxx X. |
|||
JP3354937 (JP06-524367) |
JP | 4/19/1994 | Electronic module comprising a
stack of IC chips Xxxxxx, Xxxx X.; Some, Xxxxxxx X. |
|||
IT1097467
(IT99928571.1)
|
IT | 11/2/2006 (6/10/1993) |
IC stack utilizing secondary
leadframes Xxxx, Xxxxx X. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
IT1596433
(IT04394026.1)
|
IT | 1/2/2008 (5/12/2004) |
A method for creating
neo-wafers from singulated
integrated circuit die and a
device made according to the
method Xxxxx, Xxxxxxxx Xxxxxxx |
|||
IE1596433
(IE04394026.1)
|
IE | 1/2/2008 (5/12/2004) |
A method for creating
neo-wafers from singulated
integrated circuit die and a
device made according to the
method Xxxxx, Xxxxxxxx Xxxxxxx |
|||
GB0570479
(GB92905662.0)
|
GB | 10/10/2001 (1/29/1992) |
Hardware for electronic neural
network Xxxxxx, Xxxx X. |
|||
XX0000000
(GB99928571.1)
|
GB | 11/2/2006 (6/10/1993) |
IC stack utilizing secondary
leadframes Xxxx, Xxxxx X. |
|||
GB1596433
(GB04394026.1)
|
GB | 1/2/2008 (5/12/2004) |
A method for creating
neo-wafers from singulated
integrated circuit die and a
device made according to the
method Xxxxx, Xxxxxxxx Xxxxxxx |
|||
GB83902618.4
|
GB | 7/25/1983 | Multiplexer circuitry for high
density analog signals Inventorship not available |
|||
GB05996075
(GB93911250.4)
|
GB | 8/22/2001 (5/5/1993) |
Non-conductive end layer for
integrated stack of IC chips Miyake, Xxxxxxx X. |
|||
GB0683968
(GB94903352.6)
|
GB | 10/24/2002 (12/1/1993) |
Module comprising IC memory stack dedicated to and structurally combined with an |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| IC microprocessor xxxx Xxxxxx, Xxxx X.; Indin, Xxxxxx X.; Xxxxxxx, Xxxxxx X. |
||||||
GB0695494
(GB94915397.7)
|
GB | 2/24/2001 (4/19/1994) |
Electronic module comprising a
stack of IC chips Xxxxxx, Xxxx X.; Some, Xxxxxxx X. |
|||
GB0713609
(GB94925876.8)
|
GB | 5/7/2003 (8/12/1994) |
Stack of IC chips as substitute for single IC xxxx Xxxxxx, Xxxxx X.; Xxxxxxxx, Xxxxxx H.; Some, Xxxxxxx X.; Xxxxxx, Xxxx X. | |||
GB067087
(GB94909418.9)
|
GB | (12/16/1993) | Fabricating stacks of ic chips
by segmenting a larger stack XXXXXXX XXXXXX A; XXXX XXXXX A |
|||
FR1097467
(FR99928571.1)
|
FR | 11/2/2006 (6/10/1993) |
IC stack utilizing secondary
leadframes Xxxx, Xxxxx X. |
|||
FR1596433
(FR04394026.1)
|
FR | 1/2/2008 (5/12/2004) |
A method for creating
neo-wafers from singulated
integrated circuit die and a
device made according to the
method Xxxxx, Xxxxxxxx Xxxxxxx |
|||
FR83902618.4
|
FR | 7/25/1983 | Multiplexer circuitry for high
density analog signals Inventorship not available |
|||
FR05996075
(FR93911250.4)
|
FR | 8/22/2001 (5/5/1993) |
Non-conductive end layer for
integrated stack of IC chips Miyake, Xxxxxxx X. |
|||
FR0683968
|
FR | 10/24/2002 | Module comprising IC |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
(FR94903352.6)
|
(12/1/1993) | memory
stack dedicated to and
structurally combined with an
IC microprocessor xxxx Xxxxxx, Xxxx X.; Indin, Xxxxxx X.; Xxxxxxx, Xxxxxx X. |
||||
FR0695494
(FR94915397.7)
|
FR | 2/24/2001 (4/19/1994) |
Electronic module comprising a
stack of IC chips Xxxxxx, Xxxx X.; Some, Xxxxxxx X. |
|||
FR0713609
(FR94925876.8)
|
FR | 5/7/2003 (8/12/1994) |
Stack of IC chips as
substitute for single IC xxxx Xxxxxx, Xxxxx X.; Xxxxxxxx, Xxxxxx H.; Some, Xxxxxxx X.; Xxxxxx, Xxxx X. |
|||
EP02705988.0
|
EP | 1/25/2002 | A stackable microcircuit layer
formed from a plastic
encapsulated microcircuit and
method of making the same Xxxxxx, Xxxxxxx X.; Xxxx, Xxxxx X. |
|||
EP06255467.0
|
EP | 10/24/2006 | Stackable tier structure
comprising high density
feedthrough Volkan Ozguz; Xxxxxxxx Xxxxx |
|||
EP1097467
(EP99928571.1)
|
EP | 11/2/2006 (6/10/1993) |
IC stack utilizing secondary
leadframes Xxxx, Xxxxx X. |
|||
EP1596433
(EP04394026.1)
|
EP | 1/2/2008 (5/12/2004) |
A method for creating
neo-wafers from singulated
integrated circuit die and a
device made according to the
method Xxxxx, Xxxxxxxx Xxxxxxx |
|||
EP03818224.2
|
EP | 08/8/203 | Stackable layers containing |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| ball grid array packages Xxxx, Xxxxx X. |
||||||
EP99967712.3
|
EP | 12/30/1999 | Neural processing module with
input architectures that make
maximal use of a weighted
synapse array Xxxxxx, Xxxx X.; Xxxxxxxx, Xxxxxx H. |
|||
EP99928570.3
|
EP | 6/10/1993 | IC stack utilizing flexible
circuits with BGA contacts Xxxx, Xxxxx X. |
|||
EP02805694.3
|
EP | 7/16/2002 | Wearable biomonitor with
flexible thinned integrated
circuit Ogzuz, Volkhan H; Khashayar, Abbas |
|||
EP05996075
(EP93911250.4)
|
EP | 8/22/2001 (5/5/1993) |
Non-conductive end layer for integrated stack of IC chips Miyake, Xxxxxxx X. | |||
EP02789292.6
|
EP | 10/25/2002 | Stackable layers containing
encapsulated integrated
circuit chips with one or more
overlying interconnect layers
and a method of making the
same Xxxx, Xxxxx Antonio; Xxxxxxxxx, Xxxxx Satsuo |
|||
EP02798173.7
|
EP | 9/9/2002 | Stacking of multilayer modules Xxxxxxxxx, Xxxxx Satsuo; Xxxx, Xxxxx Xxxxxxx; Ozguz, Volkan H.; Camien, Xxxxxx Xxxxxx |
|||
EP05111589.7
|
EP | 12/1/2005 | BGA-scale stacks comprised |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| of
layers containing integrated
circuit die and a method for
making the same Xxxx Xxxxx; Xxxxxxx X. Xxxx |
||||||
EP95935157.8
|
EP | 9/27/1995 | Infrared wireless
communication between
electronic system components XxXxxx, Xxxxxx; Xxxxxxxx, Xxxxxx H.; Xxxxxxx, Xxxx |
|||
EP03721978.9
|
EP | 4/22/2003 | Method and apparatus for
connecting vertically stacked
integrated circuit chips Xxxx, Xxxxx X.; Xxxxxx, Xxxxxxx X. |
|||
DE69232116 (DE69232116) |
DE | 10/10/2001 (1/29/1992) |
Hardware for electronic neural
network Xxxxxx, Xxxx X. |
|||
DE69330630 (DE69330630) |
DE | 8/22/2001 (5/5/1993) |
Non-conductive end layer for
integrated stack of IC chips Miyake, Xxxxxxx X. |
|||
DE69426695 (DE69426695) |
DE | 2/24/2001 (4/19/1994) |
Electronic module comprising a
stack of IC chips Xxxxxx, Xxxx X.; Some, Xxxxxxx X. |
|||
DE60200401 (DE60200401) |
DE | 1/2/2008 (5/12/2004) |
A method for creating
neo-wafers from singulated
integrated circuit die and a
device made according to the
method Xxxxx, Xxxxxxxx Xxxxxxx |
|||
DE83902618.4
|
DE | 7/25/1983 | Multiplexer circuitry for high density analog signals |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
| Inventorship not available | ||||||
PCT/US00/029448
|
WO | 10/25/2000 | SYSTEM AND METHODS FOR
PRODUCING HIGH RESOLUTION
IMAGES FROM A VIDEO SEQUENCE
OF LOWER RESOLUTION IMAGES XXXXXXX XXXXXXXX S; XXXXXX XXXX L; XXXXXXX XXXXXXXX G |
|||
PCT/US92/005348
|
WO | 6/24/1992 | Fabricating electronic
circuitry unit containing
stacked IC layers having lead
rerouting Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. |
|||
PCT/US03/004462
|
WO | 5/5/1993 | Non-conductive end layer for
integrated stack of IC chips Miyake, Xxxxxxx X. |
|||
PCT/US99/013171
|
WO | 6/10/1999 | IC stack utilizing flexible
circuits with BGA contacts Xxxx, Xxxxx X. |
|||
PCT/US06/008920
|
WO | 3/10/2006 | Method for making a neo-layer
comprising embedded discrete
components He, Sambo |
|||
PCT/US06/039915
|
WO | 8/26/2006 | MEMS cooling device Xxxxxx Xxxxx |
|||
PCT/US01/031583
|
WO | 10/9/2001 | High speed switching module
comprised of stacked layers
incorporating T-connect
structures Xxxx X. Xxxxxx; Xxxxxx X. Orguz |
|||
PCT/US02/002276
|
WO | 1/25/2002 | A stackable microcircuit layer
formed from a plastic
encapsulated microcircuit and
method of making the same Xxxxxx, Xxxxxxx X.; Xxxx, Xxxxx X. |
|||
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
PCT/US02/006848
|
WO | 3/4/2002 | Retro-reflector warm stop for
uncooled thermal imaging
cameras and method of using
the same Xxxxxxx, Xxxxxxx X. |
|||
PCT/US02/022617
|
WO | 7/16/2002 | Wearable biomonitor with
flexible thinned integrated
circuit Ogzuz, Volkhan H; Khashayar, Abbas |
|||
PCT/US02/028628
|
WO | 9/9/2002 | Stacking of multilayer modules Xxxxxxxxx, Xxxxx Satsuo; Xxxx, Xxxxx Antonio; Ozguz, Volkan H.; Camien, Xxxxxx Xxxxxx |
|||
PCT/US02/034339
|
WO | 10/25/2002 | Stackable layers containing
encapsulated integrated
circuit chips with one or more
overlying interconnect layers
and a method of making the
same Xxxx, Xxxxx Antonio; Xxxxxxxxx, Xxxxx Satsuo |
|||
PCT/US02/19779
|
WO | 6/24/2002 | Video event capture, storage
and processing method and
apparatus Xxxxxxxx X. Xxxxxxx |
|||
PCT/US03/009190
|
WO | 9/27/1993 | Fabrication of dense parallel
solder bump connections Xxxx, Xxxxx X.; Xxxxxxx, Xxxxx X.; Xxxxxxx, Xxxxxx X. |
|||
PCT/US03/013569
|
WO | 4/22/2003 | Method and apparatus for
connecting vertically stacked
integrated circuit chips Xxxx, Xxxxx X.; Xxxxxx, Xxxxxxx X. |
|||
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
PCT/US03/024706
|
WO | 08/08/2003 | Stackable layers containing
ball grid array packages Xxxx, Xxxxx X. |
|||
PCT/US83/01142
|
WO | 7/25/1983 | Multiplexer circuitry for high density analog signals | |||
PCT/US88/003084
|
WO | 9/8/1988 | Bonding of aligned conductive
bumps on adjacent surfaces Go, Tiong C. |
|||
PCT/US92/000780
|
WO | 1/29/1992 | Hardware for electronic neural
network Xxxxxx, Xxxx X. |
|||
PCT/US92/003705
|
WO | 6/28/1990 | Fabricating electronic
circuitry unit containing
stacked IC layers having lead
rerouting Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. |
|||
PCT/US93/009470
|
WO | 10/5/1993 | Apparatus and system for
controllably varying image
resolution to reduce data
output Xxxxxx, Xxxx |
|||
PCT/US93/011601
|
WO | 12/1/1993 | Module comprising IC memory
stack dedicated to and
structurally combined with an
IC microprocessor xxxx Xxxxxx, Xxxx X.; Indin, Xxxxxx X.; Xxxxxxx, Xxxxxx X. |
|||
PCT/US93/012268
|
WO | 12/16/1993 | Fabricating stacks of ic chips
by segmenting a larger stack XXXXXXX XXXXXX A; XXXX XXXXX A |
|||
PCT/US94/004322
|
WO | 4/19/1994 | Electronic module comprising a
stack of IC chips Xxxxxx, Xxxx X.; Some, Xxxxxxx X. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
PCT/US94/009186
|
WO | 8/12/1994 | Stack of IC chips as substitute
for single IC xxxx Xxxxxx, Xxxxx X.; Xxxxxxxx, Xxxxxx H.; Some, Xxxxxxx X.; Xxxxxx, Xxxx X. |
|||
PCT/US95/002851
|
WO | 3/7/1995 | 3D stack of IC chips having leads
reached by vias through
passivation covering access plane Xxxxxxx, Xxxx X. |
|||
PCT/US95/012378
|
WO | 9/27/1995 | Infrared wireless communication
between electronic system
components XxXxxx, Xxxxxx; Xxxxxxxx, Xxxxxx H.; Xxxxxxx, Xxxx |
|||
PCT/US96/000746
|
WO | 1/22/1996 | Stackable modules and
multimodular assemblies Xxxxxx, Xxxx X.; XxXxxx, Xxxxxx X.; Xxx, Xxxx; Miyake, Xxxxxxx X. |
|||
PCT/US96/014610
|
WO | 9/11/1996 | SENSING AND SELECTING OBSERVED
EVENTS FOR SIGNAL PROCESSING XXXXXXXX XXXXXX H |
|||
PCT/US98/021798
|
WO | 10/14/1998 | Multi-element micro gyro Xxx, Xxxx Wen |
|||
PCT/US98/023929
|
WO | 11/10/1998 | Method for thinning semiconductor
wafers with circuits and wafers
made by the same Xxxxxx, Xxxxxxx; Ogzuz Volkhan H |
|||
PCT/US98/095415
|
WO | 6/10/1999 | IC stack utilizing secondary
leadframes Xxxx, Xxxxx X. |
|||
PCT/US99/001734
|
WO | 3/23/1990 | Analog to digital conversion
incorporated in Z-technology
module Wall, Xxxxxxxxx X. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
PCT/US99/004211
|
WO | 2/25/1999 | STACKING LAYERS CONTAINING
ENCLOSED IC CHIPS XXXX XXXXX |
|||
PCT/US99/031124
|
WO | 12/30/1999 | Neural processing module with input architectures that make maximal use of a weighted synapse array | |||
| Xxxxxx, Xxxx X.; Xxxxxxxx, Xxxxxx H. | ||||||
WO1998US21798
|
WO | 10/14/1998 | Multi-element micro gyro | |||
| Xxx, Xxxx Wen | ||||||
07/329,003
|
US | 3/27/1989 | Analog to digital conversion on multiple channel IC chips | |||
| Wall, Xxxxxxxxx X. | ||||||
07/377,241
|
US | 7/7/1989 | Inventorship not available | |||
07/884,719
|
US | 5/15/1992 | Method for fabricating stacks of IC chips by segmenting a larger stack | |||
| Xxxxxxx, Xxxxxx X.; Xxxx, Xxxxx X. | ||||||
07/884660
|
US | 5/15/1992 | Non-conductive end layer for integrated stack of IC chips | |||
| Miyake, Xxxxxxx X. | ||||||
07/955461
|
US | 10/2/1992 | Fabrication of dense parallel solder bump connections | |||
| Xxxxxx Xxxxxxx | ||||||
08/052,475
|
US | 4/23/1993 | Electronic module comprising a
stack of IC chips each
interacting with an IC chip
secured to the stack face Xxxxxx, Xxxx X.; Some, Xxxxxxx X. |
|||
08/106,909
|
US | 8/13/1993 | Inventorship not available | |||
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
08/213,149
|
US | 3/15/1994 | 3D stack of IC chips having leads reached by vias through passivation covering access plane | |||
| Xxxxxxx, Xxxx X. | ||||||
08/870,812
|
US | 6/6/1997 | Multi-element micro gyro | |||
| Xxx, Xxxx X.; Reeds, III, Xxxx X.; Xxxxxxxx, Xxxxxx H. | ||||||
08/943,305
|
US | 10/14/1997 | Multi-element micro gyro | |||
| Xxx, Xxxx X.; Reeds, III, Xxxx X.; Xxxxxxxx, Xxxxxx H. | ||||||
09/190,378
|
US | 11/10/1998 | Method for thinning semiconductor wafers with circuits and wafers made by the same | |||
| Xxxxxx, Xxxxxxx | ||||||
09/770,864
|
US | 1/26/2001 | Method of making a stackable microcircuit layer from a plastic encapsulated microcircuit | |||
| Xxxxxxx X. Xxxxxx; Xxxxx X. Xxxx | ||||||
10/197,006
|
US | 7/16/2002 | Wearable biomonitor with flexible thinned integrated circuit | |||
| Ogzuz, Volkhan H; Khashayar, Abbas | ||||||
10/663,371
|
US | Stacked microelectronic module
with vertical interconnect
vias Ogzuz, Volkhan H; |
||||
10/805,849
|
US | 3/22/2004 | Three-dimensional imaging device incorporating stacked layers containing microelectronic circuits | |||
| Xxxxx X. Xxxxxx; Xxxx X. Xxxxxxx; Xxxxxxxxx Xxxxxxx | ||||||
11/003,429
|
US | 12/6/2004 | Wearable biomonitor with flexible thinned integrated circuit | |||
| Ogzuz, Volkhan H; Khashayar, Abbas |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
60/036,759
|
US | 1/28/1997 | Multi-element micro gyro | |||
| Xxx, Xxxx X.; Reeds, III, Xxxx X.; Xxxxxxxx, Xxxxxx H. | ||||||
60/049,025
|
US | 6/9/1997 | Stacking layers containing enclosed IC chips | |||
| Xxxx, Xxxxx X. | ||||||
60/049,026
|
US | 6/9/1997 | Stacking layers containing
enclosed IC chips Xxxx, Xxxxx X. |
|||
60/049,582
|
US | 6/13/1997 | IC stack utilizing BGA contacts | |||
| Xxxx, Xxxxx X. | ||||||
60/065,088
|
US | |||||
60/238,797
|
US | 10/6/2000 | High speed data switch with traverse-mated stacks containing superconducting electronics | |||
| Xxxx Xxxxxx | ||||||
60/274,120
|
US | |||||
60/305,353
|
US | Biomonitor device | ||||
| Ogzuz, Volkhan H | ||||||
60/346,494
|
US | 1/9/2002 | Low cost miniature computer and
methods for making same
Xxxx, Xxxxx |
|||
60/348,852
|
US | 1/17/2002 | Field programmable gate array structure incorporating high density support circuitry and method for making same | |||
| Ozguz, Volkan H.; | ||||||
60/354,442
|
US | 2/7/2002 | BGA layer and assembly and method for making same | |||
| Xxxx, Xxxxx X. | ||||||
60/355,955
|
US | 2/12/2002 | Stacked BGA assembly Xxxx, Xxxxx X. |
|||
60/394,167
|
US | 7/8/2002 | Cryopump piston position tracking using an encoder | |||
| Xxxxx, Xxxxxx | ||||||
60/410,895
|
US | Wearable biomonitor with flexible thinned integrated circuit | ||||
| Ogzuz, Volkhan H; Khashayar, Abbas |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
60/424,022
|
US | NEO-wafers and NEO-chips, device and method | ||||
| Sambo S. He | ||||||
60/424,025
|
US | 11/6/2002 | Creating wafers from singulated die | |||
| Xxxxx, Xxxxxxxx Xxxxxxx | ||||||
60/462,677
|
US | 3/28/2003 | High-speed transmitter and receiver incorporating three-dimensional readout electronic module | |||
| Xxxxx X. Xxxxxx; | ||||||
60/546,598
|
US | 2/20/2004 | BGA-scale stacks comprised of thin small outline packages and method for making the same | |||
| Xxxx Xxxxx; Xxxxxxx X. Xxxx | ||||||
60/617,356
|
US | 10/8/2004 | Anti-tamper module | |||
| Xxxxxx X. Xxxxx; Xxxx Xxxx | ||||||
60/652,777
|
US | 2/14/2005 | Stacked ball grid array package module utilizing one or more interposer layers | |||
| Xxxxxxx X. Xxxx; Xxxxxx Xxxxxxxx | ||||||
60/678,618
|
US | 5/5/2005 | GPS incorporating low power real time clock circuitry | |||
| Xxxxxx Xxxxx | ||||||
60/684,372
|
US | 5/26/2005 | Stackable layers of encapsulated integrated circuit chips interconnected with prefabricated via structures | |||
| Volkan Ozguz; Xxxxxxxx Xxxxx | ||||||
60/710,717
|
US | 8/24/2005 | Surface trenched stackable layers | |||
| Xxxxx Xxxx; Xxxxxxx X. Xxxxxx |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
60/711,375
|
US | 8/26/2005 | High density interconnect scheme for stacked electronic modules | |||
| Xxxx X. Xxxxxxx | ||||||
60/711,376
|
US | 8/26/2005 | MEMS cooling device | |||
| Xxxxxx Xxxxx | ||||||
60/758,922
|
US | 1/17/2006 | Absolute pressure sensor Xxxxx, Xxxxxx | |||
60/628,742
|
US | 11/18/2004 | Interface optimization of high density interconnects | |||
| Xxxxxxxx Xxxxx | ||||||
60/617,426
|
US | 10/8/2004 | Interface optimization of high density interconnects | |||
| Xxxxxxxx Xxxxx | ||||||
RE33331 (07/336,017) |
US | 9/11/1990 (4/10/1989) |
Multiplexer circuitry for high density analog signals | |||
| Inventorship not available | ||||||
4,490,626 (06/403,004) |
US | 12/25/1984 (7/29/1982) |
Multiplexer circuitry for high density analog signals | |||
| Xxxxxxx, Xxxxxxxx X. | ||||||
4,912,545 (07/097,797) |
US | 3/27/1990 (9/16/1987) |
Bonding of aligned conductive bumps on adjacent surfaces | |||
| Go, Tiong C. | ||||||
4,983,533 (07/114,415) |
US | 1/8/1991 (10/28/1987) |
High-density electronic modules — process and product | |||
| Go, Tiong C. | ||||||
4,290,844 (06/015070) |
US | 9/22/1981 (2/26/1979) |
Focal plane photo-detector mosaic array fabrication | |||
| Xxxxxxxxx, Xxxxx X.; Xxxxxxx, Xxxxx |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
4,304,624 (05/855242) |
US | 12/8/1981 (11/28/1977) |
Method of fabricating a multi-layer structure for detector array module | |||
| Xxxxxx, Xxxx X.; Xxxxxxxx, Xxxx X. | ||||||
4,352,715 (06/206993) |
US | 10/5/1982 (11/17/1980) |
Detector array module fabrication | |||
| Xxxxxx, Xxxx X.; Xxxxxxxx, Xxxx X. | ||||||
4,354,107 (06/206994) |
US | 10/12/1982 (11/14/1980) |
Detector array module-structure
and fabrication Xxxxxx, Xxxx X.; Xxxxxxxx, Xxxx X. |
|||
4,403,238 (06/213933) |
US | 9/6/1983 (12/8/1980) |
Detector array focal plane configuration | |||
| Xxxxx, Xxxxxxx X. | ||||||
4,449,044 (06/262296) |
US | 5/15/1984 (5/11/1981) |
Focal plane photo-detector mosaic array apparatus | |||
| Xxxxxxxxx, Xxxxx X.; Xxxxxxx, Xxxxx | ||||||
4,525,921 (06/517221) |
US | 7/2/1985 (7/25/1983) |
High-density electronic processing package-structure and fabrication | |||
| Xxxxxx, Xxxx X.; Xxxxx, Xxxxxxx X. | ||||||
4,551,629 (06/572802) |
US | 11/5/1985 (1/23/1984) |
Detector array module-structure and fabrication | |||
| Xxxxxx, Xxxx X.; Xxxxx, Xxxxxxx X. | ||||||
4,555,623 (06/558099) |
US | 11/26/1985 (12/5/1983) |
Pre-amplifier in focal plane detector array | |||
| Bridgewater, Xxxxxx X.; Xx Xxxx, Xxxxxx X.; Xxxxxx, Xxxxx; Wall, Xxxxxxxxx X. | ||||||
4,596,948 (06/661727) |
US | 6/24/1986 (10/17/1984) |
Constant current source for integrated circuits | |||
| Wall, Xxxxxxxxx X. | ||||||
4,617,160 (06/674096) |
US | 10/14/1986 (11/23/1984) |
Method for fabricating modules comprising uniformly stacked, aligned circuit-carrying layers | |||
| Xxxxxxxx, Xxxxxx X.; Xxxxxxxxx, Xxxx X. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
4,646,128 (06/720902) |
US | 2/24/1987 (4/8/1985) |
High-density electronic processing package—structure and fabrication | |||
| Xxxxxx, Xxxx X.; Xxxxx, Xxxxxxx X. | ||||||
4,672,737 (06/761889) |
US | 6/16/1987 (8/2/1985) |
Detector array module fabrication process | |||
| Xxxxxx, Xxxx X.; Xxxxx, Xxxxxxx X. | ||||||
4,675,532 (06/795988) |
US | 6/23/1987 (11/6/1985) |
Combined staring and scanning photodetector sensing system having both temporal and spatial filterin | |||
| Xxxxxx, Xxxx X. | ||||||
4,704,319 (06/842159) |
US | 11/3/1987 (3/21/1986) |
Apparatus and method for fabricating modules comprising stacked circuit-carrying layers | |||
| Xxxxxxxx, Xxxxxx X.; Xxxxxxxxx, Xxxx X. | ||||||
4,706,166 (06/856835) |
US | 11/10/1987 (4/25/1986) |
High-density electronic modules—process and product | |||
| Go, Tiong C. | ||||||
4,764,846 (07/000562) |
US | 8/16/1988 (1/5/1987) |
High density electronic package comprising stacked sub-modules | |||
| Go, Tiong C. | ||||||
4,779,005 (07/048551) |
US | 10/18/1988 (5/11/1987) |
Multiple detector viewing of pixels using parallel time delay and integration circuitry | |||
| Xxxxxx, Xxxx X. | ||||||
4,791,286 (07/042686) |
US | 12/13/1988 (4/27/1987) |
Pre-amplifier in focal plane detector array | |||
| Wall, Xxxxxxxxx X. | ||||||
4,806,761 (07/023644) |
US | 2/21/1989 (3/9/1987) |
Thermal imager incorporating electronics module having focal plane sensor mosaic | |||
| Xxxxxx, Xxxx X.; Xxxxx, Xxxxxxx X. | ||||||
4,814,629 (07/107352) |
US | 3/21/1989 (10/13/1987) |
Pixel displacement by series- parallel analog switching | |||
| Xxxxxx, Xxxx X. | ||||||
4,912,545 (07/097797) |
US | 3/27/1990 (9/16/1987) |
Bonding of aligned conductive bumps on adjacent surfaces | |||
| Go, Tiong C. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
5,701,233 (08/376,799) |
US | 12/23/1997 (1/23/1995) |
Stackable modules and multimodular assemblies | |||
| Xxxxxx, Xxxx X.; XxXxxx, Xxxxxx X.; Xxx, Xxxx; Miyake, Xxxxxxx X. | ||||||
5,745,631 (08/592,691) |
US | 4/28/1998 (1/26/1996) |
Self-aligning optical beam system | |||
| Xxxxxxx, Xxxxx X. | ||||||
SE0511218
(SE90917886.5)
|
SE | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
NL0511218
(NL90917886.5)
|
NL | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
NL0683968
(NL94903352.6)
|
NL | 10/24/2002 (12/1/1993) |
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor xxxx | |||
| Xxxxxx, Xxxx X.; Indin, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
LU0511218
(LU90917886.5)
|
LU | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
LI0511218
(LI90917886.5)
|
LI | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
JP06-0515293
|
JP | 12/16/1993 | Inventorship not available |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
JP05-0513453
|
JP | 12/1/1993 | Inventorship not available | |||
JP07-0513369
|
JP | 9/27/1995 | Inventorship not available | |||
JP02-0506137
|
JP | 3/23/1990 | Inventorship not available | |||
JP04-0505734
|
JP | 1/29/1992 | Hardware for electronic neural network | |||
| Xxxxxx, Xxxx X. | ||||||
JP58-502699
|
JP | 7/25/1983 | Inventorship not available | |||
PCT/US98/021798
|
JP | 10/14/1998 | Multi-element micro gyro Xxx, Xxxx Wen | |||
IT0511218
(IT90917886.5)
|
IT | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
IT0683968
(IT94903352.6)
|
IT | 10/24/2002 (12/1/1993) |
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor xxxx | |||
| Xxxxxx, Xxxx X.; Indin, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
GB0511218
(GB90917886.5)
|
GB | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
FR0511218
(FR90917886.5)
|
FR | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
ESP0511218
(ES90917886.5)
|
ES | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
EP0116072
(EP83902618.4)
|
EP | 10/11/1989 (7/25/1983) |
Multiplexer circuitry for high density analog signals | |||
EP01979633.3
|
EP | 10/9/2001 | High speed multi-stage stacked layer switch | |||
| Xxxx X. Xxxxxx; Volkan H. Orguz | ||||||
EP02797722.2
|
EP | 3/4/2002 | Retro-reflector warm stop for uncooled thermal imaging cameras and method of using the same | |||
| Xxxxxxx, Xxxxxxx X. | ||||||
EP0511218
(EP90917886.5)
|
EP | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
EP0570479
(EP92905662.0)
|
EP | 10/10/2001 (1/29/1992) |
Hardware for electronic neural network | |||
| Xxxxxx, Xxxx X. | ||||||
EP067087(EP94909418.9)
|
EP | (12/16/1993) | Fabricating stacks of ic chips by segmenting a larger stack XXXXXXX XXXXXX A; XXXX XXXXX A |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
EP0683968
(EP94903352.6)
|
EP | 10/24/2002 (12/1/1993) |
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor xxxx | |||
| Xxxxxx, Xxxx X.; Indin, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
XX0000000
(EP94915397.7)
|
EP | 2/24/2001 (4/19/1994) |
Electronic module comprising a stack of IC chips | |||
| Xxxxxx, Xxxx X.; Some, Xxxxxxx X. | ||||||
EP0713609
(EP94925876.8)
|
EP | 5/7/2003 (8/12/1994) |
Stack of IC chips as substitute for single IC xxxx | |||
| Xxxxxx, Xxxxx X.; Xxxxxxxx, Xxxxxx H.; Some, Xxxxxxx X.; Xxxxxx, Xxxx X. | ||||||
EP90906503.9
|
EP | 3/23/1990 | Analog to digital conversion in Z-technology module | |||
| Wall, Xxxxxxxxx X. | ||||||
EP92916059.6
|
EP | 6/24/1992 | Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
EP93922760.9
|
EP | 9/27/1993 | Fabrication of dense parallel solder bump connections | |||
| Xxxx, Xxxxx X.; Xxxxxxx, Xxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
EP96902733.3
|
EP | 1/22/1996 | Stackable modules and multimodular assemblies | |||
| Xxxxxx, Xxxx X.; XxXxxx, Xxxxxx X.; Xxx, Xxxx; Miyake, Xxxxxxx X. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
EP98957755.6
|
EP | 11/10/1998 | Method for thinning semiconductor wafers with circuits and wafers made by the same | |||
| Xxxxxx, Xxxxxxx; Ogzuz Volkhan H | ||||||
EP98964683.1
|
EP | 10/14/1998 | Multi-element micro gyro | |||
| Xxx, Xxxx Wen | ||||||
DK0511218(DK90917886.5)
|
DK | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | |||
DE0683968
(DE94903352.6)
|
DE | 10/24/2002 (12/1/1993) |
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor xxxx | |||
| Xxxxxx, Xxxx X.; Indin, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
DE69030195 (DE69030195) |
DE | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
CH0511218
(CH90917886.5)
|
CH | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
BE0511218
(BE90917886.5)
|
BE | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. |
| Title of Patent and First | ||||||
| Patent or Application No. | Country | Filing Date | Named Inventor | |||
AU20020332937
|
AU | 9/9/2002 | Stacking of multilayer modules | |||
| Xxxxxxxxx, Xxxxx Satsuo; Xxxx, Xxxxx Xxxxxxx; Ozguz, Volkan H.; Camien, Xxxxxx Xxxxxx | ||||||
AU20020353894
|
AU | 10/25/2002 | A method of stacking layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers | |||
| Xxxx, Xxxxx Antonio; Xxxxxxxxx, Xxxxx Satsuo | ||||||
AU20020365422
|
AU | 7/16/2002 | Wearable biomonitor with flexible thinned integrated circuit | |||
| Ogzuz, Volkhan H; Khashayar, Abbas | ||||||
AU20030225259
|
AU | 4/22/2003 | Method and apparatus for connecting vertically stacked integrated circuit chips | |||
| Xxxx, Xxxxx X.; Xxxxxx, Xxxxxxx X. | ||||||
AU20030261429
|
AU | 8/8/2003 | Stackable layers containing ball grid array packages | |||
| Xxxx, Xxxxx X. | ||||||
XX0000000
(AT90917886.5)
|
AT | 3/12/1997 (6/28/1990) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. | ||||||
AT150210 (WO1992US05348) |
AT | 5/13/1997 (6/24/1992) |
Fabricating electronic circuitry unit containing stacked IC layers having lead rerouting | |||
| Go, Tiong C.(deceased,); Xxxxxxx, Xxxxxx X.; Xxxxxxx, Xxxxxx X. |
