LETTERHEAD OF SOCIETE GENERALE] [Corporate & Investment Banking]

Exhibit 99.9

[LETTERHEAD OF SOCIETE GENERALE]

[Corporate & Investment Banking]

To: Xxxxxx Xxxxxx
Senior Vice President & Chief Financial Officer
Chartered Semiconductor manufacturing Ltd

From: Xxxxxxxx Xxxx
Managing Director and Regional Head of Export Finance, Asia
Societe Generale (“SG”)

Reference: Signed Credit Agreement dated as of January 28, 2008 (the “Agreement”) with Chartered Semiconductor manufacturing Ltd (the “Company”)

Dear Sirs,

Reference is made to the waiver request received on July 15, 2009 from your company, regarding the Debt Service Reserve Requirement listed as a covenant under Section 16.2 of the Agreement, in case Historical Debt Service Coverage Ratio is below 1.3x at any Repayment Date.

SG hereby confirms its consent to temporarily waive the above requirements for the next Repayment Date that is scheduled on September 1, 2009.

Yours faithfully,

/s/Xxxxxxxx Xxxx

Xxxxxxxx Xxxx
Managing Director and Regional Head of Export Finance, Asia

For and on behalf of
Societe Generale