1
EXHIBIT 10.1
INTELLECTUAL PROPERTY TRANSFER AND LICENSE AGREEMENT
THIS INTELLECTUAL PROPERTY TRANSFER AND LICENSE AGREEMENT (the
"Agreement") is entered into effective as of May 6, 1999 (the "Effective Date"),
by and between Amkor Technology Korea, Inc. ("Amkor"), a corporation organized
under the laws of the Republic of Korea, and Anam Semiconductor, Inc. ("Anam"),
a corporation organized under the laws of the Republic of Korea and having
offices in Seoul, Korea (each of Amkor and Anam, a "Party"; together, the
"Parties").
W I T N E S S E T H:
WHEREAS, the Parties have entered into that certain "Asset Purchase
Agreement" dated as of December 30, 1998, pursuant to which Amkor shall acquire
from Anam certain assets related to Anam's K4 packaging facility;
WHEREAS, In connection with such acquisition, Amkor will acquire certain
intellectual property rights and license certain other intellectual property
rights from Anam;
WHEREAS, Anam will license from Amkor certain intellectual property
rights.
NOW, THEREFORE, in consideration of the mutual covenants and promises
contained herein, the Parties hereby agree as follows:
ARTICLE 1.
CONSTRUCTION AND DEFINITIONS
SECTION 1.1. Construction.
(a) All references in this Agreement to "Articles," "Sections"
and "Exhibits" refer to the articles, sections and exhibits of this Agreement.
(b) As used in this Agreement, neutral pronouns and any
variations thereof shall be deemed to include the feminine and masculine and all
terms used in the singular shall be deemed to include the plural, and vice
versa, as the context may require.
(c) The words "hereof," "herein" and "hereunder" and other words
of similar import refer to this Agreement as a whole, as the same may from time
to time be amended or supplemented, and not to any subdivision contained in this
Agreement.
(d) The word "including" when used herein is not intended to be
exclusive and means "including, without limitation."
SECTION 1.2. Definitions. As used herein:
(a) "Anam Facilities" means Anam's "K1," "K2" and "K3"
semiconductor packaging facilities located in and around Seoul, Korea.
2
(b) "Bankruptcy Event" means any of the following events or
circumstances with respect to a Party: such Party (i) ceases conducting its
business; (ii) makes a general assignment for the benefit of its creditors;
(iii) petitions, applies for, or suffers or permits with or without its consent
the appointment of a custodian, receiver, trustee in bankruptcy or similar
officer for all or any substantial part of its business or assets; or (iv)
avails itself or becomes subject to any proceeding under the U.S. Bankruptcy
Code or any similar state, federal or foreign statute relating to bankruptcy,
insolvency, reorganization, receivership, arrangement, adjustment of debts,
dissolution or liquidation, which proceeding is not dismissed within sixty (60)
days of commencement thereof.
(c) "Change of Control" means, with respect to a Party: (A) the
direct or indirect acquisition of either (i) the majority of the voting stock of
such Party or (ii) all or substantially all of the assets of such Party, by
another entity in a single transaction or series of related transactions; or (B)
such Party is merged with, or into, another entity.
(d) "Confidential Information" means (i) any information
disclosed by one Party (the "Disclosing Party") to the other (the "Receiving
Party"), which, if in written, graphic, machine-readable or other tangible form
is marked as "Confidential" or "Proprietary", or which, if disclosed orally or
by demonstration, is identified at the time of initial disclosure as
confidential and reduced to a writing marked "Confidential" and delivered to the
Receiving Party within thirty (30) days of such disclosure; and (ii) the terms
of this Agreement as set forth in Section 8.3.
(e) "Intellectual Property Rights" means all rights of a Person
in, to, or arising out of: (i) any U.S., international or foreign patent,
utility model or registered design or any application therefor and any and all
reissues, divisions, continuations, renewals, extensions and
continuations-in-part thereof; (ii) inventions (whether patentable or not in any
country), invention disclosures, improvements, trade secrets, proprietary
information, know-how, technology and technical data; (iii) copyrights,
copyright registrations, mask works, mask work registrations, and applications
therefor in the U.S. or any foreign country, and all other rights corresponding
thereto throughout the world; (iv) moral rights; and (v) any other proprietary
rights anywhere in the world similar to those described in this definition,
including, without limitation, rights in registered computer programs.
(f) "License Term" means the time period commencing on the
Effective Date and ending on the earlier of the expiration or termination of
that certain "Packaging & Test Services Agreement" by and among Amkor
Technology, Inc., Amkor Electronics, Inc., C.I.L. Limited, Anam USA, Inc. and
Anam Industrial Co., Ltd.
(g) "Person" means any legal person or entity, including any
individual, corporation, partnership, joint venture, association, joint stock
company, trust, unincorporated association, limited liability corporation,
governmental entity, or other person or entity of similar nature.
(h) "Subsidiary" of a first entity means any corporation or other
entity that is directly or indirectly controlling, controlled by or under common
control with such first entity.
-2-
3
For the purpose of this definition, "control" shall mean the direct or indirect
ownership of fifty percent (50%) or more of the shares of the subject entity
entitle to vote in the election of directors (or, in the case of an entity that
is not a corporation, for the election of managing authority).
(i) "Term" means the term of this Agreement as set forth in
Section 11.1.
(j) "Type A Materials" means those documents and other materials
listed on Exhibit B attached hereto and all derivative works and compilations
thereof.
(k) "Type A Patents" means the patents listed on Exhibit A
attached hereto, the patent applications listed on Exhibit D attached hereto,
all patents issuing therefrom and all reissues, renewals, extensions,
continuations, continuations-in-part, divisions and reexaminations thereof and
foreign and domestic counterparts of all of the foregoing.
(l) "Type B Materials" means all materials, documents,
information and data of Anam ("Materials") relating to the K4 packaging facility
and all other Materials provided to or learned by Amkor.
(m) "Type B Patents" means all patents and patent applications
owned or controlled by Anam, and all reissues, renewals, extensions,
continuations, continuations-in-part, divisions and reexaminations thereof and
foreign and domestic counterparts of all of the foregoing, other than Type A
Patents, including the patents and patent applications listed on Exhibit E
attached hereto.
ARTICLE 2.
TYPE A PATENTS
SECTION 2.1. Assignment to Amkor. Anam hereby irrevocably transfers,
conveys and assigns to Amkor in perpetuity all worldwide right, title and
interest in and to the Type A Patents. In furtherance of the foregoing, upon
Amkor's request, Anam shall execute and deliver to Amkor a patent assignment
substantially in the form attached hereto as Exhibit C.
SECTION 2.2. License to Anam. Amkor hereby grants to Anam a
royalty-free, nonexclusive, worldwide, transferable, sublicensable, royalty-free
license under the Type A Patents during the License Term to make in the Anam
Facilities, use, sell and import any product and practice any process in the
Anam Facilities.
ARTICLE 3.
TYPE B PATENTS
SECTION 3.1. License to Amkor. Anam hereby grants to Amkor and its
Subsidiaries a royalty-free, perpetual, irrevocable, nonterminable,
nonexclusive, worldwide, transferable, sublicensable, royalty-free license under
the Type B Patents to make, have made, use, sell, offer for sale and import any
product and practice any process.
-3-
4
ARTICLE 4.
TYPE A MATERIALS
SECTION 4.1. Assignment to Amkor. Anam hereby irrevocably transfers,
conveys and assigns to Amkor in perpetuity all worldwide right, title and
interest in and to the Type A Materials, including without limitation (i) Anam's
trade secret rights in the information contained in the Type A Materials, (ii)
Anam's copyrights and maskwork rights in the Type A Materials, (iii) the right
to file in Amkor's name patents on inventions disclosed in the Type A Materials
and any other application for or registration of any Intellectual Property Right
in or to any of the Type A Materials in Amkor's sole discretion, and (iv) all
other Intellectual Property Rights in and to any of the Type A Materials
(collectively, the "Type A IP").
SECTION 4.2. Confidential Information. The information contained in the
Type A Materials is and shall become Amkor's Confidential Information.
SECTION 4.3. License to Anam. Amkor hereby grants to Anam a
nonexclusive, worldwide, transferable, sublicensable, royalty-free license under
the Type A IP during the License Term to make in the Anam Facilities, use, sell
and import any product and practice in the Anam Facilities any process.
ARTICLE 5.
TYPE B MATERIALS
SECTION 5.1. License to Amkor. Anam hereby grants to Amkor and its
Subsidiaries a royalty-free, perpetual, irrevocable, nonterminable,
nonexclusive, worldwide, transferable, sublicensable license under Anam's
existing and future Intellectual Property Rights in and to the Type B Materials
to make, have made, use, sell, offer for sale and import any product and
practice any process.
ARTICLE 6.
DELIVERY OF MATERIALS
SECTION 6.1. Delivery. Within five (5) days of the Closing (as such term
is defined in the Asset Purchase Agreement), Anam shall, in connection with the
transfer of the assets of Anam's K4 semiconductor packaging facility to Amkor,
deliver to Amkor copies of the Type A Materials and the Type B Materials (the
date of such delivery, the "Transfer Date").
ARTICLE 7.
NEW TECHNOLOGY SHARING
SECTION 7.1. Meeting; Delivery.
(a) The Parties shall hold regular meetings of an engineering
council substantially similar to the meetings held by representatives of the K1,
K2, K3 and K4 packaging facilities prior to the Effective Date. Anam shall
ensure that representatives of Amkor are invited to, and
-4-
5
given reasonable opportunity to attend, all such meetings and any similar
technology sharing meetings.
(b) No less frequently than once per calendar quarter, the
Parties shall meet to discuss inventions and know-how ("New Technology") created
or acquired by each of the Parties since the last such meeting or, in the case
of the first such meeting, since the Transfer Date. With respect to each item of
New Technology, upon mutual agreement of the Parties, the Party owning or
controlling, as the case may be, such item of New Technology shall (i) disclose
such item of New Technology to the other Party and grant such other Party a
license under the disclosing Party's intellectual property rights to make, have
made, use, sell, offer for sale and import any products and practice any
processes. The foregoing obligation shall not apply to any item of New
Technology or any Intellectual Property Right owned or controlled by a purchaser
of or successor to Amkor, which item or right was not acquired from Amkor.
SECTION 7.2. Jointly Developed Technology. The Parties shall own jointly
developed works of authorship and jointly developed inventions, including all
Intellectual Property Rights associated therewith, jointly, without a duty to
account.
ARTICLE 8.
CONFIDENTIAL INFORMATION
SECTION 8.1. Confidential Information and Exclusions. Notwithstanding
Section 1.2(d), Confidential Information shall exclude information that the
Receiving Party can demonstrate:
(a) was independently developed by the Receiving Party without
any use of the Disclosing Party's Confidential Information or by the Receiving
Party's employees or other agents (or independent contractors hired by the
Receiving Party) who have not been exposed to the Disclosing Party's
Confidential Information;
(b) becomes known to the Receiving Party, without restriction,
from a source other than the Disclosing Party, which source has no duty of
confidentiality with respect thereto;
(c) was in the public domain at the time it was disclosed or
becomes in the public domain through no act or omission of the Receiving Party;
or
(d) was rightfully known to the Receiving Party, without
restriction, at the time of disclosure;
except that neither Section 8.1(a) nor Section 8.1(d) shall be considered in
determining whether the Type A Materials is Amkor's Confidential Information.
SECTION 8.2. Confidentiality Obligation. The Receiving Party shall treat
as confidential all of the Disclosing Party's Confidential Information. Without
limiting the foregoing, the Receiving Party shall use at least the same degree
of care which it uses to prevent the disclosure of its own confidential
information of like importance, but in no event with less than reasonable care,
to prevent the disclosure of the Disclosing Party's Confidential Information.
-5-
6
Notwithstanding the foregoing, Amkor shall have the right to disclose Anam's
Confidential Information to Amkor's Subsidiaries pursuant to an agreement
containing provisions at least as protective of such Confidential Information as
this Article 8.
SECTION 8.3. Confidentiality of Agreement. Each Party agrees that the
terms and conditions, but not the existence, of this Agreement shall be treated
as the other's Confidential Information and that no reference to the terms and
conditions of this Agreement or to activities pertaining thereto can be made in
any form of public or commercial advertising without the prior written consent
of the other Party; provided, however, that each Party may disclose the terms
and conditions of this Agreement: (i) as required by any court or other
governmental body; (ii) as otherwise required by law; (iii) to legal counsel of
the Parties; (iv) in connection with the requirements of an initial public
offering or securities filing or offering; (v) in confidence, to accountants,
banks, and financing sources and their advisors; (vi) in confidence, in
connection with the enforcement of this Agreement or rights under this
Agreement; or (vii) in confidence, in connection with a merger or acquisition or
proposed merger or acquisition, or the like.
SECTION 8.4. Compelled Disclosure. If a Receiving Party believes that it
will be compelled by a court or other authority to disclose Confidential
Information of the Disclosing Party, it shall give the Disclosing Party prompt
written notice so that the Disclosing Party may take steps to oppose such
disclosure.
SECTION 8.5. Remedies. Unauthorized use by a Party of the other Party's
Confidential Information will diminish the value of such information. Therefore,
if a Party breaches any of its obligations with respect to confidentiality or
use of Confidential Information hereunder, the other Party shall be entitled to
seek equitable relief to protect its interest therein, including injunctive
relief, as well as money damages.
SECTION 8.6. Residuals. Each Party shall be free, and each Party hereby
grants to the other Party the right, to use for any purpose the Residuals
resulting from access to or work with the Confidential Information. "Residuals"
means information retained in the unaided memory of an individual who has had
access to Confidential Information without conscious attempt by such individual
to memorize such information. Neither Party shall have any obligation to limit
or restrict the assignment of any individual who has had access to the other
Party's Confidential Information or to pay royalties for any work resulting from
the use of Residuals. However, the foregoing shall not be deemed to grant to
either Party a license under the other Party's copyrights or patents.
ARTICLE 9.
WARRANTIES, DISCLAIMERS AND INDEMNITIES
SECTION 9.1. General Warranty. Each Party hereby represents and warrants
to the other that: (i) all corporate action on the part of such Party, its
officers, directors and shareholders necessary for the authorization of this
Agreement and the performance of all obligations of such Party hereunder has
been taken; and (ii) this Agreement, when executed and delivered, will be a
valid and binding obligation of such Party enforceable in accordance with its
terms.
-6-
7
SECTION 9.2. No Conflict. Each Party hereby represents and warrants to
the other that such Party's making of this Agreement and performance hereunder
does not and will not violate any agreement existing between such Party and any
third party.
SECTION 9.3. Intellectual Property. Anam hereby represents and warrants
to Amkor that, to the best of Anam's knowledge: (i) the Type A Materials, the
Type B Materials and Amkor's use thereof as authorized herein will not infringe
any Intellectual Property Right of any third party; (ii) neither the Type A
Materials nor the Type A Patents are subject to any third-party lien or
encumbrance; (iii) no third party is infringing or misappropriating or has
infringed or misappropriated: (A) any claim of any of the Type A Patents or the
Type B Patents or (B) any other Intellectual Property Right in or to the Type A
Materials or the Type B Materials; and (iv) all Intellectual Property Rights
transferred or licensed to Amkor hereunder are valid and subsisting, and no
grounds exist to invalidate or render unenforceable any such Intellectual
Property Right.
SECTION 9.4. Disclaimer. EXCEPT AS EXPRESSLY SET FORTH HEREIN, NEITHER
PARTY MAKES ANY WARRANTIES OR CONDITIONS, EXPRESS, STATUTORY, IMPLIED, OR
OTHERWISE, WITH RESPECT TO ANY PRODUCT OR SERVICE PROVIDED HEREUNDER, AND EACH
PARTY HEREBY DISCLAIMS THE IMPLIED WARRANTIES AND CONDITIONS OF NONINFRINGEMENT
OF THIRD PARTY RIGHTS, SATISFACTORY QUALITY, MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE WITH RESPECT THERETO.
SECTION 9.5. Indemnity. Anam shall indemnify and hold Amkor, its
affiliates and customers harmless from and against all loss, cost, liability,
damage and expense suffered or incurred by any of them in connection with any
breach by Anam of any warranty set forth herein.
ARTICLE 10.
LIABILITY LIMITATIONS
SECTION 10.1. Exclusion of Damages. EXCEPT IN CONNECTION WITH A BREACH
OF A PROVISION OF ARTICLE 8, IN NO EVENT SHALL EITHER PARTY BE LIABLE TO THE
OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES, WHETHER
BASED ON BREACH OF CONTRACT, TORT (INCLUDING NEGLIGENCE), PRODUCT LIABILITY, OR
OTHERWISE, AND WHETHER OR NOT THE PARTY AGAINST WHOM LIABILITY IS SOUGHT HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
SECTION 10.2. Failure of Essential Purpose. The limitations specified in
this ARTICLE 10 shall survive and apply even if any limited remedy specified in
this Agreement is found to have failed of its essential purpose.
-7-
8
ARTICLE 11.
TERM AND TERMINATION
SECTION 11.1. Term. Unless earlier terminated in accordance with Section
11.2, the term ("Term") of this Agreement shall commence on the Effective Date
and continue in full force and effect until the Parties agree to mutually
terminate this Agreement.
SECTION 11.2. Default. If either Party defaults in the performance of
any of its material obligations hereunder, such Party shall use its best efforts
to correct such default within thirty (30) days (or such additional time as the
Parties may agree) after written notice thereof from the other Party. If any
such default cannot be, or is not, corrected within such thirty (30)-day period,
then the non-defaulting Party shall have the right, in addition to any other
remedies it may have, to terminate this Agreement by giving written notice to
the Party in default.
SECTION 11.3. Survival. The following provisions of this Agreement shall
survive any expiration or termination hereof: Articles 1, 3, 5, 8, 9, 10, 11, 12
and 13 and Sections 2.1, 4.1 and 4.2.
ARTICLE 12.
ARBITRATION
SECTION 12.1. Arbitration of Disputes.
(a) Any dispute arising out of, in connection with, or in
relation to the interpretation, performance or breach of this Agreement,
including any claim based on contract, tort or statute, which is not settled
after good faith attempts by the Parties to amicably resolve such dispute shall
be resolved by final and binding arbitration. The arbitration shall be held in
Seoul, Korea if the arbitration is brought by Amkor and in San Francisco,
California, United States of America if the arbitration is brought by Seller in
accordance the Rules of Conciliation and Arbitration of the International
Chamber of Commerce ("ICC Rules") as then existing and shall be heard and
determined by an arbitration tribunal composed of three (3) arbitrators. Each of
the Parties shall appoint one arbitrator each, and both of such arbitrators
shall appoint a third arbitrator who shall serve as the Chairman of such
arbitration tribunal, provided that such third arbitrator is not a citizen of
the United States of America of Korea. If either party fails or decides against
appointing an arbitrator within a period of thirty (30) days of the appointment
of the first arbitrator, or if the arbitrators designated by the Parties fail or
otherwise are unable to appoint the third arbitrator within (30) days of the
appointment of the second arbitrator, then the remaining arbitrator (s) shall be
selected by the President of the International Chamber of Commerce, U.S.A.,
which shall act as the appointing authority.
(b) All arbitration proceedings shall be conducted in the English
language and the arbitration award (the "Award") shall be rendered no later than
six (6) months from the commencement of the arbitration or as otherwise provided
by the ICC Rules, unless otherwise extended by the arbitration tribunal for no
more than an additional six (6) months for reasons that are just and equitable.
-8-
9
(c) The Parties expressly understand and agree that the Award
shall be the sole, exclusive, final and binding remedy between them regarding
any and all disputes presented to the arbitration tribunal. Each Party hereby
expressly waives any and all rights that such Party may have with respect to a
judicial review of the Award in the courts having jurisdiction over the Party
(or its assets) against whom the Award is rendered for a judicial acceptance of
the Award and an order of enforcement.
(d) Notwithstanding any other provision of this Agreement, either
Party shall be entitled to seek preliminary injunctive relief from any court of
competent jurisdiction pending the final decision or award of the arbitrators.
Any arbitration shall be held before a single arbitrator, who shall be selected
in accordance
ARTICLE 13.
MISCELLANEOUS
SECTION 13.1. Further Assurances. At any time, and from time to time,
Anam shall forthwith, upon Amkor's (or its successors' or assigns') request,
take any and all steps necessary to execute, acknowledge and deliver to Amkor
(or its successors or assigns), any and all further instruments and assurances
(including, without limitation, assignments of patent and copyright rights and
patent applications) necessary or expedient in order to invest all right, title
and interest in the Type A Patents and Type A Materials in Amkor (or its
successors or assigns) and to facilitate Amkor's (or its successors' and
assigns') enjoyment, enforcement and recordation of such rights. Anam hereby
constitutes and appoints Amkor as Anam's true and lawful attorney-in-fact with
full power of substitution, in Anam's name, place and stead to take any and all
steps, including proceedings at law, in equity or otherwise, to execute,
acknowledge and deliver any and all documents, instruments and assurances
necessary or expedient in order to vest, record or perfect all Amkor's (or its
successors' or assigns') rights in the Type A Patents and Type A Materials, to
protect the same, or to enforce any claim or any right of any kind with respect
thereto. This includes, but is not limited to, any rights with respect to the
Type A Patents and Type A Materials that may have accrued in Anam's favor at any
time prior to the date of this Agreement. Anam hereby declares that the
foregoing power is coupled with an interest and, as such, is irrevocable.
Without limiting the foregoing, Anam shall, upon Amkor's request, provide to
Amkor all reasonable cooperation in connection with the application for or
registration of Intellectual Property Rights in or to the Type A Patents and/or
the Type A Materials, including without limitation cooperation in connection
with the prosecution of the patent applications included in the Type A Patents.
SECTION 13.2. Licensor Bankruptcy. All rights and licenses granted to
Amkor pursuant to this Agreement are, and shall otherwise be deemed to be, for
purposes of Section 365(n) of Title 11 of the United States Code (the
"Bankruptcy Code"), licenses to rights of "intellectual property" as defined
thereunder. Notwithstanding any provision contained herein to the contrary, if
Anam is under any proceeding under the Bankruptcy Code and the trustee in
bankruptcy of Anam, or Anam as a debtor in possession, rightfully elects to
reject this Agreement, Amkor may, pursuant to Sections 365(n)(1) and (2) of the
Bankruptcy Code, retain any and all of Amkor's rights hereunder, to the maximum
extent permitted by law, subject to Amkor's making the payments specified
herein.
-9-
10
SECTION 13.3. Governing Law. THIS AGREEMENT SHALL BE GOVERNED BY AND
INTERPRETED IN ACCORDANCE WITH THE LAWS OF THE REPUBLIC OF KOREA, WITHOUT
REFERENCE TO CONFLICT OF LAWS PRINCIPLES.
SECTION 13.4. Independent Contractors. The Parties are independent
contractors. Nothing contained herein or done pursuant to this Agreement shall
constitute either Party the agent of the other Party for any purpose or in any
sense whatsoever, or constitute the Parties as partners or joint venturers.
SECTION 13.5. Assignment. Anam shall not assign or delegate this
Agreement, or any of its rights or duties hereunder, directly, indirectly, by
operation of law, in connection with a Change of Control or otherwise, and any
such purported assignment or delegation shall be void, except with the express
written permission of Amkor in its sole discretion. Amkor may assign or delegate
this Agreement and any of Amkor's rights or duties hereunder in Amkor's sole
discretion.
SECTION 13.6. Amendment. No alteration, amendment, waiver, cancellation
or any other change in any term or condition of this Agreement shall be valid or
binding on either Party unless mutually assented to in writing by both Parties.
SECTION 13.7. No Waiver. The failure of either Party to enforce at any
time any of the provisions of this Agreement, or the failure to require at any
time performance by the other Party of any of the provisions of this Agreement,
shall in no way be construed to be a present or future waiver of such
provisions, nor in any way affect the validity of either Party to enforce each
and every such provision thereafter. The express waiver by either Party of any
provision, condition or requirement of this Agreement shall not constitute a
waiver of any future obligation to comply with such provision, condition or
requirement.
SECTION 13.8. Severability. If, for any reason, a court of competent
jurisdiction finds any provision of this Agreement, or portion thereof, to be
invalid or unenforceable, such provision of the Agreement will be enforced to
the maximum extent permissible so as to effect the intent of the Parties, and
the remainder of this Agreement will continue in full force and effect. The
Parties agree to negotiate in good faith an enforceable substitute provision for
any invalid or unenforceable provision that most nearly achieves the intent and
economic effect of such provision.
SECTION 13.9. Notices. All notices, requests, demands, waivers, and
other communications required or permitted hereunder shall be in writing and
shall be deemed to have been duly given: (i) when delivered by hand or confirmed
facsimile transmission; (ii) one day after delivery by receipted overnight
delivery; or (iii) four days after being mailed by certified or registered mail,
return receipt requested, with postage prepaid to the following, or to such
other person or address as either Party shall furnish to the other Party in
writing pursuant to the above:
(a) in the case of notices to Amkor, to the attention of the
General Counsel at the relevant address set forth on the first page hereof, with
a copy to Xxxxxx X. Xxxxxxxx, Esq., Xxxxxx Xxxxxxx Xxxxxxxx & Xxxxxx, 000 Xxxx
Xxxx Xxxx, Xxxx Xxxx, XX 00000.
-10-
11
(b) in the case of notices to Anam, to [ ].
SECTION 13.10. Titles and Subtitles. The titles and subtitles used in
this Agreement are used for convenience only and are not to be considered in
construing or interpreting this Agreement.
SECTION 13.11. Entire Agreement. The terms and conditions herein
contained and the referenced Exhibits which are hereby incorporated herein by
reference constitute the entire agreement between the Parties with respect to
the subject matter hereof and supersede all previous and contemporaneous
agreements and understandings, whether oral or written, between the Parties with
respect to the subject matter hereof.
SECTION 13.12. Counterparts. This Agreement may be executed in
counterparts or duplicate originals, both of which shall be regarded as one and
the same instrument, and which shall be the official and governing version in
the interpretation of this Agreement.
*** End of Agreement ***
-11-
12
IN WITNESS WHEREOF, the Parties have caused this Agreement to be
executed by duly authorized officers or representatives to be effective as of
the date first above written.
Amkor Technology, Inc. Anam Semiconductor, Inc.
By: /s/ By: /s/
---------------------------- ----------------------------
Name: Name:
-------------------------- --------------------------
Title: Title:
------------------------- -------------------------
-12-
13
Exhibit A
HEAT SINK PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
------------------------------------------------------------------------------------------------------------------------------------
AP-094 Semiconductor package having heatsink X.X. Xxxx 94-22437 Sep 7, '94 Dec 26, '97 P137066 Anam
and method of manufacturing
it (Heatsink structure)
------------------------------------------------------------------------------------------------------------------------------------
AP-108 Semiconductor package (Making heatsink X.X. Xxxx 94-25862 Oct 10, '94 Dec 26, '97 P134933 Anam
when it's easy to eject in
molding process)
------------------------------------------------------------------------------------------------------------------------------------
AP-109 A method of manufacturing for X.X Xxxx 94-25863 Oct 10, '94 Jan 23, '98 P137325 Anam
semiconductor package (Attaching
heatsink at last time)
------------------------------------------------------------------------------------------------------------------------------------
AP-111 Apparatus of attaching tape for X.X. Xxx 94-27136 Oct 24, '94 Mar 31, '98 P144313 Anam
preventing heatsink plating
------------------------------------------------------------------------------------------------------------------------------------
AP-114 Method of attaching between heatsink B.T. Dho 94-28904 Nov 4, '94 May 22, '98 P159965 Anam
and leadframe of semiconductor package
------------------------------------------------------------------------------------------------------------------------------------
AU-128 Structure of heatspreader for X.X. Xxx 94-33576 Dec 10, '94 Jan 23, '98 U117453 Anam
semiconductor package
------------------------------------------------------------------------------------------------------------------------------------
AP-181 Method of eliminating tape attached X.X. Xxx 94-39353 Dec 30, '94 Feb 26, '98 P142135 Anam
in heatsink
------------------------------------------------------------------------------------------------------------------------------------
BGA PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
------------------------------------------------------------------------------------------------------------------------------------
AP-027 Semiconductor package (BGA + PQ) N.H. Xxxx 93-27078 Dec 9, '93 Sep 25, '97 P127737 Anam
------------------------------------------------------------------------------------------------------------------------------------
AP-091 Cap type BGA package and method X.X. Xxx 94-21781 Aug 31, '94 Mar 31, '98 P144311 Anam
of manufacturing it
------------------------------------------------------------------------------------------------------------------------------------
LEADFRAME PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
------------------------------------------------------------------------------------------------------------------------------------
AP-035 Surface mounting integrated circuit X. Xxx 94-01773 Jan 31, '94 Sep 12, '97 P124790 Anam
package (BLP)
------------------------------------------------------------------------------------------------------------------------------------
45 Plastic mold package with heatsink Rorert 94-05545 Mar 19, '94 Jun 30, '97 P126052
------------------------------------------------------------------------------------------------------------------------------------
-1-
14
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
------------------------------------------------------------------------------------------------------------------------------------
46 Forming method of plastic mold package Rorert 94-05546 Mar 19, '94 Jun 30, '97 P126053
with heatsink
------------------------------------------------------------------------------------------------------------------------------------
PKG PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
1 Safe setting method for solder ball 93-15983 P105750
for integrated circuit package (BGA)
------------------------------------------------------------------------------------------------------------------------------------
2 Method of decreasing bending for 93-15984 P122789
integrated circuit package (BGA)
------------------------------------------------------------------------------------------------------------------------------------
3 Mold runner removal from a 93-15985 P128174
substrate-based packaged electronic
device (BGA, Gold gate)
------------------------------------------------------------------------------------------------------------------------------------
4 Semiconductor package (BGA+PQ) 93-27078 P127737
------------------------------------------------------------------------------------------------------------------------------------
5 Method of mounting chip for BGA 94-02982 P131392
semiconductor package and structure
using the same (Double Adhesive)
------------------------------------------------------------------------------------------------------------------------------------
6 Cap type BGA package and method of 94-21781 P144311
manufacturing it
------------------------------------------------------------------------------------------------------------------------------------
7 Method for checking wire bonding in 94-24280 P131389
result of BGA package
------------------------------------------------------------------------------------------------------------------------------------
8 Semiconductor package (Consists of 94-39354 P167141
metal cap and advanced adhesive)
------------------------------------------------------------------------------------------------------------------------------------
9 Method for leveling solder ball array 95-10418 P179473
in BGA semiconductor package
------------------------------------------------------------------------------------------------------------------------------------
11 BGA semiconductor package with improved 95-19582 P159987
heat dissipation and dehumidification
------------------------------------------------------------------------------------------------------------------------------------
19 Printed circuit board having epoxy 95-37513 P170024
barrier around its throughout slot
and ball grid array semiconductor
package using such a printed circuit
board, thereby exhibiting a high
moisture discharge characteristic
------------------------------------------------------------------------------------------------------------------------------------
119 Method of decreasing bending for 97-10103 P122847
integrated circuit package (BGA)
------------------------------------------------------------------------------------------------------------------------------------
-2-
15
Exhibit B
Type A Materials
I. All documents, databases and other materials in Anam's possession or
control, whether in printed, electronic or other form, describing, addressing,
related to or useful in connection with any of the following topics:
A. With respect to TSOP/TSSOP/SSOP:
1. General leadframe design rules including strip configurations and
die design guidelines.
2. Wafer Backgrinding process recipe for optimized surface finish
and residual stress.
3. Leadframe design criteria specific to ePad TSSOP delamination
control.
4. Low loop and second stitch on ball wire bonding process recipes.
5. Dispense tool design criteria for thermally enhanced epoxy
processing.
6. ePad TSSOP deflashing process and recipe.
7. ePad process flow for delamination enhancement.
B. Generally:
1. Tape design rules, including with respect to lead length/notch
width, reliability, yield and quality.
2. Tape to frame lamination material and process.
3. Elastomer material, including with respect to thickness,
supplier, type, reliability and manufacturability.
4. Frame design, including with respect to cost reduction.
5. Elastomer to tape to die size design rules, including issues with
respect to quality and yield optimization.
6. Multiple unit punching of elastomer onto tape sites, including
with respect to cost reduction.
7. D/A process and optimization methodology, including with respect
to time/press/temp to meet MRT.
-1-
16
8. Lead bond parameters (90E and 45E leads) (to allow reliable perf)
9. Coverlay tape material, including with respect to specific
adhesion level but with release properties.
10. Coverlay tape attach process (void free).
11. Encap material prep, including with respect to filtering/mixing.
12. Encap dispense/vacuum/cure process (high speed/void free).
13. Solderball attach process, including with respect to small balls
and multiple units on strip.
14. Xxxx (laser xxxx on Si backside without die damage).
15. Singulation (process parameters to avoid burrs).
-2-
17
II. The following drawings and all information contained therein:
================================================================================
DRAWING # TITLE
================================================================================
001 0501 2099 BGA Standard Process Description
--------------------------------------------------------------------------------
001 0307 2025 Saw and Clean Monitor
--------------------------------------------------------------------------------
001 0510 2495 Precure Process (before die attach)
--------------------------------------------------------------------------------
001 0310 2033 Die Mounting Monitor
--------------------------------------------------------------------------------
001 0311 2078 Ball Shear Test
--------------------------------------------------------------------------------
001 0311 2465 Bond Strength Test
--------------------------------------------------------------------------------
001 0311 2455 Wire Bond Monitor
--------------------------------------------------------------------------------
001 0314 2032 Oven Monitor
--------------------------------------------------------------------------------
001 0410 2637 Incoming Inspection for Die Attach Adhesive
--------------------------------------------------------------------------------
001 0411 2694 Incoming Inspection for Bonding Wires
--------------------------------------------------------------------------------
001 0440 2688 Incoming Inspection for PCB
--------------------------------------------------------------------------------
001 0506 2001 Wafer Mounting Process
--------------------------------------------------------------------------------
001 0507 2002 Wafer Sawing Process
--------------------------------------------------------------------------------
001 0510 2042 Die Bonding for Adhesive
--------------------------------------------------------------------------------
001 0510 2052 Adhesive Curving Process
--------------------------------------------------------------------------------
001 0511 2044 Wire Bonding for Gold Wire
--------------------------------------------------------------------------------
001 0511 2497 Precure Process (before wire bond)
--------------------------------------------------------------------------------
001 0517 2496 Precure Process (before mold)
--------------------------------------------------------------------------------
001 0417 2690 Incoming Inspection for Mold Compound
--------------------------------------------------------------------------------
001 0513 2005 Internal Visual Inspection for Commercial Product
--------------------------------------------------------------------------------
-3-
18
--------------------------------------------------------------------------------
001 0313 2009 Internal Visual Lot Acceptance
--------------------------------------------------------------------------------
001 0419 2671 Incoming Inspection for Marking/Dot Ink
--------------------------------------------------------------------------------
001 0517 2447 Process for Molding
--------------------------------------------------------------------------------
001 0317 2476 Mold Monitor
--------------------------------------------------------------------------------
001 0217 2223 X-Ray Monitor Mold
--------------------------------------------------------------------------------
001 0519 2062 Laser Marking
--------------------------------------------------------------------------------
001 0319 2105 Laser Marking Monitor
--------------------------------------------------------------------------------
================================================================================
DRAWING # TITLE
================================================================================
001 0519 2062 Marking
--------------------------------------------------------------------------------
001 0319 2105 Marking Monitor
--------------------------------------------------------------------------------
001 0514 2038 Post Mold Cure
--------------------------------------------------------------------------------
001 0314 2032 Oven Monitor
--------------------------------------------------------------------------------
001 0319 2472 Marking Permanency Test
--------------------------------------------------------------------------------
001 0431 2083 Procurement Spec for Shipping Tray
--------------------------------------------------------------------------------
001 0340 2482 Solder Ball Attach Monitor
--------------------------------------------------------------------------------
001 0340 2481 Solder Ball Shear Strength Test
--------------------------------------------------------------------------------
001 0521 2014 DTFS for Plastic Packages
--------------------------------------------------------------------------------
001 0422 2666 Anode & Solder Incoming Inspection
--------------------------------------------------------------------------------
001 0540 2624 Solder Ball Attach Process
--------------------------------------------------------------------------------
001 0321 2259 DTFS Monitor (Deflash/Trim/Form/Singulation)
--------------------------------------------------------------------------------
001 0530 2623 Final Visual Inspection
--------------------------------------------------------------------------------
001 0330 2010 Final V/M Lot Acceptance
--------------------------------------------------------------------------------
-4-
19
--------------------------------------------------------------------------------
001 0531 2247 Dry Packing
--------------------------------------------------------------------------------
001 0331 2248 Dry Packing Monitor
--------------------------------------------------------------------------------
001 0531 2234 Packing Operation Procedure
--------------------------------------------------------------------------------
001 0331 2158 Packing Monitor
--------------------------------------------------------------------------------
BODY SIZE STRIP DRAWING #
--------------------------------------------------------------------------------
13 X 13 72132
--------------------------------------------------------------------------------
14 X 22 72076
--------------------------------------------------------------------------------
15 X 15 72371
--------------------------------------------------------------------------------
17 X 17 72176
--------------------------------------------------------------------------------
23 X 23 70821
--------------------------------------------------------------------------------
27 x 27 70795
--------------------------------------------------------------------------------
31 x 31 71218
--------------------------------------------------------------------------------
35 x 35 70796
--------------------------------------------------------------------------------
37.5 x 37.5 75312
--------------------------------------------------------------------------------
-5-
20
Exhibit C
Patent Assignment
ASSIGNMENT OF PATENT RIGHTS
For good and valuable consideration, the receipt of which is hereby
acknowledged, __________, a__________ corporation, having offices at __________
("Assignor"), does hereby sell, assign, transfer and convey unto __________, a
__________ corporation, having offices at __________ ("Assignee") or its
designees, all of Assignor's right, title and interest in and to the patent
applications and patents listed below, any patents issuing on any patent
applications listed below, the inventions disclosed in any of the foregoing, any
and all counterpart United States, international and foreign patents,
applications and certificates of invention based upon or covering any portion of
the foregoing and all reissues, divisionals, renewals, extensions, provisionals,
continuations and continuations-in-part of any of the foregoing (collectively
"Patent Rights"):
PATENT OR APPLICATION
NUMBER COUNTRY ISSUE OR FILING DATE TITLE AND INVENTOR(S)
--------------------- ------- -------------------- ---------------------
--------------------- ------- -------------------- ---------------------
Assignor represents, warrants and covenants that: (i) it is the sole owner,
assignee and holder of record title to the Patent Rights identified above, (ii)
it has obtained and properly recorded previously executed assignments for all
patent applications and patents identified above as necessary to fully perfect
its rights and title therein in accordance with governing law and regulations in
each respective jurisdiction, and (iii) it has full power and authority to make
the present assignment. Assignor shall indemnify and hold harmless Assignee for
any breach of the foregoing.
Assignor further agrees to and hereby does sell, assign, transfer and convey
unto Assignee all rights: (i) in and to causes of action and enforcement rights
for the Patent Rights including all rights to pursue damages, injunctive relief
and other remedies for past and future infringement of the Patent Rights, and
(ii) to apply in any or all countries of the world for patents, certificates of
invention or other governmental grants for the Patent Rights, including without
limitation under the Paris Convention for the Protection of Industrial Property,
the International Patent Cooperation Treaty, or any other convention, treaty,
agreement or understanding. Assignor also hereby authorizes the respective
patent office or governmental agency in each jurisdiction to issue any and all
patents or certificates of invention which may be granted upon any of the Patent
Rights in the name of Assignee, as the assignee to the entire interest therein.
-1-
21
Assignor will, at the reasonable request of Assignee and without demanding any
further consideration therefor, do all things necessary, proper, or advisable,
including without limitation the execution, acknowledgment and recordation of
specific assignments, oaths, declarations and other documents on a
country-by-country basis, to assist Assignee in obtaining, perfecting,
sustaining, and/or enforcing the Patent Rights. Such assistance shall include
providing, and obtaining from the respective inventors, prompt production of
pertinent facts and documents, giving of testimony, execution of petitions,
oaths, powers of attorney, specifications, declarations or other papers and
other assistance reasonably necessary for filing patent applications, complying
with any duty of disclosure, and conducting prosecution, reexamination, reissue,
interference or other priority proceedings, opposition proceedings, cancellation
proceedings, public use proceedings, infringement or other court actions and the
like with respect to the Patent Rights.
The terms and conditions of this Assignment shall inure to the benefit of
Assignee, its successors, assigns and other legal representatives, and shall be
binding upon Assignor, its successor, assigns and other legal representatives.
IN WITNESS WHEREOF this Assignment of Patent Rights is executed at __________,
on __________.
ASSIGNOR
By:
_____________________________________________
Name:
_____________________________________________
(Notarization Required) Title:
_____________________________________________
State of )
)
______________________________ County of )
Name
On _________, 1997, before me, _________,
personally appeared ____________________'
[ ] personally known to me or [ ] proved
______________________________ to me on the basis of staisfactory
Date evidence, to be the person whose name is
subscribed to the within instrument and
acknowleged to me that he/she executed
the same in his/her authorized capacity,
and that by his/her signature on the
instrument the person or the entity upon
behalf of which the person acted,
executed the instrument.
WITNESS my hand and offical seal.
_________________________________________
(Notary Public)
-2-
22
Exhibit D
Patent Applications
HEAT SINK PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
AU-278 Heatsink structure for X.X. Xxxx 95-34075 Nov 17, '95 Aug 28, '98 Anam Notice of
semiconductor package (Forming Allowance
a plural of Ni/Pd layer on
heatsink)
----------------------------------------------------------------------------------------------------------------------------------
AP-392 Structure of semiconductor0 X.X. Xxxx 96-06301 Mar 11, '96 Oct 30, '98 Anam Notice of
package (Making ground ring at Allowance
the heatsink)
----------------------------------------------------------------------------------------------------------------------------------
BGA PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
AP-242 BGA semiconductor package circuit W.Y. Pyo 95-25173 Aug 16, '95 Nov 9, '98 Anam Notice of
board structure of using the Allowance
solderballs as I/O part
----------------------------------------------------------------------------------------------------------------------------------
AP-296 Humidity per coating prevention X.X. Xxx 95-54766 Dec 22, '95 Sep 11, '98 Anam Notice of
structure of BGA semiconductor Allowance
package
----------------------------------------------------------------------------------------------------------------------------------
AP-390 Structure of BGA semiconductor X.X. Xxx 96-05344 Feb 29, '96 Oct 30, '98 Anam Notice of
package and method of manufacturing Allowance
the same (CSP BGA)
----------------------------------------------------------------------------------------------------------------------------------
AP-400 Structure of PCB substrate of X.X. Xxx 96-09779 Apr 1, '96 Nov 27, '98 Anam Notice of
BGA semiconductor package Allowance
----------------------------------------------------------------------------------------------------------------------------------
AP-401 BGA semiconductor package M.E. Xxx 96-09780 Apr 1, '96 Nov 27, '98 Anam Notice of
Allowance
----------------------------------------------------------------------------------------------------------------------------------
AP-545 The Structure of semiconductor X.X. Xxx 96-62306 Dec 6, '96 Anam
package (BGA - Using half-etching
& one-side molding)
----------------------------------------------------------------------------------------------------------------------------------
AP-576 BGA semiconductor package X.X. Xxxx 96-77898 Dec 30, '96 Anam
built-in carrier frame
----------------------------------------------------------------------------------------------------------------------------------
-1-
23
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
AP-577 BGA semiconductor package with X.X. Xxxx 96-77899 Dec 30, '96 Anam
carrier frame
----------------------------------------------------------------------------------------------------------------------------------
AP-610 BGA semiconductor package with X.X. Xxxx 97-02503 Jan 28, '97 Anam
heatsink
----------------------------------------------------------------------------------------------------------------------------------
AP-612 Free-delamination pad for BGA X.X. Xxxx 97-02505 Jan 28, '97 Anam
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
AP-613 BGA semiconductor package with X.X. Xxx 97-02506 Jan 28, '97 Anam
heatsink
----------------------------------------------------------------------------------------------------------------------------------
AP-615 BGA semiconductor package using X.X. Xxx 97-04430 Feb 14, 97 Anam
the flexible circuit board
----------------------------------------------------------------------------------------------------------------------------------
AP-616 The method of forming solder-ball X.X. Xxxx 97-04431 Feb 14, '97 Anam
land and BGA semiconductor package
including the same
----------------------------------------------------------------------------------------------------------------------------------
AP-916 Molding device of ball grid array X.X. Xxx 98-37203 Sep 9, '98 Anam
semiconductor using a carrier
frame
----------------------------------------------------------------------------------------------------------------------------------
AP-919 Attaching method of flexible S.H. Ha 98-37630 Sep 11, '98 Anam
circuit board on carrier frame
for ball grid array semiconductor
package
----------------------------------------------------------------------------------------------------------------------------------
AP-923 Structure of BGA semiconductor D.H. Park 98-37970 Sep 15, '98 Anam
packages with cavity down type
----------------------------------------------------------------------------------------------------------------------------------
AP-926 Structure of ball grid array L.G Ham 98-38259 Sep 16, '98 Anam
semiconductor package using
flexible circuit board strip
----------------------------------------------------------------------------------------------------------------------------------
LEADFRAME PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
AP-233 Structure of semiconductor X.X. Xxxx 95-19587 Jul 5, '95 Nov 9, '98 Anam Notice of
package (Paddleless) Allowance
----------------------------------------------------------------------------------------------------------------------------------
AP-397 Semiconductor package and method X.X. Xxxx 96-09776 Apr 1, '96 Nov 30, '96 Anam Notice of
of manufacturing the same (BLP) Allowance
----------------------------------------------------------------------------------------------------------------------------------
AP-649 Area array bumped semiconductor X.X. Xxxx 97-18509 May 13, '97 Anam
package
----------------------------------------------------------------------------------------------------------------------------------
AP-650 The method forming area array X.X. Xxxx 97-18510 May 13, '97 Anam
burned semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
-2-
24
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
AP-660 Grid array leadframe and lead X.X. Xxx 97-24409 Jun 12, '97 Anam
grid array semiconductor package
using the same
----------------------------------------------------------------------------------------------------------------------------------
AP-760 Array type semiconductor package X.X. Xxx 97-54507 Oct 23, '97 Anam
using lead frame and its method
----------------------------------------------------------------------------------------------------------------------------------
AP-762 Array type semiconductor package X.X. Xxx 97-54509 Oct 23, '97 Anam
using lead frame and its method
----------------------------------------------------------------------------------------------------------------------------------
WAFER SCALE PACKAGING
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
AP-623 Structure and manufacturing X.X. Xxx 97-04652 Feb 17, '97 Anam
method for flip-ship
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
AP-763 Semiconductor package for a flip X.X. Xxx 97-54510 Oct 23, '97 Anam
chip and its manufacturing method
----------------------------------------------------------------------------------------------------------------------------------
AP-959 A flexible film for semiconductor D.S. You 98-47798 Nov 06, '98 Anam
packages
----------------------------------------------------------------------------------------------------------------------------------
AP-964 Flexible substrate structure and X.X. Xxx 98-48929 Nov 14, '98 Anam
semiconductor packages and
manufacturing method with the
structure
----------------------------------------------------------------------------------------------------------------------------------
AP-761 Ball grid array semiconductor X.X. Xxxx 97-54508 Oct 23, '97 Anam
package using a silicon substrate
----------------------------------------------------------------------------------------------------------------------------------
PKG PATENTS
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
10 Thin BGA semiconductor package 95-25172
with exposed heatsink
----------------------------------------------------------------------------------------------------------------------------------
11 BGA semiconductor package circuit 95-25173
board structure of using the
solderballs as I/O part
----------------------------------------------------------------------------------------------------------------------------------
12 Ball grid array semiconductor 95-41438
package with ring-type heatsink
----------------------------------------------------------------------------------------------------------------------------------
13 Semiconductor chip bonding method 95-41845
and structure for using solder ball
----------------------------------------------------------------------------------------------------------------------------------
14 Humidity per coating prevention 95-54766
structure of BGA semiconductor
package
----------------------------------------------------------------------------------------------------------------------------------
-3-
25
No. Title Inventor Appl No. Filing Date Req. Date Patent Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
15 Semiconductor package for using 95-69093
solderballs and leads as
I/O terminal
----------------------------------------------------------------------------------------------------------------------------------
16 BGA semiconductor package 95-69098
----------------------------------------------------------------------------------------------------------------------------------
17 Structure of BGA semiconductor 96-05344
package and method of manufacturing
the same (CSP BGA)
----------------------------------------------------------------------------------------------------------------------------------
18 Method of producing BGA 96-05345
semiconductor package metal carrier
frame and BGA package produced by
such method
----------------------------------------------------------------------------------------------------------------------------------
19 Method of manufacturing 96-06302
semiconductor package and
structure produced by such method
(CSP: Making solder bump on
chip pad)
----------------------------------------------------------------------------------------------------------------------------------
20 Semiconductor package and method 96-09776
of manufacturing the same (BLP)
----------------------------------------------------------------------------------------------------------------------------------
21 BGA semiconductor package 96-09777
----------------------------------------------------------------------------------------------------------------------------------
22 Structure of PCB substrate of BGA 96-09779
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
23 BGA semiconductor package 96-09780
----------------------------------------------------------------------------------------------------------------------------------
24 Method of molding BGA semiconductor
attached heatsink 96-22903
25 Stacking BGA semiconductor package 96-41464
----------------------------------------------------------------------------------------------------------------------------------
26 BGA semiconductor package 96-43844
----------------------------------------------------------------------------------------------------------------------------------
27 BGA semiconductor package 96-62300
----------------------------------------------------------------------------------------------------------------------------------
28 Semiconductor package 96-62301
----------------------------------------------------------------------------------------------------------------------------------
29 BGA semiconductor package 96-62302
----------------------------------------------------------------------------------------------------------------------------------
-4-
26
No. Title Inventor Appl No. Filing Date Req. Date Patent No. Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
30 The structure of semiconductor 96-62306
package (BGA: Using half-etching &
one-sided molding
----------------------------------------------------------------------------------------------------------------------------------
31 Structure and method of BGA 96-65236
semiconductor package with heatsink
----------------------------------------------------------------------------------------------------------------------------------
32 Structure and manufacturing method 96-74115
of semiconductor package (Attaching
internally double chip on leadframe)
----------------------------------------------------------------------------------------------------------------------------------
33 The structure of PCB for BGA 96-74117
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
34 Printed circuit for ball grid array 96-74120
semiconductor package and method
for molding ball grid array
semiconductor package using the same
----------------------------------------------------------------------------------------------------------------------------------
35 BGA semiconductor package built-in 96-77898
carrier frame
----------------------------------------------------------------------------------------------------------------------------------
36 BGA semiconductor package with 96-77899
carrier frame
----------------------------------------------------------------------------------------------------------------------------------
37 Flexible circuit board of die flag 96-77900
for BGA semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
38 Flexible circuit board of die flag 96-77901
for BGA semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
39 Flexible circuit board of die flag 96-77902
for BGA semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
40 The structure of semiconductor 96-77931
with carrier frame
----------------------------------------------------------------------------------------------------------------------------------
41 BGA semiconductor package with 97-02503
heatsink
----------------------------------------------------------------------------------------------------------------------------------
42 The singulation method of BGA 97-02504
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
43 Free-delamination pad for BGA 97-02505
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
44 BGA semiconductor package with 97-02506
heatsink
----------------------------------------------------------------------------------------------------------------------------------
45 BGA semiconductor package using 97-0443 0
flexible circuit board
----------------------------------------------------------------------------------------------------------------------------------
46 Semiconductor package (PGA) 97-04432
----------------------------------------------------------------------------------------------------------------------------------
-5-
27
No. Title Inventor Appl No. Filing Date Req. Date Patent No. Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
47 Semiconductor package (Using 97-04433
the pin-type of metal sheet)
----------------------------------------------------------------------------------------------------------------------------------
48 BGA semiconductor package 97-04653
----------------------------------------------------------------------------------------------------------------------------------
49 Structure and manufacturing method 97-04656
of BGA
----------------------------------------------------------------------------------------------------------------------------------
50 Ball grid array semiconductor 97-04657
package
----------------------------------------------------------------------------------------------------------------------------------
51 The structure of semiconductor 97-06062
package
----------------------------------------------------------------------------------------------------------------------------------
52 Semiconductor package (Attaching 97-18551
heatsink on the top of chip)
----------------------------------------------------------------------------------------------------------------------------------
53 Semiconductor package (Attaching 97-18507
the leadframe of array type at
the bottom of package)
----------------------------------------------------------------------------------------------------------------------------------
54 Area array bumped semiconductor 97-18509
package
----------------------------------------------------------------------------------------------------------------------------------
55 The method forming area array 97-18510
bumped semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
56 Semiconductor package (Making 97-18623
test terminals in circuit test)
----------------------------------------------------------------------------------------------------------------------------------
57 Semiconductor package (BGA) 97-18624
----------------------------------------------------------------------------------------------------------------------------------
58 Semiconductor package (Attaching 97-18629
coupling agent for preventing crack
& popcorn from PCB)
----------------------------------------------------------------------------------------------------------------------------------
59 Ball grid array semiconductor 97-54508
package suing a silicon substrate
----------------------------------------------------------------------------------------------------------------------------------
60 Array type semiconductor package 97-54509
suing lead frame and its method
----------------------------------------------------------------------------------------------------------------------------------
61 Printed circuit board of wafer 97-64123
taped chip scale package and method
of routing it
----------------------------------------------------------------------------------------------------------------------------------
62 Ball grid array semiconductor 97-64125
package
----------------------------------------------------------------------------------------------------------------------------------
63 Structure of micro film for micro 97-43970
ball grid array semiconductor
package
----------------------------------------------------------------------------------------------------------------------------------
-6-
28
No. Title Inventor Appl No. Filing Date Req. Date Patent No. Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
64 Structure of fan-in TAB lead for 97-43971
micro-film for a semiconductor
package
----------------------------------------------------------------------------------------------------------------------------------
65 Structure of micro film for micro 97-43972
ball grid array semiconductor
package
----------------------------------------------------------------------------------------------------------------------------------
66 Structure of micro film for micro 97-43973
ball grid array semiconductor
package
----------------------------------------------------------------------------------------------------------------------------------
67 Structure of micro film for micro 97-43974
ball grid array semiconductor
package
----------------------------------------------------------------------------------------------------------------------------------
68 Structure of micro film for micro 97-43975
ball grid array semiconductor
package
----------------------------------------------------------------------------------------------------------------------------------
69 Structure of micro film for micro 97-43976
ball grid array semiconductor
package
----------------------------------------------------------------------------------------------------------------------------------
70 Structure of chip array ball grid 97-79222
array semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
71 Ball grid array semiconductor 97-79225
package using a flexible circuit
board
----------------------------------------------------------------------------------------------------------------------------------
72 Ball grid array semiconductor 97-79228
package using a flexible circuit
board
----------------------------------------------------------------------------------------------------------------------------------
73 Singulation method of ball grid 97-79230
array semiconductor package using
a flexible circuit board strip
----------------------------------------------------------------------------------------------------------------------------------
74 Ball grid array semiconductor 97-79232
package using a flexible circuit
board and its manufacturing method
----------------------------------------------------------------------------------------------------------------------------------
75 Semiconductor package 98-12364
----------------------------------------------------------------------------------------------------------------------------------
76 Structure of semiconductor package 98-09915
----------------------------------------------------------------------------------------------------------------------------------
77 Structure of BGA-semiconductor 98-09916
package
----------------------------------------------------------------------------------------------------------------------------------
78 Printed circuit board for 98-36897
semiconductor package for
preventing static electricity
----------------------------------------------------------------------------------------------------------------------------------
79 Printed circuit board for 98-36898
semiconductor package for
preventing static electricity
----------------------------------------------------------------------------------------------------------------------------------
80 Attaching method of flexible circuit 98-37630
board on carrier frame for ball
grid array semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
-7-
29
No. Title Inventor Appl No. Filing Date Req. Date Patent No. Assignee Remark
----------------------------------------------------------------------------------------------------------------------------------
81 Structure of BGA semiconductor 98-37970
packages with cavity down type
82 Structure of ball grid array 98-38259
semiconductor package using
flexible circuit board strip
83 Micro ball grid array 98-40125
semiconductor package
84 Semiconductor package and its 98-48046
manufacturing method
85 Flexible circuit board and 98-25418
semiconductor packages using it
Exhibit E
Type B Patents
I. Korean Patents and Applications
----------------------------------------------------------------------------------------------------------------------------------
APPLICATION NO. TITLE INVENTOR APPLICATION DATE ISSUE NO.
----------------------------------------------------------------------------------------------------------------------------------
87-15336 Marking apparatus of leadframe for assembling semiconductor X.X. Xxxx 87/9/8 U0 49666
----------------------------------------------------------------------------------------------------------------------------------
91-16361 Pad cleaner of marking machine for semiconductor device X.X. Xxxx 91/9/19 P0 70556
----------------------------------------------------------------------------------------------------------------------------------
91-16589 Method and apparatus of lead bending for surface mounting device X.X. Xxxx 91/9/24 P0 81093
----------------------------------------------------------------------------------------------------------------------------------
91-22233 Method and apparatus of cam form for IC package K.C. Park 91/12/5 P0 81833
----------------------------------------------------------------------------------------------------------------------------------
92-03869 Method and apparatus of Forming for surface mounting device X. Xxx 92/3/9 P0 81834
----------------------------------------------------------------------------------------------------------------------------------
-8-
30
----------------------------------------------------------------------------------------------------------------------------------
92-04715 Structure of package for surface mounting device X.X. Xxx 92/3/25 U0 89814
----------------------------------------------------------------------------------------------------------------------------------
92-10285 Method and apparatus of LASER marking for IC package X.X. Xxx 92/6/13 P1 13208
----------------------------------------------------------------------------------------------------------------------------------
92-10526 Heatspreader fixture X.X. Xxx 92/6/13 U0 88640
----------------------------------------------------------------------------------------------------------------------------------
92-26797 Gate cull of quad type intergrated circuit package and gate tiebar X. Xxx 92/12/30 P0 95030
of leadframe (QFP, making the structure of gate tiebar for easily
triming process)
----------------------------------------------------------------------------------------------------------------------------------
92-26798 Matrix structure of dual in line leadframe (PDIP) X.X. Xxx 92/12/30 P1 05768
----------------------------------------------------------------------------------------------------------------------------------
93-03199 Automatic leadframe loader S.Y. Park 93/3/4 P1 05760
----------------------------------------------------------------------------------------------------------------------------------
93-13930 Apparatus for inspecting leadframe bonding C.G. Son 93/7/26 U0 94008
----------------------------------------------------------------------------------------------------------------------------------
93-13931 Apparatus for inspecting intergrated circuit package H.M. Aha 93/7/26 U0 94009
----------------------------------------------------------------------------------------------------------------------------------
93-14164 Feeding system for marking intergrated circuit package X.X. Xxx 93/7/26 P1 18553
----------------------------------------------------------------------------------------------------------------------------------
93-15983 Safe setting method for solder ball for integrated circuit X.X. Xxx 93/8/18 P1 05750
package (BGA)
----------------------------------------------------------------------------------------------------------------------------------
93-15984 Method of decreasing bending for integrated circuit package (BGA) X.X. Xxx 93/8/18 P1 22789
----------------------------------------------------------------------------------------------------------------------------------
93-15986 Apparatus of eliminating gate for intergated circuit package X.X. Xxxx 93/8/18 P1 05749
----------------------------------------------------------------------------------------------------------------------------------
-9-
31
----------------------------------------------------------------------------------------------------------------------------------
93-18223 Structure of heatsink for mounting in intergated circuit package X.X. Xxxx 00/0/00 X0 00000
(Xxxxx Xxxx)
----------------------------------------------------------------------------------------------------------------------------------
93-22858 Loading and unloading apparatus of plating rack S.Y. Park 93/10/30 P1 12771
----------------------------------------------------------------------------------------------------------------------------------
93-25775 Semiconductor leadframe (Xxxxxx supporting lead) X.X. Xxx 93/11/30 P1 22885
----------------------------------------------------------------------------------------------------------------------------------
93-30799 Stucture of leadframe pad (QFP, Tiebar Downset) C.K. Park 93/12/30 U1 05970
----------------------------------------------------------------------------------------------------------------------------------
93-31195 Method of eliminating flash for intergated circuit package and X. Xxx 93/12/30 P1 09990
structure of leadframe hereof (QFP, Tiebar Trim)
----------------------------------------------------------------------------------------------------------------------------------
94-00395 Molding method and device of semiconductor package (MGP Mold) X. Xxx 94/1/12 P1 24549
----------------------------------------------------------------------------------------------------------------------------------
94-01158 Method of manufacturing mold for semiconductor package and structure X. Xxx 94/1/22 P1 27190
of mold thereof (Mold Tool)
----------------------------------------------------------------------------------------------------------------------------------
94-01771 Method of manufacturing ink marking apparatus and structure of ink X.X. Xxxx 94/1/31 P1 27189
marking apparatus (Marking ad)
----------------------------------------------------------------------------------------------------------------------------------
94-01772 Indexing method and apparatus in wire bonding process for X.X. Xxxxx 94/1/31 P1 13187
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
94-01774 Tiebar structure of leadframe (QFP) X. XXX 94/1/31 P1 19059
----------------------------------------------------------------------------------------------------------------------------------
94-02476 Ground terminal X.X. XXX 94/2/8 U1 09467
----------------------------------------------------------------------------------------------------------------------------------
94-03322 Method of recognizing leadframe in wire bonding process for X.X. Xxxxx 94/2/24 P1 21047
semiconductor package (Pattern recognition system)
----------------------------------------------------------------------------------------------------------------------------------
-10-
32
----------------------------------------------------------------------------------------------------------------------------------
94-03494 Heatsink structure of thin package (PQ2) S.D. Xxx 94/2/25 P1 19650
----------------------------------------------------------------------------------------------------------------------------------
94-03820 Heatsink structure (PQ2) S.D. Xxx 94/2/28 P1 24789
----------------------------------------------------------------------------------------------------------------------------------
94-04109 Multi-magazine holder X.X. Xxx 94/3/3 P1 26534
----------------------------------------------------------------------------------------------------------------------------------
94-05635 Semiconductor leadframe (Oxide) X.X. Xxx 94/3/21
----------------------------------------------------------------------------------------------------------------------------------
94-05636 Semiconductor epoxy tool X.X. Xxxxx 94/3/21 P1 21113
----------------------------------------------------------------------------------------------------------------------------------
94-05852 Pick up tool of bonding semiconductor chip (Quad Type) S.I. Xxx 94/3/23 P1 22774
----------------------------------------------------------------------------------------------------------------------------------
94-05967 Surface structure of heatsink for semiconductor package (PQ2) S.D. Xxx 94/3/24 P1 25999
----------------------------------------------------------------------------------------------------------------------------------
94-06063 Structure of leadframe (Tiebar) S.M. Seo 94/3/24 P1 26000
----------------------------------------------------------------------------------------------------------------------------------
94-06064 Structure of heatsink for semiconductor package (PQ2: Making S.D. Xxx 94/3/25 P1 26001
grooves at the center of heatsink
----------------------------------------------------------------------------------------------------------------------------------
94-06289 Pad structure of leadframe (Making holes at the center of paddle S.M. Seo 94/3/28 P1 19651
for preventing delamination rom paddle surface)
----------------------------------------------------------------------------------------------------------------------------------
94-06290 Pad structure of leadframe (Making Down thickness at paddle as S.M. Seo 94/3/28 P1 19652
an ecthing method for free elamination)
----------------------------------------------------------------------------------------------------------------------------------
94-06291 Pad structure of leadframe (consists of double paddle for S.M. Seo 94/3/28 P1 19653
reducing dimension)
----------------------------------------------------------------------------------------------------------------------------------
94-06421 Leadframe structure (Free moisture) S.M. Seo 94/3/29 U1 11266
----------------------------------------------------------------------------------------------------------------------------------
-11-
33
----------------------------------------------------------------------------------------------------------------------------------
94-06742 Tiebar of leadframe(Making holes in tiebar) X.X. Xxx 94/3/31 P1 33014
-----------------------------------------------------------------------------------------------------------------------------------
94-06756 Mold of wire bonding for semiconductor package(Install subheater) X.X. Xxx 94/3/31
-----------------------------------------------------------------------------------------------------------------------------------
94-06775 Injection method of mold compound(Connect electric signal) X.X. Xxx 94/3/31 P1 21114
-----------------------------------------------------------------------------------------------------------------------------------
94-06776 Structure of mold semiconductor package(Air vent) X. Xxx 94/3/31 P1 21112
-----------------------------------------------------------------------------------------------------------------------------------
94-08596 Heatsink feeding apparatus X. Xxx 94/4/22 P1 26529
-----------------------------------------------------------------------------------------------------------------------------------
94-08646 Leadframe of inspecting trimming and forming process K.C. Park 94/4/22 U1 08304
(Identification xxxx)
----------------------------------------------------------------------------------------------------------------------------------
94-09056 Feeding apparatus for ink marking of intergrated circuit package X.X. Xxxx 94/4/27
----------------------------------------------------------------------------------------------------------------------------------
94-09667 Font mask for LASER marking of intergrated circuit package X.X. Xxx 94/5/2 U1 09734
----------------------------------------------------------------------------------------------------------------------------------
94-10643 Copper heatspreader (Making embossed pattern on the central paddle) T.H. Xxx 94/5/16 P1 23424
----------------------------------------------------------------------------------------------------------------------------------
94-10938 Leadframe (Making wave pattern in inner lead) X.X. Xxx 94/5/19 P1 23423
----------------------------------------------------------------------------------------------------------------------------------
94-11454 Pot coupling structure of transfer apparatus X.X. Xxxx 94/5/23
----------------------------------------------------------------------------------------------------------------------------------
94-11455 Transfer apparatus for molding semiconductor package X.X. Xxxx 94/5/23 U1 16194
----------------------------------------------------------------------------------------------------------------------------------
94-13647 Copper Oxide Filled polymer die attach adhesive composition for X.X. Xxxx 94/6/16 P1 24788
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
-12-
34
----------------------------------------------------------------------------------------------------------------------------------
94-14332 Tape for preventing plating and method of plating semiconductor N.H. Xxxx 94/6/22 P1 26273
package
----------------------------------------------------------------------------------------------------------------------------------
94-15996 Relocation structure for cutting xxxxxx I.S. Xxx 94/6/30 U1 14547
----------------------------------------------------------------------------------------------------------------------------------
94-15772 Method and apparatus of ejecting semiconductor chip X.X. Xxxx 94/7/1 P1 42152
----------------------------------------------------------------------------------------------------------------------------------
94-15873 Method of reducing moisture and contamination penetration into X.X. Xxx 94/7/2 P1 28165
microelectronics (Coating oxidation in leadframe)
----------------------------------------------------------------------------------------------------------------------------------
94-16492 Transfer dual molding apparatus X.X. Xxxx 94/7/8
----------------------------------------------------------------------------------------------------------------------------------
94-16948 Leadframe for plastic package (Coating silver in only wire C.K. Park 94/7/8
bonding area)
----------------------------------------------------------------------------------------------------------------------------------
94-18497 Heatsink projected out of semiconductor package X.X. Xxxx 94/7/28 P1 56513
----------------------------------------------------------------------------------------------------------------------------------
94-18498 Mold for molding semiconductor package X.X. Xxxx 94/7/28 P1 56514
----------------------------------------------------------------------------------------------------------------------------------
94-18499 Semiconductor package(Apply new type heatspreader) X.X. Xxxx 94/7/28 P1 56515
----------------------------------------------------------------------------------------------------------------------------------
94-19006 Heatsink projected out of semiconductor package X.X. Xxxx 94/7/28 U1 09468
----------------------------------------------------------------------------------------------------------------------------------
94-19290 Pad of leadframe(Cutting partly pad for free delamination) X.X. Xxxx 94/8/4 P1 56516
----------------------------------------------------------------------------------------------------------------------------------
94-21273 Package for test and method of manufacturing it X.X. Xxxx 94/8/27 P1 44314
----------------------------------------------------------------------------------------------------------------------------------
-13-
35
----------------------------------------------------------------------------------------------------------------------------------
94-21782 Method of molding and structure of mold(Dambarless) X. Xxx 94/8/31 P1 32702
----------------------------------------------------------------------------------------------------------------------------------
94-23007 Leadframe of preventing leakage from solder and epoxy X.X. Xxxx 94/9/7 U1 29005
----------------------------------------------------------------------------------------------------------------------------------
94-22438 Method of manufacturing semiconductor package having heatsink B.T. Dho 94/9/7 P1 37067
(Solder material for preventing it from delamination and crack)
----------------------------------------------------------------------------------------------------------------------------------
94-22439 Method and device of molding for intergrated circuit package X. Xxx 94/9/7 P1 62887
(Dambarless)
----------------------------------------------------------------------------------------------------------------------------------
94-22625 Method and device for molding of intergrated circuit package X. Xxx 94/9/8 P1 42153
(Making a oxdatantlayer on heatspreader)
----------------------------------------------------------------------------------------------------------------------------------
94-22626 Copper Oxide filled polymer die attach adhesive composition for X.X. Xxxx 94/9/8 P1 44312
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
94-22712 Semiconductor package (Making embossed patterns as blocking X.X. Xxx 94/9/9 P1 47420
epoxy wall)
----------------------------------------------------------------------------------------------------------------------------------
94-23309 Semiconductor package (Making a grooved surface in paddle) X.X. Xxxx 94/9/9 U1 33386
----------------------------------------------------------------------------------------------------------------------------------
94-23663 A dry system for leadframe (Making a filtering apparatus in system) N.H. Xxxx 94/9/16 P1 49523
----------------------------------------------------------------------------------------------------------------------------------
94-23431 A printing circuit board in semiconductor package (Making holes X.X. Xxxx 94/9/10 U1 20612
in PCB)
----------------------------------------------------------------------------------------------------------------------------------
94-24279 Apparatus and method of elimination dummy xxxxxx and xxxxxx of K.C. Park 94/9/27 P1 59304
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
94-25860 A method of adhesion of heatsink for semiconductor package X.X. Xxxx 94/10/10 P1 47768
----------------------------------------------------------------------------------------------------------------------------------
-14-
36
----------------------------------------------------------------------------------------------------------------------------------
94-25861 Leadframe (Connecting a plural of line pad & ground line pad) X.X. Xxxx 94/10/10 P1 37068
----------------------------------------------------------------------------------------------------------------------------------
94-26326 Leadframe (Making pattern for connecting signal, powerline and X.X. Xxx 94/10/10 U1 29004
ground at the same time)
----------------------------------------------------------------------------------------------------------------------------------
94-27230 Semiconductor package (Making connections directly from chip X.X. Xxx 94/10/25 P1 86961
pad to PCB)
----------------------------------------------------------------------------------------------------------------------------------
94-28218 Method and apparatus of auto supply wafer S.Y. Park 94/10/31 P1 37828
----------------------------------------------------------------------------------------------------------------------------------
94-29045 Gate insert tip and tool used thereof X.X. Xxxxx 94/11/2 U1 17395
----------------------------------------------------------------------------------------------------------------------------------
94-30309 Driving apparatus of multi magazine for fabrication semiconductor X.X. Xxxx 94/11/16 U1 17628
equipment
----------------------------------------------------------------------------------------------------------------------------------
94-30518 Apparatus of inspecting wire bonding of semiconductor package K.B. Xxx 94/11/19 P1 59967
(Making controller in wire bonding machine)
----------------------------------------------------------------------------------------------------------------------------------
94-30757 Leadframe (Making identation xxxx in out lead) W.Y. Pyo 94/11/21 U1 23589
----------------------------------------------------------------------------------------------------------------------------------
94-31033 Die of forming machine and die tip thereof X.X. Xxx 94/11/23 U1 17412
----------------------------------------------------------------------------------------------------------------------------------
94-31781 Method of adhesive semiconductor package on PCB (Connecting out X.X. Xxxx 94/11/29
lead on PCB as a solder ball)
----------------------------------------------------------------------------------------------------------------------------------
94-32145 Method of eject marking for die bonding and apparatus thereof Y.Y. Moon 94/11/30 P1 65765
(Making a circle of pattern on packaging surface)
----------------------------------------------------------------------------------------------------------------------------------
94-32146 Ram apparatus of mold (Making respectively supporting ram parts) Y.Y. Moon 94/11/30 P1 65764
----------------------------------------------------------------------------------------------------------------------------------
-15-
37
----------------------------------------------------------------------------------------------------------------------------------
94-32642 Ejecting method for die bonding and apparatus thereof X.X. Xxxx 94/12/3
----------------------------------------------------------------------------------------------------------------------------------
94-32909 Automatic strip counter X.X. Xxx 94/12/6
----------------------------------------------------------------------------------------------------------------------------------
94-33257 Lifter(Making masspoint for carring the objectives) X.X. Xxx 94/12/8 U1 09535
----------------------------------------------------------------------------------------------------------------------------------
94-33288 Method of forming character and figure of tray(Easy to I. Hang 94/12/8
detach/Attach the character/Figure logo on tray surface)
----------------------------------------------------------------------------------------------------------------------------------
94-33423 Structure of hot plate for preheating leadframe (Making groove B.T. Dho 94/12/9 U1 17452
on hot plate)
----------------------------------------------------------------------------------------------------------------------------------
94-33831 Magazine holder structure of leadframe loader X.X. Xxx 94/12/13 U1 12218
----------------------------------------------------------------------------------------------------------------------------------
94-33832 Pusher structure of leadframe loader(Making the sensor for X.X. Xxxx 00/00/00 X0 00000
loading leadframe)
----------------------------------------------------------------------------------------------------------------------------------
94-33833 Pusher apparatus of leadframe loader (Making air-cylinder for X.X. Xxxx 94/12/13 U1 29221
loading leadframe)
----------------------------------------------------------------------------------------------------------------------------------
94-33834 Leadframe heater block stracture (Making embossed pattern and X.X. Xxx 94/12/13 U1 17717
fixed gripper heater block)
----------------------------------------------------------------------------------------------------------------------------------
94-33835 Semiconductor package (Connecting a plural of signals for I.K. Park 94/12/13 U1 17716
integrated circuit package)
----------------------------------------------------------------------------------------------------------------------------------
94-33931 Gripper apparatus of leadframe loader for semiconductor package X.X. Xxxx 94/12/13 P1 38057
----------------------------------------------------------------------------------------------------------------------------------
94-33932 Feeding loader apparatus of leadframe loader for semiconductor X.X. Xxxx 94/12/13 P1 38055
package
----------------------------------------------------------------------------------------------------------------------------------
94-33933 Leadframe loader system for semiconductor package X.X. Xxx 94/12/13 P1 27628
----------------------------------------------------------------------------------------------------------------------------------
-16-
38
----------------------------------------------------------------------------------------------------------------------------------
94-33934 Megazine holder of leadframe loader for semiconductor package X.X. Xxxx 94/12/13 P1 27618
----------------------------------------------------------------------------------------------------------------------------------
94-33935 Robot apparatus of leadframe loader for semiconductor package M.H. Park 94/12/13 P1 27619
----------------------------------------------------------------------------------------------------------------------------------
94-33936 Heater block apparatus of leadframe loader for semiconductor package X.X. Xxx 94/12/13 P1 38054
----------------------------------------------------------------------------------------------------------------------------------
94-33993 Pad structure of semiconductor package (Making a plural of heat X.X. Xxx 94/12/14
disppation shapes)
----------------------------------------------------------------------------------------------------------------------------------
94-34165 Leadframe for manufacturing semiconductor package (Preventing D.H. Park 94/12/14 P1 40458
wire shorting)
----------------------------------------------------------------------------------------------------------------------------------
94-34170 Heater block of wire bonding for semiconductor package (Making X.X. Xxxx 94/12/14 P1 38056
a plural of embossed pattern on paddle for preventing crack &
distortion)
----------------------------------------------------------------------------------------------------------------------------------
94-34332 Heatsink for semiconductor package (Making a circle groved pattern X.X. Xxxx 94/12/16 U1 34092
on heatsink)
----------------------------------------------------------------------------------------------------------------------------------
94-34333 Heatsink for semiconductor package (Making a variety of heatsink K.S. Jung 94/12/16
for heat disspation)
----------------------------------------------------------------------------------------------------------------------------------
94-34334 Structure of leadframe (Making slots on pad for preventing thermal X.X. Xxxx 94/12/16
distortion)
----------------------------------------------------------------------------------------------------------------------------------
94-34664 Structure of leadframe for manufacturing semiconductor package K.S. Jung 94/12/16
(Making a variety of pattern for combining molding resin)
----------------------------------------------------------------------------------------------------------------------------------
94-34809 Heater block for wirebonding (Making different steps on heater X.X. Jo 94/12/17 P1 79472
block)
----------------------------------------------------------------------------------------------------------------------------------
94-35635 Structure of leadframe for semiconductor package (Making specific X. Xxx 94/12/21 P1 70022
xxxxxx pattern)
----------------------------------------------------------------------------------------------------------------------------------
-17-
39
----------------------------------------------------------------------------------------------------------------------------------
94-35636 Device and method of molding semiconductor (Dambarless) X. Xxx 94/12/21 P1 72188
----------------------------------------------------------------------------------------------------------------------------------
94-35637 Device and method of molding semiconductor (Making a plural of I.T. Han 94/12/21 P1 43021
gates for same pressure on molding process)
----------------------------------------------------------------------------------------------------------------------------------
94-35246 Apparatus of eliminating particle of apparatus for manufacuring X.X. Xxx 94/12/23 U1 33388
semiconductor package (Making air blower on trim/form appratus)
----------------------------------------------------------------------------------------------------------------------------------
94-35247 Cam floater of equipment for fabricating semiconductor package X.X. Xxxx 94/12/23 U1 17627
----------------------------------------------------------------------------------------------------------------------------------
94-35248 Stroker of floating bar and index for fabricating semiconductor X.X. Xxx 94/12/23 U1 19164
equipment
----------------------------------------------------------------------------------------------------------------------------------
94-35249 Adjusting apparatus of finger pin position for fabricating X.X. Xxx 94/12/23
semiconductor equipment
----------------------------------------------------------------------------------------------------------------------------------
94-35250 Detecting apparatus for setting position of leadframe X.X. Xxx 94/12/23
----------------------------------------------------------------------------------------------------------------------------------
94-35251 Spanking apparatus for fabricating semiconductor equipment X.X. Xxx 94/12/23 U1 17800
----------------------------------------------------------------------------------------------------------------------------------
94-35252 Double forming apparatus for fabricating semiconductor equipment X.X. Xxx 94/12/23 U1 23314
----------------------------------------------------------------------------------------------------------------------------------
94-35253 Detecting apparatus of mis-alignmented package for fabricating X.X. Xxx 94/12/23 U1 17626
semiconductor equipment
----------------------------------------------------------------------------------------------------------------------------------
94-35254 Semiconductor package guide in semiconductor equipment X.X. Xxx 94/12/23 U1 27109
----------------------------------------------------------------------------------------------------------------------------------
94-35255 Feeding apparatus of semiconductor package X.X. Xxx 94/12/23 U1 26333
----------------------------------------------------------------------------------------------------------------------------------
94-35256 Degating apparatus X.X. Xxx 94/12/23 U1 20491
----------------------------------------------------------------------------------------------------------------------------------
-18-
40
----------------------------------------------------------------------------------------------------------------------------------
94-35257 Xxxx pressing apparatus X.X. Xxx 94/12/23 U1 32461
----------------------------------------------------------------------------------------------------------------------------------
94-35258 Detecting apparatus of mis-loading tube for fabricating X.X. Xxxx 94/12/23 U1 20490
semiconductor equipment
----------------------------------------------------------------------------------------------------------------------------------
94-35259 Inserting apparatus of package into tube X.X. Xxx 94/12/23 U1 18231
----------------------------------------------------------------------------------------------------------------------------------
94-36206 Forming machine X.X. Xxxx 94/12/23 P1 38840
----------------------------------------------------------------------------------------------------------------------------------
94-36207 Apparatus of operating slope cam X.X. Xxx 94/12/23 P1 27785
----------------------------------------------------------------------------------------------------------------------------------
94-36208 Tubular feeding method X.X. Xxx 94/12/23 P1 37814
----------------------------------------------------------------------------------------------------------------------------------
94-36219 Method of coating in semiconductor chip X.X. Xxx 94/12/23 P1 67143
----------------------------------------------------------------------------------------------------------------------------------
94-36220 Coating apparatus for semiconductor package X.X. Xxx 94/12/23 P1 67142
----------------------------------------------------------------------------------------------------------------------------------
94-36221 Loader of feeding for coating equipment X.X. Xxx 94/12/23 P1 43020
----------------------------------------------------------------------------------------------------------------------------------
94-36222 Coating machine for semiconductor package X.X. Xxx 94/12/23 P1 67144
----------------------------------------------------------------------------------------------------------------------------------
94-36223 Machine of coating for semiconductor package X.X. Xxx 94/12/23 P1 84714
----------------------------------------------------------------------------------------------------------------------------------
94-36224 Method of operating coating system X.X. Xxx 94/12/23 P1 39266
----------------------------------------------------------------------------------------------------------------------------------
-19-
41
----------------------------------------------------------------------------------------------------------------------------------
94-37167 Method of marking semiconductor package X.X. Xxx 94/12/27
----------------------------------------------------------------------------------------------------------------------------------
94-37168 Leadframe pad structure (Making x-type paddle for reducing paddle X.X. Xxx 94/12/27 P0 201062
dimension)
----------------------------------------------------------------------------------------------------------------------------------
94-38872 Structure of molding for semiconductor package (Making champer Y.Y. Moon 94/12/29 P1 67145
type on the edge of siderail)
----------------------------------------------------------------------------------------------------------------------------------
94-39354 Semiconductor package (Consists of metal cap and advanced adhesive) X.X. Xxx 94/12/30 P1 67141
----------------------------------------------------------------------------------------------------------------------------------
95-00812 Jig of inspecting semiconductor package X.X. Xxx 95/1/20
----------------------------------------------------------------------------------------------------------------------------------
95-00940 Supporting trim die for leadframe I.S. Xxx 95/1/20 P1 43139
----------------------------------------------------------------------------------------------------------------------------------
95-01928 Apparatus of lead sparking for semiconductor package I.S. Xxx 95/2/3 P1 43138
----------------------------------------------------------------------------------------------------------------------------------
95-06328 Structure of feeding belt for equipment of manufacturing X.X. Xxxx 00/0/00 X0 00000
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
95-06329 Apparatus of seperading bottom module X.X. Xxxx 95/3/31 U1 20549
----------------------------------------------------------------------------------------------------------------------------------
95-07361 Transfer molding apparatus S.I. Xxx 95/3/31 P1 72052
----------------------------------------------------------------------------------------------------------------------------------
95-07362 Method and device for forming the lead of PLCC semiconductor package X.X. Xxxx 95/3/31 P1 72051
----------------------------------------------------------------------------------------------------------------------------------
95-07363 Semiconductor leadframe X.X. Xxxx 95/3/31
----------------------------------------------------------------------------------------------------------------------------------
95-09198 Semiconductor package (Connecting between chip and heatsink as PCB) X.X. Xx 95/4/19
----------------------------------------------------------------------------------------------------------------------------------
-20-
42
----------------------------------------------------------------------------------------------------------------------------------
95-10418 Method for leveling solder ball array in BGA semiconductor package X.X. Xxx 95/4/29 P1 79473
----------------------------------------------------------------------------------------------------------------------------------
95-15045 A device for heating periphery of semiconductor mold die X.X. Xxx 95/6/8 P1 45996
----------------------------------------------------------------------------------------------------------------------------------
95-16397 Device for loading leadframe and heatspreader X.X. Xxxxx 95/6/20
----------------------------------------------------------------------------------------------------------------------------------
95-19581 Method and circuit board structure for leveling solder ball in BGA
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
95-19582 BGA simiconductor package with improved heat dissipation and X.X. Xxxx 95/7/5 P1 59987
dehumidification
----------------------------------------------------------------------------------------------------------------------------------
95-19583 Structure of heatsink for semiconductor package (Including Ni & X.X. Xxxx 95/7/5 P1 59985
Pd layer for wire bonding easily)
----------------------------------------------------------------------------------------------------------------------------------
95-19584 Method of manufacturing semiconductor package (Using solder X.X. Xxxx 95/7/5 P0 192226
plating and solder reflow)
----------------------------------------------------------------------------------------------------------------------------------
95-21041 Pad structure of leadframe X.X. Xxx 95/8/16
----------------------------------------------------------------------------------------------------------------------------------
95-21042 Leadframe structure (Making the paddle surface like net) D.H. Park 95/8/16
----------------------------------------------------------------------------------------------------------------------------------
95-21043 Heatsink structure (Making groove on heatsink's surface) X.X. Xxx 95/8/16
----------------------------------------------------------------------------------------------------------------------------------
95-21044 Identifying xxxx for P.W.B. strip X.X. Xxx 95/8/16
----------------------------------------------------------------------------------------------------------------------------------
95-25172 Thin BGA semiconductor package with exposed heatsink X.X. Xxxx 95/8/16 P1 86759
----------------------------------------------------------------------------------------------------------------------------------
95-23884 Structure of semiconductor package (Attaching lead heatsink X.X. Xxxx 95/9/4
on lead surface)
----------------------------------------------------------------------------------------------------------------------------------
95-28770 Auxiliary oil pressure apparatus of mold press for manufacturing X.X. Xxx 95/9/4
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
-21-
43
----------------------------------------------------------------------------------------------------------------------------------
95-28772 Bonding method for the semiconductor chips X.X. Xxxx 95/9/4 P1 86752
----------------------------------------------------------------------------------------------------------------------------------
95-24350 Device of intergrated circuit and method thereof Rorert 95/8/7
----------------------------------------------------------------------------------------------------------------------------------
95-29420 Identifying xxxx for P.W.B strip C.K. Park 95/10/19 U1 43923
----------------------------------------------------------------------------------------------------------------------------------
95-29421 Heatsink structure for semiconductor package (Making groove on X.X. Xxx 95/10/19
the below of heatsink)
----------------------------------------------------------------------------------------------------------------------------------
95-29422 Heatsink structure for semiconductor package X.X. Xxx 95/10/19
----------------------------------------------------------------------------------------------------------------------------------
95-29423 Heatsink structure for semiconductor package (Making groove at X.X. Xxxx 95/10/19
xxxxxx/tiebar)
----------------------------------------------------------------------------------------------------------------------------------
95-36139 Semiconductor package strip (Forming the rectangular of holes in X.X. Xxx 95/10/19
trim/form process for identifying xxxx)
----------------------------------------------------------------------------------------------------------------------------------
95-36140 Semiconductor L.O.C. package structure X.X. Xxx 95/10/19
----------------------------------------------------------------------------------------------------------------------------------
95-36141 PCB manufacturing method and BGA semiconductor package structure X.X. Xxx 95/10/19
of the same
----------------------------------------------------------------------------------------------------------------------------------
95-36142 Tube vibrating device of semiconductor manufacturing equipment X.X. Xxx 95/10/19
----------------------------------------------------------------------------------------------------------------------------------
95-36143 Leadframe of semiconductor package (Making notch for preventing X. Xxx 95/10/19
distortion before trim/form process)
----------------------------------------------------------------------------------------------------------------------------------
95-36144 Marking method of semiconductor package X.X. Xxxx 95/10/19
----------------------------------------------------------------------------------------------------------------------------------
95-36145 Mold die for manufacturing semiconductor package X.X. Xxx 95/10/19
----------------------------------------------------------------------------------------------------------------------------------
95-30143 Heater block structure for wire bonding X.X. Xxx 95/10/25
----------------------------------------------------------------------------------------------------------------------------------
95-30144 Heater block structure for wire bonding D.S. Sho 95/10/25
----------------------------------------------------------------------------------------------------------------------------------
-22-
44
----------------------------------------------------------------------------------------------------------------------------------
95-30145 Dispensing system for die coating X.X. Xxxx 95/10/25
----------------------------------------------------------------------------------------------------------------------------------
95-36947 Solder ball forming method of BGA semiconductor package X.X. Xxxx 95/10/25
----------------------------------------------------------------------------------------------------------------------------------
95-36948 M.C.M. package C.K. Park 95/10/25
----------------------------------------------------------------------------------------------------------------------------------
95-36949 Magazine fixing device of trim/forming apparatus for manufacturing X.X. Xxxx 95/10/25 P1 66561
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
95-36950 Heatsink structure of semiconductor package (Making holes on X.X. Xxx 95/10/25 P0 201063
heatsink)
----------------------------------------------------------------------------------------------------------------------------------
95-37513 Printed circuit board having epoxy barrier around its throughout X.X. Xxx 95/10/27 P1 70024
slot and ball grid array semiconductor package using such a printed
circuit board, thereby exhibiting a high moisture discharge
characteristic
----------------------------------------------------------------------------------------------------------------------------------
95-33139 Forming punch of manufacturing equipment for semiconductor package X.X. Xxxx 95/11/11
----------------------------------------------------------------------------------------------------------------------------------
95-33140 Trim die fixing holder of manufacturing equipment for semiconductor X.X. Xxxx 95/11/11
package
----------------------------------------------------------------------------------------------------------------------------------
95-40842 Automatic speed checking apparatus of transfer ram in mold press XX XXXX 95/11/11
of semiconductor manufacturing equipment
----------------------------------------------------------------------------------------------------------------------------------
95-40843 Semiconductor package forming method X.X. Xxxx 95/11/11
----------------------------------------------------------------------------------------------------------------------------------
95-33944 Supply device of semiconductor package inserted into the tube X.X. Xxx 95/11/16
----------------------------------------------------------------------------------------------------------------------------------
95-33945 Semiconductor package lead fixing device X.X. Xxx 95/11/16
----------------------------------------------------------------------------------------------------------------------------------
95-33946 Detecting device for bad tube X.X. Xxx 95/11/16
----------------------------------------------------------------------------------------------------------------------------------
95-33947 Supply device of semiconductor package tube X.X. Xxxx 95/11/16
----------------------------------------------------------------------------------------------------------------------------------
-23-
45
----------------------------------------------------------------------------------------------------------------------------------
95-33948 Marking structure in semiconductor package marking equipment X.X. Xxxx 95/11/16
----------------------------------------------------------------------------------------------------------------------------------
95-41665 Semiconductor package test equipment X.X. Xxxx 95/11/16 P1 71668
----------------------------------------------------------------------------------------------------------------------------------
95-41843 Semiconductor package leadframe manufacturing method and X.X. Xxxx 95/11/17 P0 198313
semiconductor package manufacturing process/structure thereof
----------------------------------------------------------------------------------------------------------------------------------
95-41844 Semiconductor package structure (Making a variety of chemicals X.X. Xxxx 95/11/17
layer for adhesive power)
----------------------------------------------------------------------------------------------------------------------------------
95-41845 Semiconductor chip bonding method and structure for using X.X. Xxx 95/11/17 P0 201379
solder ball
----------------------------------------------------------------------------------------------------------------------------------
95-41846 Using printed circuit board carrier frame for ball grid array
semiconductor package and method for fabricating ball grid array
semiconductor package using the same
----------------------------------------------------------------------------------------------------------------------------------
95-34640 Epoxy mixing apparatus (Using irregular vibration) D.Y. Sho 95/11/21
----------------------------------------------------------------------------------------------------------------------------------
95-34641 Absorpation block of semiconductor package manufacturing method D.Y. Sho 95/11/21
of the same
----------------------------------------------------------------------------------------------------------------------------------
95-42560 Method and structure for manufacturing heatsink of semiconductor X.X. Xxxx 95/11/21
package (Using the method of casting & sintering)
----------------------------------------------------------------------------------------------------------------------------------
95-36372 Capillary of bonding device for manufacturing semiconductor package X.X. Xxxx 95/11/29
----------------------------------------------------------------------------------------------------------------------------------
95-36373 Heatspread safe mounter for semiconductor package X.X. Xxx 95/11/29
----------------------------------------------------------------------------------------------------------------------------------
95-44553 Method and structure for manufacturing semiconductor package (CSP) X.X. Xxxx 95/11/29 P1 80280
----------------------------------------------------------------------------------------------------------------------------------
95-47009 Method and structure for manufacturing semiconductor package (CSP) I.T. Han 95/12/6 P1 78626
----------------------------------------------------------------------------------------------------------------------------------
-24-
46
----------------------------------------------------------------------------------------------------------------------------------
95-38947 Solder ball forming method for BGA semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
95-38855 Leadframe fixing apparatus for semiconductor package I.S. Hwang 95/12/7
----------------------------------------------------------------------------------------------------------------------------------
95-47349 Solder ball safe mounting device in integrated circuit package I.S. Hwang 95/12/7 P1 80281
----------------------------------------------------------------------------------------------------------------------------------
95-45942 Heater block of apparatus for manufacturing semiconductor package X.X. Son 95/12/22
----------------------------------------------------------------------------------------------------------------------------------
95-48972 Leadframe structure for semiconductor package (Reducing the X.X. Xxx 95/12/27 U0 143373
dimension between paddle and lead)
----------------------------------------------------------------------------------------------------------------------------------
95-48973 Pad structure of leadframe (Making spiral shape on leadframe) X.X. Xxxx 95/12/27
----------------------------------------------------------------------------------------------------------------------------------
95-48974 Pad structure of leadframe X.X. Xxx 95/12/27
----------------------------------------------------------------------------------------------------------------------------------
95-58806 Semiconductor package leadframe with stress absorbing means on X.X. Xxxx 95/12/27 P1 91078
fused leads
----------------------------------------------------------------------------------------------------------------------------------
95-58807 Semiconductor package using flip chip technique (CSP) X.X. Xxx 95/12/27
----------------------------------------------------------------------------------------------------------------------------------
95-58808 Frame structure for cleaning mold die (Anodizing metalliclayer X.X. Xxx 95/12/27
or metallic tape)
----------------------------------------------------------------------------------------------------------------------------------
95-58809 Chip size semiconductor package (CSP using substrate attaching X.X. Xxx 95/12/27
anisotropic conductive film and copper foil)
----------------------------------------------------------------------------------------------------------------------------------
95-50614 Semiconductor package (Making dam for preventing delamination X.X. Xxxx 95/12/28
from the top & bottom of paddle)
----------------------------------------------------------------------------------------------------------------------------------
95-50615 Structure of semiconductor package (Paddleless) X.X. Xxxx 95/12/28
----------------------------------------------------------------------------------------------------------------------------------
95-50616 Semiconductor package (Surrounded by metal-cap at the bottom) X.X. Xxx 95/12/28
----------------------------------------------------------------------------------------------------------------------------------
95-50617 Leadframe structure for semiconductor packaging having fused area E.S. Son 95/12/28
----------------------------------------------------------------------------------------------------------------------------------
-25-
47
----------------------------------------------------------------------------------------------------------------------------------
95-50618 Leadframe structure for semiconductor packaging (Making slots on E.S. Son 95/12/28
lead tip for reducing thermal stress)
----------------------------------------------------------------------------------------------------------------------------------
95-50619 Structure of semiconductor package (Attaching the reliable heatsink) X.X. Xxxx 95/12/28
----------------------------------------------------------------------------------------------------------------------------------
95-50620 Plug of tube for shipping semiconductor package (Making a X. Xxxxx 95/12/28
versatile plug)
----------------------------------------------------------------------------------------------------------------------------------
95-61438 Semiconductor package (Making dam for sweeping molding compound) M.Y. Xxx 95/12/28 P1 91076
----------------------------------------------------------------------------------------------------------------------------------
95-61439 Structure of heat slug for semiconductor package (Making wings on X.X. Xx 95/12/28 P1 91077
the peripheral heat plug for gaining locking power)
----------------------------------------------------------------------------------------------------------------------------------
95-61440 Method of manufacturing leadframe (Adding thermal process in X.X. Xxxx 95/12/28
forming process)
----------------------------------------------------------------------------------------------------------------------------------
95-52621 Leadframe structure for semiconductor package (Making tiebar for X.X. Xxx 95/12/29
preventing chip out from chip paddle
----------------------------------------------------------------------------------------------------------------------------------
95-52622 Leadframe structure for semiconductor package (Making a lot of X.X. Xxx 95/12/29
leads for integrated circuit)
----------------------------------------------------------------------------------------------------------------------------------
95-52623 Method for supplying electricity of rectifier during plating A.K. Kang 95/12/29
process by iron plating
----------------------------------------------------------------------------------------------------------------------------------
95-52624 Device for detecting fixed state of leadframe during plating X.X. Xxx 95/12/29
process by iron plating (Attaching the touch sensor at the below of
Iron plating belt)
----------------------------------------------------------------------------------------------------------------------------------
95-52625 Structure for preventing grip belt from sagging during plating A.K. Kang 95/12/29
process by iron plating
----------------------------------------------------------------------------------------------------------------------------------
95-52626 Filtering method of plating liquid in plating process A.K. Kang 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
-26-
48
----------------------------------------------------------------------------------------------------------------------------------
95-53421 Pellet kicker structure for manufacturing semiconductor package Y.J. Kwun 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-53422 Molding apparatus for cutting flash of thin semiconductor package Y.J. Kwun 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-53423 Ink marking area structure of heatsink for semiconductor package X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-53424 Structure of semiconductor package for preventing leakage of D.H. Park 95/12/29
electromagnetic wave
----------------------------------------------------------------------------------------------------------------------------------
95-53425 Method of manufacturing chip size semiconductor package X.X. Xxxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-53426 Tray for semiconductor package (Making supporting pole at the X. Xxxxx 95/12/29
side of tray)
----------------------------------------------------------------------------------------------------------------------------------
95-53427 Heatsink structure for semiconductor package (Making cap type) X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-53428 Heatsink structure for semiconductor package (Making a lot of X.X. Xxxx 95/12/29
stripe on heatsink)
----------------------------------------------------------------------------------------------------------------------------------
95-53429 Structure of installing pad of cam punch for forming X.X. Xxx 95/12/29
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
95-53430 Structure of controlling position of cam punch for forming X.X. Xxx 95/12/29
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
95-53431 Apparatus of operating cam punch for forming semiconductor package X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-53432 Structure of cam punch for forming semiconductor package X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-53433 Structure of cleaning pad for marking semiconductor package H.Y. Moon 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-53434 Structure of semiconductor package (tiebarless & downset less) X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-65450 Semiconductor package (CSP: connecting between chip pad and D.H. Park 95/12/29
bond pad as a gold ball)
----------------------------------------------------------------------------------------------------------------------------------
-27-
49
----------------------------------------------------------------------------------------------------------------------------------
95-65451 Structure of semiconductor package (CSP) X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-65452 Structure of semiconductor package (Trim-less) X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-65453 Method of coating surface of semiconductor package X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-67199 Cam die for forming semiconductor package X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-67200 Mold die for molding semiconductor package X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-67201 Cam punch for forming semiconductor package X.X. Xxx 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-67202 Method of adhesive semiconductor chip and structure of X.X. Xxx 95/12/29
leadframe (QFP)
----------------------------------------------------------------------------------------------------------------------------------
95-67203 Structure of leadframe and method of attaching semiconductor Y.J. Park 95/12/29
package using
----------------------------------------------------------------------------------------------------------------------------------
95-67204 Die of cutting lead J.Y. No 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-67205 Punch of cutting lead I.K. Ko 95/12/29
----------------------------------------------------------------------------------------------------------------------------------
95-55056 Storage box of die-bonded leadframe materials M.S. Park 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
95-55057 Storage box for leadframe stacked magazine during manufacturing X.X. Xxx 95/12/30
package
----------------------------------------------------------------------------------------------------------------------------------
95-55058 Block letter pad attaching structure of marking equipment for X.X. Xxxx 95/12/30
manufacturing semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
95-55059 Semiconductor package (Making holes on PKG-body for controlling X.X. Xxx 95/12/30
loading position)
----------------------------------------------------------------------------------------------------------------------------------
95-55060 Bend reforming device in PCB frame materials X.X. Xxxxx 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
95-69090 Flux spreading method of integrated circuit package X.X. Xxxxx 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
-28-
50
----------------------------------------------------------------------------------------------------------------------------------
95-69091 Block letter plate fixing device of marking apparatus for X.X. Xxxx 95/12/30
manufacturing semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
95-69092 Marking apparatus for manufacturing semiconductor package X.X. Xxxx 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
95-69093 Semiconductor package for using solderballs and leads as I/O Y.S. Son 95/12/30
terminal
----------------------------------------------------------------------------------------------------------------------------------
95-69094 Chip size package structure and manufacturing method thereof S.H. Ha 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
95-69095 Chip size package and manufacturing method thereof S.H. Ha 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
95-69096 Chip size package structure and manufacturing method thereof S.H. Ha 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
95-69097 Chip size package X.X. Xxx 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
95-69098 BGA semiconductor package N.H. Xxxx 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
95-69099 Leadframe of semiconductor package (Making double ring for wire S.D. Xxx 95/12/30
bonding easily power bonding and ground bonding)
----------------------------------------------------------------------------------------------------------------------------------
95-69100 Package heating method during wire bonding process of X.X. Xxxx 95/12/30
manufacturing semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
95-69101 Semiconductor package (CSP) X.X. Xxx 95/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-05342 Die xxxxxx X.X. Song 96/2/29 P0189378
----------------------------------------------------------------------------------------------------------------------------------
96-05343 Wafer map conversion method X.X. Song 96/2/29 P0192216
----------------------------------------------------------------------------------------------------------------------------------
96-05345 Method of producing BGA semiconductor package metal carrier X.X. Xxxx 96/2/29 P0192760
frame and BGA package produced by such method
----------------------------------------------------------------------------------------------------------------------------------
-29-
51
----------------------------------------------------------------------------------------------------------------------------------
96-06302 Method of manufacturing semiconductor package and structure X.X. Xxx 96/3/11 P0192758
produced by such method (CSP: Making solder bump on chip pad)
----------------------------------------------------------------------------------------------------------------------------------
96-06303 Method of forming bump of CSP package (Forming bump on chip pad) X.X. Xxx 96/3/11 P0192759
----------------------------------------------------------------------------------------------------------------------------------
96-09774 Method of manufactuting semiconductor package and structure X.X. Xxx 96/4/1
produced by such method
----------------------------------------------------------------------------------------------------------------------------------
96-09775 Semiconductor package and method of manufacturing the same (BLP) X.X. Xxxx 96/4/1
----------------------------------------------------------------------------------------------------------------------------------
96-09777 BGA semiconductor package M.E. Xxx 96/4/1
----------------------------------------------------------------------------------------------------------------------------------
96-09778 Solder ball land metal structure of BGA semiconductor package M.E. Xxx 96/4/1
----------------------------------------------------------------------------------------------------------------------------------
96-06892 Structure for connecting mold chase of mold for manufacturing X.X. Xxx 96/4/1 U0146456
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
96-14883 Apparatus for changing fixture of UVO3 automatic cleaner X.X. Xxx 96/6/4 U0148893
----------------------------------------------------------------------------------------------------------------------------------
96-14884 Apparatus for controlling width of guide rail in leadframe loader X.X. Xxx 96/6/4
----------------------------------------------------------------------------------------------------------------------------------
96-14885 Leadframe loader X.X. Xxx 96/6/4
----------------------------------------------------------------------------------------------------------------------------------
96-14886 Handler apparatus of UVO3 automatic cleaner X.X. Xxx 96/6/4 U0148894
----------------------------------------------------------------------------------------------------------------------------------
96-19858 Fixture structure of UVO3 automatic cleaner X.X. Xxx 96/6/4
----------------------------------------------------------------------------------------------------------------------------------
96-19859 Loading and unloading apparatus of UVO3 automatic cleaner X.X. Xxx 96/6/4
----------------------------------------------------------------------------------------------------------------------------------
96-19860 UVO3 automatic cleaner apparatus X.X. Xxx 96/6/4
----------------------------------------------------------------------------------------------------------------------------------
96-16791 Structure of heater block for bonding wire for BGA semiconductor I.S. Yoon 96/6/20
package
----------------------------------------------------------------------------------------------------------------------------------
-30-
52
----------------------------------------------------------------------------------------------------------------------------------
96-16792 Mold structure for molding BGA semiconductor package I.S. Yoon 96/6/20
----------------------------------------------------------------------------------------------------------------------------------
96-16793 Heatsink for semiconductor package X.X. Xxx 96/6/20
----------------------------------------------------------------------------------------------------------------------------------
96-22659 Leadframe structure and method of manufacturing semiconductor X.X. Xxx 96/6/20
package using the same (Making supporting poles near by tiebar)
----------------------------------------------------------------------------------------------------------------------------------
96-22660 Leadframe pad of semiconductor package for improving molding K.O. Xxxx 96/6/20
reliability (Making a plural of adhesive pattern at the
peripheral of paddle)
----------------------------------------------------------------------------------------------------------------------------------
96-22661 Leadframe pad of semiconductor package for improving molding K.O. Xxxx 96/6/20
reliability
----------------------------------------------------------------------------------------------------------------------------------
96-22897 Array chip scale semiconductor package X.X. Xxxx 96/6/21
----------------------------------------------------------------------------------------------------------------------------------
96-22898 Array chip on chip semiconductor package X.X. Xxx 96/6/21
----------------------------------------------------------------------------------------------------------------------------------
96-22899 Lead array leadframe and semiconductor package using the same X.X. Xxx 96/6/21
----------------------------------------------------------------------------------------------------------------------------------
96-22900 Semiconductor package and method of manufacturing the same X.X. Xxx 96/6/21
(paddleless and tiebarless)
----------------------------------------------------------------------------------------------------------------------------------
96-22901 Semiconductor package and method for fabrication the same (CSP) X.X. Xxx 96/6/21
----------------------------------------------------------------------------------------------------------------------------------
96-22902 Leadframe structure and semiconductor package using the same X.X. Xxx 96/6/21 P0198312
(Downset-less)
----------------------------------------------------------------------------------------------------------------------------------
96-22903 Method of molding BGA semiconductor attached heatsink X.X. Xxx 96/6/21
----------------------------------------------------------------------------------------------------------------------------------
96-27617 Structure of socket for BGA semiconductor package X.X. Xxxx 96/7/9
----------------------------------------------------------------------------------------------------------------------------------
96-27618 Leadframe structure and semiconductor package using the same (QFP) X.X. Xxxx 96/7/9
----------------------------------------------------------------------------------------------------------------------------------
-31-
53
----------------------------------------------------------------------------------------------------------------------------------
96-27619 Purity supply system for building wafer X.X. Xxx 96/7/9
----------------------------------------------------------------------------------------------------------------------------------
96-29000 Tray for inspecting reliability of semiconductor package X.X. Xxxx 96/7/18
----------------------------------------------------------------------------------------------------------------------------------
96-29001 Apparatus of inspecting reliability of semiconductor package X.X. Xxxx 96/7/18 P182191
----------------------------------------------------------------------------------------------------------------------------------
96-21510 Structure of megazine X.X. Xxxxx 96/7/22
----------------------------------------------------------------------------------------------------------------------------------
96-21511 Ion plating apparatus for semiconductor package A.K. Kang 96/7/22 U0149178
----------------------------------------------------------------------------------------------------------------------------------
96-21512 Apparatus of inserting semiconductor package X.X. Xxxx 96/7/22
----------------------------------------------------------------------------------------------------------------------------------
96-21513 Loading apparatus of leadframe in ion plating process A.K. Kang 96/7/22 U0146267
----------------------------------------------------------------------------------------------------------------------------------
96-29555 Automatic solder ball placement apparatus X.X. Xxx 96/7/22
----------------------------------------------------------------------------------------------------------------------------------
96-29556 Apparatus of loading PCB of automatic solder ball placement system X.X. Xxxx 96/7/22
----------------------------------------------------------------------------------------------------------------------------------
96-29557 Apparatus of vibrating solder ball mounting members of automatic X.X. Xxx 96/7/22
solder ball placement system
----------------------------------------------------------------------------------------------------------------------------------
96-29558 Robot arm apparatus of automatic solder ball placement system J.Y. Ha 96/7/22
----------------------------------------------------------------------------------------------------------------------------------
96-29559 Apparatus of transferring leadframe of making apparatus for X.X. Xxxx 96/7/22
manufacturing semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
96-30286 Air blow system for semiconductor package X.X. Xxxx 96/7/25 P0201378
----------------------------------------------------------------------------------------------------------------------------------
96-30287 Apparatus for reloading of automatic solder ball placement system X.X. Xxxx 96/7/25
----------------------------------------------------------------------------------------------------------------------------------
96-30486 Structure of establishing circuit position of mold for Y.Y. Moon 96/9/21 U145718
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
-32-
54
----------------------------------------------------------------------------------------------------------------------------------
96-41463 Heatspreader structure (PQIP) X.X. Xxx 96/9/21
----------------------------------------------------------------------------------------------------------------------------------
96-41464 Stacking BGA semiconductor package X.X. Xxx 96/9/21
----------------------------------------------------------------------------------------------------------------------------------
96-41465 Circuit board for BGA semiconductor package for testing electric X.X. Xxx 96/9/21
reliability
----------------------------------------------------------------------------------------------------------------------------------
96-41466 Apparatus of testing electric reliability for semiconductor X.X. Xxx 96/9/21
package (Making prove pin on PCB)
----------------------------------------------------------------------------------------------------------------------------------
96-41467 Heatspreader for semiconductor package X.X. Xxx 96/9/21 P187801
----------------------------------------------------------------------------------------------------------------------------------
96-41468 Semiconductor package structure D.H. Park 96/9/21 P196493
----------------------------------------------------------------------------------------------------------------------------------
96-41470 Mold for BGA semiconductor package Y.Y. Moon 96/9/21 P194362
----------------------------------------------------------------------------------------------------------------------------------
96-41472 PCB clamping apparatus for molding BGA semiconductor package Y.Y. Moon 96/9/21 P196494
----------------------------------------------------------------------------------------------------------------------------------
96-43841 CSP structure and method of manufacturing the same Y.Y. Moon 96/10/4
----------------------------------------------------------------------------------------------------------------------------------
96-43842 CSP structure and method of manufacturing the same X.X. Xxx 96/10/4
----------------------------------------------------------------------------------------------------------------------------------
96-43844 BGA semiconductor package X.X. Xxx 96/10/4
----------------------------------------------------------------------------------------------------------------------------------
96-44452 3th form die holder of trim and form system X.X. Xxx 96/10/7 P0207341
----------------------------------------------------------------------------------------------------------------------------------
96-44453 Singulation die holder of trim and form system X.X. Xxx 96/10/7 P0207342
----------------------------------------------------------------------------------------------------------------------------------
-33-
55
----------------------------------------------------------------------------------------------------------------------------------
96-44454 Form die holder of trim and form system M.H. Park 96/10/7 P189395
----------------------------------------------------------------------------------------------------------------------------------
96-44789 Heatsink-integrated semiconductor package with double X.X. Xxxx 96/10/9
encapsulating parts and method for fabricating the same
----------------------------------------------------------------------------------------------------------------------------------
96-46656 Semiconductor package X.X. Xxx 96/10/18
----------------------------------------------------------------------------------------------------------------------------------
96-46657 Semiconductor package X.X. Xxx 96/10/18
----------------------------------------------------------------------------------------------------------------------------------
96-34290 Wire spool structure of wire bonding apparatus X.X. Xxx 96/10/18
----------------------------------------------------------------------------------------------------------------------------------
96-46948 PCB strip structure and semiconductor package produced by such
method
----------------------------------------------------------------------------------------------------------------------------------
96-46949 CSP semiconductor package and method of manufacturing the same X.X. Xxx 96/10/19
----------------------------------------------------------------------------------------------------------------------------------
96-47915 Solder bumping apparatus X.X. Xxx 96/10/24
----------------------------------------------------------------------------------------------------------------------------------
96-47916 Apparatus of transferring BGA semiconductor package of solder X.X. Xxx 96/10/24
bumping apparatus
----------------------------------------------------------------------------------------------------------------------------------
96-47917 Solder ball mounting apparatus of solder bumping apparatus X.X. Xxx 96/10/24
----------------------------------------------------------------------------------------------------------------------------------
96-47918 Solder tray apparatus of solder bumping apparatus X.X. Xxx 96/10/24
----------------------------------------------------------------------------------------------------------------------------------
96-47919 Apparatus of inspecting adhesion status of solder bumping apparatus X.X. Xxx 96/10/24
----------------------------------------------------------------------------------------------------------------------------------
96-47920 Solder ball unloading apparatus of solder bumping apparatus X.X. Xxx 96/10/24
----------------------------------------------------------------------------------------------------------------------------------
96-47921 Apparatus of inspecting solder ball mounting of solder bumping X.X. Xxx 96/10/24
apparatus
----------------------------------------------------------------------------------------------------------------------------------
96-47922 Loading apparatus of solder bumping apparatus X.X. Xxx 96/10/24
----------------------------------------------------------------------------------------------------------------------------------
-34-
56
----------------------------------------------------------------------------------------------------------------------------------
96-49378 Mold for semiconductor package X.X. Xxx 96/10/29
----------------------------------------------------------------------------------------------------------------------------------
96-49379 Semiconductor package (Making at least one of the via-hole at X.X. Xxx 96/10/29
the bottom in molding process)
----------------------------------------------------------------------------------------------------------------------------------
96-51528 Leadframe for semiconductor package X.X. Xxxx 96/11/1
----------------------------------------------------------------------------------------------------------------------------------
96-58753 Method of manufacturing leadframe having exposed and arrayed X.X. Xxxx 96/11/28
I/O terminal at below surface of semiconductor package(CSP)
----------------------------------------------------------------------------------------------------------------------------------
96-58754 Method of manufacturing leadframe having fused solder ball at X.X. Xxxx 96/11/28
below surface of semiconductor package(CSP)
----------------------------------------------------------------------------------------------------------------------------------
96-58755 Semiconductor package structure(TQFP) X.X. Xxxx 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58756 CSP structure having bottom lead type X.X. Xxxx 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58757 Leadframe structure for CSP X.X. Xxxx 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58758 Method of forming flip chip bump X.X Song 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58759 Lead on chip area array bumped semiconductor package X.X. Xxxx 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58760 Area array bumped semiconductor package having ground and X.X. Xxxx 96/11/28
power lines
----------------------------------------------------------------------------------------------------------------------------------
96-58761 Area array bumped semiconductor package having a plurality of X.X. Xxxx 96/11/28
chips
----------------------------------------------------------------------------------------------------------------------------------
96-58762 Area array bumped semiconductor package having ground and X.X. Xxxx 96/11/28
power lines
----------------------------------------------------------------------------------------------------------------------------------
96-58800 Wafer transfer apparatus of wafer mounting system W.H. Kong 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58801 Alignment of wafer mounting system X.X. Xxx 96/11/28 P199821
----------------------------------------------------------------------------------------------------------------------------------
-35-
57
----------------------------------------------------------------------------------------------------------------------------------
96-58802 Xxxxx apparatus of wafer mounting system W.H. Kong 96/11/28 P199822
----------------------------------------------------------------------------------------------------------------------------------
96-58803 Wafer check of wafer mounting system W.H. Kong 96/11/28 P199823
----------------------------------------------------------------------------------------------------------------------------------
96-58804 Frame check of wafer mounting system W.H. Kong 96/11/28 P199824
----------------------------------------------------------------------------------------------------------------------------------
96-58805 Apparatus of cutting tape of wafer mounting system W.H. Kong 96/11/28 P199825
----------------------------------------------------------------------------------------------------------------------------------
96-58806 Roller apparatus of wafer mounting system X.X. Xxx 96/11/28 P199826
----------------------------------------------------------------------------------------------------------------------------------
96-58807 Tape transfer apparatus of wafer mounting system W.H. Kong 96/11/28 P199827
----------------------------------------------------------------------------------------------------------------------------------
96-58808 Tape tension main tenance detaining of wafer mounting system W.H. Kong 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58809 Station of wafer mounting system W.H. Kong 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58810 Liner of mold for semiconductor package Y.Y. Moon 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58811 Loading bar of mold for semiconductor package Y.Y. Moon 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58812 PCB of BGA semiconductor package Y.Y. Moon 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58813 PCB of BGA semiconductor package Y.Y. Moon 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-58814 PCB transferring apparatus of forming system for BGA Y.Y. Moon 96/11/28
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
96-58815 Cavity plating installation structure of molding device for BGA Y.Y. Moon 96/11/28 P198031
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
-36-
58
----------------------------------------------------------------------------------------------------------------------------------
96-58816 Top moiding structure of molding device for BGA semiconductor Y.Y. Moon 96/11/28 P198032
package
----------------------------------------------------------------------------------------------------------------------------------
96-58817 Wafer mounting method and apparatus for semiconductor package X.X. Xxx 96/11/28
----------------------------------------------------------------------------------------------------------------------------------
96-61958 Trimming method and apparatus for semiconductor package HJ Son 96/12/5
----------------------------------------------------------------------------------------------------------------------------------
96-61959 Apparatus for inspecting trag inner material X.X. Xxx 96/12/5
----------------------------------------------------------------------------------------------------------------------------------
96-62298 Structure and manufacturing method of CSP I.T. Han 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62299 Structure and manufacturing method of CSP I.T. Han 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62300 BGA semiconductor package W.Y. Pyo 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62301 Semiconductor package X.X. Xxx 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62302 BGA semiconductor package W.Y. Pyo 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62303 Structure preventing bending effect from semiconductor package X.X. Xxxx 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62304 Structure and manufacturing method of CSP I.T. Han 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62305 Method for marking poor quality printed
circuit board units of printed circuit
board strip for semiconductor package and
the printed board strip
----------------------------------------------------------------------------------------------------------------------------------
96-62307 The Structure of semiconductor package(The dual type of BGA package) X.X. Xxxx 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62308 The Structure of semiconductor package(Stacking chip on leadframe) X.X. Xxxx 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62309 The molding method of semiconductor package X.X. Xxxx 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62310 Structure of semiconductor package with good heat dissipation X.X. Xxxx 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
-37-
59
----------------------------------------------------------------------------------------------------------------------------------
96-62311 Cleaning method of die X.X. Xxxx 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62312 Manufacturing method of leadframe and CSP using the same X.X. Xxxx 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62313 The structure and manufacturing method of CSP X.X. Xxxx 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62314 The structure of leadframe and semiconductor package using the same I.S. Yoon 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62315 The structure of leadframe for semiconductor package S.M. Seo 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62316 Bond-pad structure of semiconductor chip X.X. Song 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62317 Lead-finger structure of flip-chip board S.M. Seo 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-62318 The structure of flip-chip board X.X. Song 96/12/6
----------------------------------------------------------------------------------------------------------------------------------
96-65236 Structure and method of BGA semiconductor package with heatsink X.X. Xxxx 96/12/13
----------------------------------------------------------------------------------------------------------------------------------
96-65237 Semiconductor package X.X. Xxx 96/12/13
----------------------------------------------------------------------------------------------------------------------------------
96-68819 Nonfunctional metal in clamping area X.X. Xxx 96/12/20
----------------------------------------------------------------------------------------------------------------------------------
96-68820 Structure and manufacturing method of semiconductor package X.X. Xxxx 96/12/20
(Installing luminous diode in chip for malfunctional test)
----------------------------------------------------------------------------------------------------------------------------------
96-74111 The structure of leadframe and semiconductor package using the same X.X. Xxxx 96/12/27
----------------------------------------------------------------------------------------------------------------------------------
96-74112 Structure and manufacturing method of CSP with pin grid array X.X. Xxxx 96/12/27
----------------------------------------------------------------------------------------------------------------------------------
96-74113 Structure and manufacturing method of semiconductor package X.X. Xxxx 96/12/27
----------------------------------------------------------------------------------------------------------------------------------
96-74114 Structure and manufacturing method of semiconductor package X.X. Xxxx 96/12/27
----------------------------------------------------------------------------------------------------------------------------------
-38-
60
----------------------------------------------------------------------------------------------------------------------------------
96-74115 Structure and manufacturing method of semiconductor package X.X. Xxxx 96/12/27
(Attaching internally double chip on leadframe)
----------------------------------------------------------------------------------------------------------------------------------
96-74116 The solderball land of PCB for semiconductor package M.E. Xxx 96/12/27
----------------------------------------------------------------------------------------------------------------------------------
96-74117 The structure of PCB for BGA semiconductor package X.X. Xxx 96/12/27
----------------------------------------------------------------------------------------------------------------------------------
96-74118 Attaching apparatus of solderball for integrated circuit package X.X. Xxx 96/12/27
----------------------------------------------------------------------------------------------------------------------------------
96-74119 The structure of semiconductor package X.X. Xxxx 96/12/27
----------------------------------------------------------------------------------------------------------------------------------
96-64037 Heatspreader for semiconductor package X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77898 BGA semiconductor package built-in carrier frame X.X. Xxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77899 BGA semiconductor package with carrier frame X.X. Xxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77900 Flexible circuit board of die flag for BGA semiconductor package X.X. Xxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77901 Flexible circuit board of die flag for BGA semiconductor package X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77902 Flexible circuit board of die flag for BGA semiconductor package X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77903 Molding apparatus for area array bumped semiconductor package X.X. Xxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77904 The structure of leadframe paddle X.X. Xxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77905 Apparatus dispensing epoxy for semiconductor package X.X. Xxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77906 Apparatus dispensing epoxy for semiconductor package X.X. Xxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77907 The structure of leadframe X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77908 Plasma cleaner for semiconductor apparatus S.H. Ha 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
-39-
61
----------------------------------------------------------------------------------------------------------------------------------
96-77909 Plasma cleaner for semiconductor apparatus
----------------------------------------------------------------------------------------------------------------------------------
96-77915 Attaching method and structure for semiconductor package M.H. Park 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77916 Printed circuit board for BGA semiconductor package X.X. Xx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77917 The structure of non conductive surface for semiconductor package X.X. Xxxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77918 Semiconductor package X.X. Xxxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77919 Leadframe for semiconductor package X.X. Xxx 96/12/30 P199829
----------------------------------------------------------------------------------------------------------------------------------
96-77920 Printed circuit board for BGA semiconductor package X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77921 The apparatus of die-bonding X.X. Xxx 96/12/30 P0206515
----------------------------------------------------------------------------------------------------------------------------------
96-77922 Printed circuit board for BGA semiconductor package X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77923 Back-end auto-inspection system for BGA semiconductor package X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77924 The apparatus providing PCB in back-end auto inspection system X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77925 PCB guide in back-end auto inspection system X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77926 Inspection apparatus in back-end auto-inspection system X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77927 The apparatus transferring PCB in back-end auto-inspection system X.X. Xxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77928 The apparatus outleting PCB in back-end auto-inspection system X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77929 Turn-guide of PCB in back-end auto-inspection system X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
-40-
62
----------------------------------------------------------------------------------------------------------------------------------
96-77930 Grip apparatus of PCB in back-end auto-inspection system X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77931 The structure of PCB for BGA semiconductor package X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77932 The enlarged scale semiconductor package X.X. Xxxxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
96-77933 Structure and method of heatspreader coating surface X.X. Xxx 96/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-01592 Structure and method of CSP X.X. Xxxx 97/1/21
----------------------------------------------------------------------------------------------------------------------------------
97-02504 The sigulration method of BGA semiconductor package X.X. Xxx 97/1/28
----------------------------------------------------------------------------------------------------------------------------------
97-02259 Magazine (Making safely stacked guide ring) B.S. Park 97/2/14
----------------------------------------------------------------------------------------------------------------------------------
97-04432 Semiconductor package (PGA) X.X. Xxxx 97/2/14
----------------------------------------------------------------------------------------------------------------------------------
97-04433 Semiconductor package (Using the pin-type of metal sheet) X.X. Xxxx 97/2/14
----------------------------------------------------------------------------------------------------------------------------------
97-04434 The marking method of semiconductor package X.X. Xxxx 97/2/14
----------------------------------------------------------------------------------------------------------------------------------
97-04435 The method of forming solder-ball land and BGA semiconductor X.X. Xxx 97/2/14
package including the same
----------------------------------------------------------------------------------------------------------------------------------
97-04436 The mounting method of semiconductor package X.X. Xxx 97/2/14
----------------------------------------------------------------------------------------------------------------------------------
97-02323 The structure of printed circuit board X.X. Xxx 97/2/17
----------------------------------------------------------------------------------------------------------------------------------
97-04652 Structure and manufacturing method for flip-chip semiconductor X.X. Xxx 97/2/17
package
----------------------------------------------------------------------------------------------------------------------------------
97-04653 BGA semiconductor package W.Y. Pyo 97/2/17
----------------------------------------------------------------------------------------------------------------------------------
97-04654 Metallic semiconductor package (CSP) X.X. Xxx 97/2/17
----------------------------------------------------------------------------------------------------------------------------------
97-04655 Structure and manufacturing method of CSP X.X. Xxx 97/2/17
----------------------------------------------------------------------------------------------------------------------------------
-41-
63
----------------------------------------------------------------------------------------------------------------------------------
97-04657 Ball grid array semiconductor package S.S. Cha 97/2/17
----------------------------------------------------------------------------------------------------------------------------------
97-04870 CSP semiconductor package using flexible circuit board X.X. Xxxx 97/2/18
----------------------------------------------------------------------------------------------------------------------------------
97-04871 CSP semiconductor package using rigid-flex printed circuit board X.X. Xxxx 97/2/18
----------------------------------------------------------------------------------------------------------------------------------
97-06062 The structure of semiconductor package X.X. Xxx 97/2/26
----------------------------------------------------------------------------------------------------------------------------------
97-06063 Structure and manufacturing method of semiconductor package (CSP) X.X. Xxx 97/2/26
----------------------------------------------------------------------------------------------------------------------------------
97-16918 Input/ouput pad alignment D.H. Park 97/5/1
----------------------------------------------------------------------------------------------------------------------------------
97-16919 CSP semiconductor package using lead on chip I.T. Han 97/5/1
----------------------------------------------------------------------------------------------------------------------------------
97-16920 The structure of leadframe I.T. Han 97/5/1
----------------------------------------------------------------------------------------------------------------------------------
97-09726 The structure of inner-lead clamp X.X. Xxx 97/5/1
----------------------------------------------------------------------------------------------------------------------------------
97-09727 Wire-bonding apparatus and spool holder X.X. Xxxx 97/5/1
----------------------------------------------------------------------------------------------------------------------------------
97-18551 Semiconductor package (Attaching heatsink on the top of chip) W.Y. Pyo 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-18552 Semiconductor package and the method using the same (Eliminating X.X. Xxxx 97/5/13
die attaching process)
----------------------------------------------------------------------------------------------------------------------------------
97-18553 Semiconductor package (Positioning closely bending innerlead X.X. Xxx 97/5/13
for heat dissipation)
----------------------------------------------------------------------------------------------------------------------------------
97-18554 The card structure for packaging directly chip X.X. Xxx 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-18555 Semiconductor package (Attaching adhesive tape on heatsink for X.X. Xxx 97/5/13
preventing shorting)
----------------------------------------------------------------------------------------------------------------------------------
97-10616 A tray for storing semiconductor chip S.M. Seo 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
-42-
64
----------------------------------------------------------------------------------------------------------------------------------
97-10617 A tray for storing semiconductor chip S.M. Seo 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-10618 A tray for storing semiconductor chip X.X. Song 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-18506 CSP semiconductor package X.X. Xxx 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-18507 Semiconductor package (Attaching the leadframe of array type at X.X. Xxx 97/5/13
the bottom of package)
----------------------------------------------------------------------------------------------------------------------------------
97-18508 Method and structure recognizing leadframe for wire bonding X.X. Xxxx 97/5/13
(Making identification xxxx at one of the outline leads)
----------------------------------------------------------------------------------------------------------------------------------
97-18622 Magazine for semiconductor package Y.Y. Moon 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-18623 Semiconductor package (Making test terminals in circuit test) X.X. Xxxx 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-18624 Semiconductor package (BGA) X.X. Xxxx 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-18625 The heater block apparatus of loading leadframe for X.X. Xxx 97/5/13
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-18626 Semiconductor package (Attaching heatsink patterned by X.X. Xxx 97/5/13
protrusion shape)
----------------------------------------------------------------------------------------------------------------------------------
97-18627 Semiconductor package and molding device X.X. Xxxx 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-18628 Printed circuit board for semiconductor package X.X. Xxx 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-18629 Semiconductor package (Attaching coupling agent for preventing X.X. Xxxx 97/5/13
crack & popcorn from PCB)
----------------------------------------------------------------------------------------------------------------------------------
97-10650 Leadframe for semiconductor package X.X. Xxx 97/5/13
----------------------------------------------------------------------------------------------------------------------------------
97-14577 The cleaning apparatus of marking pad X.X. Xxxx 97/6/17
----------------------------------------------------------------------------------------------------------------------------------
97-14578 Inspection apparatus and turning structure for manufacturing X.X. Xxxx 97/6/17
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
-43-
65
----------------------------------------------------------------------------------------------------------------------------------
97-14579 Pushing road apparatus for manufacturing semiconductor package C.H. Ko 97/6/17
----------------------------------------------------------------------------------------------------------------------------------
97-14580 Marking apparatus for manufacturing semiconductor package X.X. Xxx 97/6/17
----------------------------------------------------------------------------------------------------------------------------------
97-14581 The bottom structure of die for manufacturing semiconductor X.X. Xxx 97/6/17
package
----------------------------------------------------------------------------------------------------------------------------------
97-25115 Marking apparatus for manufacturing semiconductor package X.X. Xxxx 97/6/17
----------------------------------------------------------------------------------------------------------------------------------
97-25116 Rotary table apparatus of marking machine for manufacturing X.X. Xxx 97/6/17
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-25117 Input/ouput magazine apparatus for manufacturing semiconductor X.X. Xxxx 97/6/17
package
----------------------------------------------------------------------------------------------------------------------------------
97-25118 Transferring apparatus of marking device for manufacturing X.X. Xxx 97/6/17
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-25119 Turning apparatus of marking device for manufacturing X.X. Xxx 97/6/17
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-17040 Thermalsetting oven apparatus for semiconductor package X.X. Xxxx 97/6/30
----------------------------------------------------------------------------------------------------------------------------------
97-17041 Trim/form apparatus for manufacturing semiconductor package J.Y. Ha 97/6/30
----------------------------------------------------------------------------------------------------------------------------------
97-17042 Tube apparatus for manufacturing semiconductor package J.Y. Ha 97/6/30
----------------------------------------------------------------------------------------------------------------------------------
97-29850 Bond-pad structure for semiconductor chip X.X. Xxxxx 97/6/30
----------------------------------------------------------------------------------------------------------------------------------
97-29851 The controlling device of marking apparatus X.X. Xxx 97/6/30
----------------------------------------------------------------------------------------------------------------------------------
97-31735 A microscope for inspecting wafer X.X. Xxxx 97/7/9
----------------------------------------------------------------------------------------------------------------------------------
97-31960 A cleaning device of semiconductor package B.S. Bea 97/7/10
----------------------------------------------------------------------------------------------------------------------------------
-44-
66
----------------------------------------------------------------------------------------------------------------------------------
97-32795 Pattern recognition system and recognition method of ground X.X. Xxxx 97/7/15
bonding location thereof
----------------------------------------------------------------------------------------------------------------------------------
97-32796 Inner lead clamp construction of wire bonding system for X.X. Xxx 97/7/15
manufacturing semiconductor package and wire bonding method thereof
----------------------------------------------------------------------------------------------------------------------------------
97-26952 Solder ball box of ball bumping system X.X. Xxx 97/6/24
----------------------------------------------------------------------------------------------------------------------------------
97-30513 The electrode tip mount of the wire-bonding system for X.X. Xxxx 97/7/1
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-31199 The marking head in ink-marking system for semiconductor packages K.C. Park 97/7/5
----------------------------------------------------------------------------------------------------------------------------------
97-18255 The heater block of wire-bonder for semiconductor package X.X. Xxx 97/7/10
----------------------------------------------------------------------------------------------------------------------------------
97-18256 The setting-gauge for capillary in wire bonder X.X. Xxx 97/7/10
----------------------------------------------------------------------------------------------------------------------------------
97-18257 The wire spool holder of the wire-bonder X.X. Xxx 97/7/10
----------------------------------------------------------------------------------------------------------------------------------
97-18258 The wire-supply device of the wire-bonder X.X. Xxx 97/7/10
----------------------------------------------------------------------------------------------------------------------------------
97-32093 Removing method and apparatus for the heat from heater block X.X. Xxx 97/7/10
in the wire bonder
----------------------------------------------------------------------------------------------------------------------------------
97-34517 The solder ball bumping system for BGA semiconductor packages X.X. Xxx 97/7/23
----------------------------------------------------------------------------------------------------------------------------------
97-34518 The input apparatus of the solder ball bumping system for BGA X.X. Xxx 97/7/23
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-34519 The pusher of the solder ball bumping system for BGA X.X. Xxx 97/7/23
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-34520 The flow apparatus of the solder ball bumping system for BGA X.X. Xxx 97/7/23
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
-45-
67
----------------------------------------------------------------------------------------------------------------------------------
97-34521 The table of ther solder ball bumping system for BGA X.X. Xxx 97/7/23
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-34522 The material setting apparatus of the solder ball bumping X.X. Xxx 97/7/23
system for BGA semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-34523 The printer of the solder ball bumping system for BGA X.X. Xxx 97/7/23
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-34524 The solder ball supply apparatus of the solder ball bumping X.X. Xxx 97/7/23
system for BGA semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-34525 The sensing apparatus of double ball in the solder ball bumping X.X. Xxx 97/7/23
system for BGA semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-34526 The solder ball tool of the solder ball bumping system for X.X. Xxx 97/7/23
BGA semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-34527 The PCB-exhauster for solder ball bumping system of BGA X.X. Xxx 97/7/23
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-19772 Magazine of semiconductor packages X.X. Xxxxx 97/7/25
----------------------------------------------------------------------------------------------------------------------------------
97-18629 Dotted epoxy inspection system of die bonder for manufacturing X.X. Xxxx 97/7/15
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-18630 Wire spool construction system for manufacturing semiconductor X.X. Xxx 97/7/15
package
----------------------------------------------------------------------------------------------------------------------------------
97-36487 Pattern recognition system for leadframe and its control method H.K. Joh 97/7/31
----------------------------------------------------------------------------------------------------------------------------------
97-39483 The inspection system for BGA semiconductor packages X.X. Xxx 97/8/20
----------------------------------------------------------------------------------------------------------------------------------
97-39484 The supply device of inspection system for BGA semiconductor X.X. Xxxx 97/8/20
packages
----------------------------------------------------------------------------------------------------------------------------------
-46-
68
----------------------------------------------------------------------------------------------------------------------------------
97-39485 The griper of inspection system for BGA semiconductor packages H.D. Xxx 97/8/20
----------------------------------------------------------------------------------------------------------------------------------
97-39486 The material feed device of inspection system for BGA X.X. Xxx 97/8/20
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-39487 The flow device of inspection system for BGA semiconductor H.H. Park 97/8/20
packages
----------------------------------------------------------------------------------------------------------------------------------
97-39488 The flow device of inspection system for BGA semiconductor H.H. Park 97/8/20
packages
----------------------------------------------------------------------------------------------------------------------------------
97-39489 The select device of inspection system for BGA semiconductor X. Xxx 97/8/20
packages
----------------------------------------------------------------------------------------------------------------------------------
97-39490 The material feed tray for BGA semiconductor packages M.E. Xxx 97/8/20
----------------------------------------------------------------------------------------------------------------------------------
97-22674 Operation system of microscope to wafer inspection X.X. Xxxx 97/8/21
----------------------------------------------------------------------------------------------------------------------------------
97-10103 Method of decreasing bending for integrated circuit package (BGA) X.X. Xxx 97/3/24 P122847
----------------------------------------------------------------------------------------------------------------------------------
97-21289 The guide-device of leadframe in trim-form-system for K.C. Park 97/8/1
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-25666 The property remove tray of BGA semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-25668 The property remove tray of BGA semiconductor package X.X. Xxxx 97/8/1
----------------------------------------------------------------------------------------------------------------------------------
97-46504 The mold for semiconductor package X.X. Xxxx 97/9/10
----------------------------------------------------------------------------------------------------------------------------------
97-46505 The heater block of wire-bonding device for semiconductor packages J.Y. Ha 97/9/10
----------------------------------------------------------------------------------------------------------------------------------
97-26383 The epoxy application tool of wafer mounting system off X.X. Xxx 97/9/23
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
-47-
69
----------------------------------------------------------------------------------------------------------------------------------
97-26384 The epoxy application tool of wafer mounting system off Y.H. Park 97/9/23
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-26385 The wafer table establishment structure of wafer mounting K.B. Xxxx 97/9/23
system off semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-49085 Cutting device for tie-bar of leadframe X.X. Oh 97/9/26
----------------------------------------------------------------------------------------------------------------------------------
97-26791 Structure of a heat slug for semiconductor package X.X. Xxx 97/9/26
----------------------------------------------------------------------------------------------------------------------------------
97-49241 Structure of a capillary X.X. Xxxxx 97/9/26
----------------------------------------------------------------------------------------------------------------------------------
97-28504 The package cleaning device of ink marking system for BGA O.K. Xxxx 97/10/14
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-52603 Chip ejection method and device for semiconductor packages X.X. Xxx 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
97-52604 The Top cavity insert structure of mold for semiconductor packages Y.Y. Moon 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
97-52605 The mold of semiconductor packages X.X. Xxx 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
97-52606 Marking method and device of marking system for semiconductor X.X. Xxx 97/10/23
packages
----------------------------------------------------------------------------------------------------------------------------------
97-52607 Uniformly inking device of marking head in marking system for X.X. Xxx 97/10/23
semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-52608 The top cavity insert of mold for semiconductor packages I.S. Xxx 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
97-52609 A Container of wiping fluid for semiconductor packages X.X. Xxx 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
97-52714 Semiconductor packages X.X. Xxxxx 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
97-54505 Tray for storing ball grid array semiconductor package X. X. Xxx 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
-48-
70
----------------------------------------------------------------------------------------------------------------------------------
97-54506 Tube for storing ball grid array semiconductor package X. X. Xxx 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
97-54508 Ball grid array semiconductor package using a silicon substrate X.X. Xxxx 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
97-54510 Semiconductor package for a flip chip and its manufacturing method X.X. Xxx 97/10/23
----------------------------------------------------------------------------------------------------------------------------------
97-54511 Printed circuit board of matrix type X.X. Xxx 97/10/23
-----------------------------------------------------------------------------------------------------------------------------------
97-54512 Flattening method of glob top material surface encapsulated for X.X. Xxxx 97/10/23
apparatus
-----------------------------------------------------------------------------------------------------------------------------------
97-54513 Metal mold for manufacturing semiconductor package X.X. Xxx 97/10/23
-----------------------------------------------------------------------------------------------------------------------------------
97-54514 Lead frame of semiconductor package X.X. Xxx 97/10/23
-----------------------------------------------------------------------------------------------------------------------------------
97-54515 Marking method of a semiconductor package using a laser beam X.X. Xxx 97/10/23
and its apparatus
-----------------------------------------------------------------------------------------------------------------------------------
97-29924 Construction of bond roller for wafer xxxxxxx X.X. Kong 97/10/28
-----------------------------------------------------------------------------------------------------------------------------------
97-29925 Anti-reverse rotation structure of tape roller for wafer mounter X.X. Xxx 97/10/28
-----------------------------------------------------------------------------------------------------------------------------------
97-55636 Wafer mounter having function for attaching barcode label of X.X. Xxx 97/10/28
wafer identification number
-----------------------------------------------------------------------------------------------------------------------------------
97-55637 Wafer mounter for semiconductor equipment W.H. Kong 97/10/28
-----------------------------------------------------------------------------------------------------------------------------------
97-56567 Solder ball array device for ball grid array package I.S. Xxx 97/10/30
-----------------------------------------------------------------------------------------------------------------------------------
97-58067 The epoxy tool of die attach device for semiconductor packages X.X. Xxx 97/11/4
-----------------------------------------------------------------------------------------------------------------------------------
97-58068 The PCB of BGA semiconductor packages D.Y. So 97/11/4
-----------------------------------------------------------------------------------------------------------------------------------
97-58069 The Marking test device of semiconductor packages N.J. Xxxxxx 97/11/4
-----------------------------------------------------------------------------------------------------------------------------------
-49-
71
----------------------------------------------------------------------------------------------------------------------------------
97-58070 The Marking test device of PCB for BGA semiconductor packages X.X. Xxxx 97/11/4
----------------------------------------------------------------------------------------------------------------------------------
97-63195 Magazine clamp for semiconductor packages Y.Y. Moon 97/11/26
----------------------------------------------------------------------------------------------------------------------------------
97-63196 Wire bonding sensing method and sensing means of wire bonding X.X. Xxxx 97/11/26
device for semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
97-64123 Printed circuit board of wafer taped chip scale package and X.X. Xxx 97/11/28
method of routing it
----------------------------------------------------------------------------------------------------------------------------------
97-64124 Dispensing method of glob top for semiconductor package X.X. Xxxx 97/11/28
----------------------------------------------------------------------------------------------------------------------------------
97-64125 Ball grid array semiconductor package X.X. Xxx 97/11/28
----------------------------------------------------------------------------------------------------------------------------------
97-64126 The mold of chip array ball grid array package and mold X.X. Xxx 97/11/28
structure using the same
----------------------------------------------------------------------------------------------------------------------------------
97-64127 Printed circuit board of matrix type and molding method of the same X.X. Xxx 97/11/28
----------------------------------------------------------------------------------------------------------------------------------
97-64128 Mold structure of through gate the for manufacturing X.X. Xxx 97/11/28
semiconductor package and semiconductor package manufacturing
method using the same
----------------------------------------------------------------------------------------------------------------------------------
97-65410 Frame for cleaning mold for manufacturing semiconductor package X.X. Xxx 97/12/2
----------------------------------------------------------------------------------------------------------------------------------
97-72033 Solder ball bumping system for manufacturing semiconductor package X.X.Xxx 97/12/22
----------------------------------------------------------------------------------------------------------------------------------
97-72034 Flux dotting device for manufacturing semiconductor package X.X. Xxxx 97/12/22
----------------------------------------------------------------------------------------------------------------------------------
97-72035 Solder ball bumping method of semiconductor package and its X.X.Xxx 97/12/22
apparatus
----------------------------------------------------------------------------------------------------------------------------------
-50-
72
----------------------------------------------------------------------------------------------------------------------------------
97-72036 Solder ball mounting method of semiconductor package its apparatus X.X. Xxx 97/12/22
----------------------------------------------------------------------------------------------------------------------------------
97-43953 Lead frame structure for semiconductor package S.H. Na 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-43954 Tape automated bonding tool for a semiconductor chip S.G. Ko 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-43955 Transducer holder for wire bonding of a semiconductor chip S.G. Ko 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-43956 Magazine structure for safe keeping lead frame X.X. Xxxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-43957 Blade construction of deflash apparatus for manufacturing K.C. Park 97/12/24
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-43958 Structure of trim/form device for manufacturing semiconductor K.C. Park 97/12/30
package
----------------------------------------------------------------------------------------------------------------------------------
97-43959 Mold for manufacturing semiconductor package using a flexible S.H. Ha 97/12/30
circuit board
----------------------------------------------------------------------------------------------------------------------------------
97-43960 Tube changing device for inserting semiconductor package X.X. Xxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-43961 Structure of singulation die for manufacturing semiconductor X.X. Xxx 97/12/30
package
----------------------------------------------------------------------------------------------------------------------------------
97-43962 Capillary for bonding wire of a semiconductor chip S.G. Ko 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-43963 Xxxx of tray for semiconductor package X.X. Xxx 97/12/29
----------------------------------------------------------------------------------------------------------------------------------
97-43964 Manufacturing device for semiconductor package X.X. Xxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-43965 Manufacturing device for semiconductor package X.X. Xxx 97/12/29
----------------------------------------------------------------------------------------------------------------------------------
97-43966 Lead frame of semiconductor package X.X. Xxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-43967 Paddle structure of lead frame for semiconductor package X.X. Xxxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
-51-
73
----------------------------------------------------------------------------------------------------------------------------------
97-43968 Paddle structure of lead frame for semiconductor package X.X. Xxxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-43969 Press system for cutting paddle of lead frame X.X. Xxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79219 Semiconductor package manufacturing method K.C. Park 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79220 Deflash method for manufacturing semiconductor package and its K.C. Park 97/12/30
apparatus
----------------------------------------------------------------------------------------------------------------------------------
97-79221 Inspecting equipment for wire bonding of a semiconductor chip X.X. Xxxx 97/12/30
and method thereof
----------------------------------------------------------------------------------------------------------------------------------
97-79222 Structure of chip array ball grid array semiconductor package X.X. Xxxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79223 Automatic ball size filtering device of solder ball bumping X.X. Xxx 97/12/30
system for manufacturing semiconductor package and its method
----------------------------------------------------------------------------------------------------------------------------------
97-79224 Manufacturing method of semiconductor package X.X. Xxxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79225 Ball grid array semiconductor package using a flexible circuit S.H. Ha 97/12/30
board
----------------------------------------------------------------------------------------------------------------------------------
97-79226 Adhesive layer structure for manufacturing semiconductor package S.H. Ha 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79227 Attaching method of flexible circuit board on carrier frame for S.H. Ha 97/12/30
ball grid array semiconductor units
----------------------------------------------------------------------------------------------------------------------------------
97-79228 Ball grid array semiconductor package using a flexible circuit S.H. Ha 97/12/30
board
----------------------------------------------------------------------------------------------------------------------------------
97-79229 Solder ball land of ball grid array semiconductor package using S.H. Ha 97/12/30
a flexible circuit board
----------------------------------------------------------------------------------------------------------------------------------
97-79230 Singulation method of ball grid array semiconductor package S.H. Ha 97/12/30
using a flexible circuit board strip and its apparatus
----------------------------------------------------------------------------------------------------------------------------------
-52-
74
----------------------------------------------------------------------------------------------------------------------------------
97-79231 Wire bonding apparatus for manufacturing semiconductor packages X.X. Xxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79232 Ball grid array semiconductor package using a flexible circuit S.H. Ha 97/12/30
board and its manufacturing method
----------------------------------------------------------------------------------------------------------------------------------
97-79233 Picker block of ball bumping system for manufacturing X.X. Xxx 97/12/30
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-79234 Structure of chip size semiconductor package and its sif, Xxxxxxxxx 97/12/30
manufacturing method
----------------------------------------------------------------------------------------------------------------------------------
97-79235 Attaching structure for tube and plug for semiconductor units J.Y. Ha 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79236 Marking apparatus for manufacturing a semiconductor package X.X. Xxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79237 Flux dotting device of ball bumping system for manufacturing X.X. Xxx 97/12/30
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
97-79567 Tube -holder for semiconductor packages J.Y. Ha 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79572 Manufacturing device of semiconductor packages X.X. Xxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79573 Manufacturing device of semiconductor packages X.X. Xxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-79574 Manufacturing device of semiconductor packages X.X. Xxx 97/12/30
----------------------------------------------------------------------------------------------------------------------------------
97-50557 Plating method for out leads of a semiconductor package X.X. Xxx 97/9/30
----------------------------------------------------------------------------------------------------------------------------------
98-03920 Lead frame of semiconductor package X. Xxx 98/3/17
----------------------------------------------------------------------------------------------------------------------------------
98-03926 Electro flame off tip of wire bonding system for manufacturing X.X. Xxxxx 98/3/17
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
98-09104 Printed circuit board for ball grid array semiconductor package
and its manufacturing method
----------------------------------------------------------------------------------------------------------------------------------
-53-
75
----------------------------------------------------------------------------------------------------------------------------------
98-09105 Blade structure for sawing semiconductor wafer and sawing method X.X. Xxx 98/3/17
using the same
----------------------------------------------------------------------------------------------------------------------------------
98-12364 Semiconductor package X.X. Xxx 98/4/8
----------------------------------------------------------------------------------------------------------------------------------
98-06790 Tray loading device of semiconductor package manufacturing J.I. Oh 98/4/28
apparatus
----------------------------------------------------------------------------------------------------------------------------------
98-06791 Ejection device of pick and place system for semiconductor N.H. Xxxx 98/4/28
equipment
----------------------------------------------------------------------------------------------------------------------------------
98-06792 Cassette loading device of mounter system for semiconductor W.H. Kong 98/4/28
equipment
----------------------------------------------------------------------------------------------------------------------------------
98-06793 Feeding device of material for semiconductor package manufacturing N.H. Xxxx 98/4/28
apparatus
----------------------------------------------------------------------------------------------------------------------------------
98-06794 Magazine fixing device of semiconductor package manufacturing W.H. Kong 98/4/28
apparatus
----------------------------------------------------------------------------------------------------------------------------------
98-06795 Gripper device for semiconductor package manufacturing apparatus X.X. Xxx 98/4/28
----------------------------------------------------------------------------------------------------------------------------------
98-06796 Pusher device of semiconductor package manufacturing device W.H. Kong 98/4/28
----------------------------------------------------------------------------------------------------------------------------------
98-06797 Dispenser structure of encapsulation apparatus for manufacturing S.B. Na 98/4/28
semiconductor
----------------------------------------------------------------------------------------------------------------------------------
98-15158 Control method of encapsulation apparatus for manufacturing X.X. Xxx 98/4/28
semiconductor
----------------------------------------------------------------------------------------------------------------------------------
98-15159 Mounter device for semiconductor equipment X.X. Xxx 98/4/28
----------------------------------------------------------------------------------------------------------------------------------
98-19303 Molding method of printed circuit board for semiconductor package X. X. Xxx 98/5/27
----------------------------------------------------------------------------------------------------------------------------------
-54-
76
----------------------------------------------------------------------------------------------------------------------------------
98-19304 Printed Circuit Board X. X. Xxx 98/5/27
----------------------------------------------------------------------------------------------------------------------------------
98-09915 Structure of semiconductor package X.X. Xxx 98/6/11
----------------------------------------------------------------------------------------------------------------------------------
98-09916 Structure of BGA-semiconductor package X.X. Xxx 98/6/11
----------------------------------------------------------------------------------------------------------------------------------
98-21719 Winding method for end-wire of wire-spool X.X. Xxx 98/6/11
----------------------------------------------------------------------------------------------------------------------------------
98-21720 Semiconductor package X.X. Son 98/6/11
----------------------------------------------------------------------------------------------------------------------------------
98-21721 Structure of semiconductor package X.X. Xxxxx 98/6/11
----------------------------------------------------------------------------------------------------------------------------------
98-23666 BGA-semiconductor packages and its manufacturing method S.S. Cha 98/6/23
----------------------------------------------------------------------------------------------------------------------------------
98-12069 Singulation device for manufacturing semiconductor X.X. Xxxxx 98/7/2
----------------------------------------------------------------------------------------------------------------------------------
98-12070 A guide rail structure for semiconductor Y.Y. Cho 98/7/2
----------------------------------------------------------------------------------------------------------------------------------
98-12071 Magazine carrier J.Y. Ha 98/7/2
----------------------------------------------------------------------------------------------------------------------------------
98-12072 Lead frame of semiconductor package X.X. Xxxxx 98/7/2
----------------------------------------------------------------------------------------------------------------------------------
98-27292 Epoxy resin composition for die attachment X.X. Xxxx 98/7/7
----------------------------------------------------------------------------------------------------------------------------------
98-35551 Lead frame structure for semiconductor packages Y.Y. Mun 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35552 Mold structure for semiconductor packages Y.Y. Mun 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35553 Air vent structure of mold for semiconductor packages Y.Y. Mun 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35554 Mold structure for semiconductor packages Y.Y. Mun 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35555 Manufacturing method and mold structure for F-BGA semiconductor Y.Y. Mun 98/8/31
packages
----------------------------------------------------------------------------------------------------------------------------------
-55-
77
----------------------------------------------------------------------------------------------------------------------------------
98-35604 Wire bonding method for manufacturing semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35605 Circuit tape for semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35606 Circuit tape for semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35607 Circuit tape for semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35608 Lamination device of wafer and circuit tape for manufacturing W.H. Kong 98/8/31
semiconductor package and its method
----------------------------------------------------------------------------------------------------------------------------------
98-35609 Attaching device of circuit film and elastomer tape for W.H. Kong 98/8/31
manufacturing semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
98-35610 Heating and pressure capacity of wafer and circuit tape for N.H. Xxxx 98/8/31
manufacturing semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
98-35611 Cutting device of circuit tape attached to wafer for X.X. Xxx 98/8/31
manufacturing semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
98-35612 Solder ball land structure of film for semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35613 Circuit tape applied to manufacture of a semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35614 Manufacturing method of semiconductor package using a circuit tape X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35615 Circuit tape for semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35616 Circuit tape for semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35617 Bonding method of wafer and circuit tape for manufacturing W.H. Kong 98/8/31
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
98-35618 Circuit tape and wafer bonding apparatus for manufacturing W.H. Kong 98/8/31
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
-56-
78
----------------------------------------------------------------------------------------------------------------------------------
98-35619 Encapsulation cure method of semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35620 Marking method for manufacturing semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35621 Solder ball bumping method for manufacturing semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35622 Bonding method of wafer and circuit tape for manufacturing X.X. Xxxx 98/8/31
semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
98-35623 Marking method of semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35624 Manufacturing method of semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-35625 Manufacturing method of semiconductor package X.X. Xxxx 98/8/31
----------------------------------------------------------------------------------------------------------------------------------
98-36897 Printed circuit board for semiconductor package for preventing X.X. Xxx 98/9/8
static electricity
----------------------------------------------------------------------------------------------------------------------------------
98-36898 Printed circuit board for semiconductor package for preventing X.X. Xxx 98/9/8
static electricity
----------------------------------------------------------------------------------------------------------------------------------
98-37201 Semiconductor device X.X. Xxx 98/9/9
----------------------------------------------------------------------------------------------------------------------------------
98-37202 Semiconductor device X.X. Xxx 98/9/9
----------------------------------------------------------------------------------------------------------------------------------
98-37203 Molding device of ball grid array semiconductor using a carrier
frame
----------------------------------------------------------------------------------------------------------------------------------
98-17327 Method for controlling height of bonding block of did bonder X.X. Xxx 98/9/11
----------------------------------------------------------------------------------------------------------------------------------
98-17328 Structure dispenser of resin injection apparatus X.X. Xxx 98/9/11
----------------------------------------------------------------------------------------------------------------------------------
98-17505 Marking device for the lead frame of semiconductor packages B.S. Chung 98/9/15
----------------------------------------------------------------------------------------------------------------------------------
98-17506 Inspection jig for the strip of semiconductor packages S.J. Kim 98/9/15
----------------------------------------------------------------------------------------------------------------------------------
-57-
79
----------------------------------------------------------------------------------------------------------------------------------
98-19770 Carrier frame structure for semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
98-19771 Carrier frame structure for semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
98-37969 Lead frame structure of semiconductor packages Y.H. Choi 98/9/15
----------------------------------------------------------------------------------------------------------------------------------
98-38052 A method for ascer taining wire bonding state of semiconductor C.S. Seo 98/9/15
package
----------------------------------------------------------------------------------------------------------------------------------
98-38258 A method for preventing short of bonding wire between bonding C.H. Woo 98/9/16
pad and lead finger
----------------------------------------------------------------------------------------------------------------------------------
98-38475 Singulation method of ball grid array semiconductor package K.W. Lee 98/9/17
using flexible circuit board strip
----------------------------------------------------------------------------------------------------------------------------------
98-18090 Semiconductor package S.H Ruy 98/9/22
----------------------------------------------------------------------------------------------------------------------------------
98-39241 Mold structure and method for marking COO mark of semiconductor E.H. Pyo 98/9/22
package using the mold structure
----------------------------------------------------------------------------------------------------------------------------------
98-40125 Micro ball grid array semiconductor package J.H. Lee 98/9/26
----------------------------------------------------------------------------------------------------------------------------------
98-46563 Manufacturing method of circuit board sheet for semiconductor Y.G. Park 98/10/31
package
----------------------------------------------------------------------------------------------------------------------------------
98-46564 Semiconductor device I.K. Shim 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46565 Semiconductor device I.K. Shim 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46566 Molding method of semiconductor device I.K. Shim 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46567 Manufacturing method of semiconductor package B.J. Han 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46568 Semiconductor Package Y.G. Park 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46569 Manufacturing method of semiconductor package B.J. Han 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
-58-
80
----------------------------------------------------------------------------------------------------------------------------------
98-46570 Manufacturing method of semiconductor package B.J. Han 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46571 Manufacturing method of semiconductor package B.J. Han 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46572 Semiconductor device I.K. Shim 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46573 Semiconductor device and its manufacturing method I.K. Shim 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46574 Semiconductor package and its manufacturing method C.K. Park 98/10/31
----------------------------------------------------------------------------------------------------------------------------------
98-46847 Manufacturing method and device for semiconductor packages S.H. Kim 98/11/2
----------------------------------------------------------------------------------------------------------------------------------
98-21474 Equipment for fabricating semiconductor package S.G. Kim 98/11/5
----------------------------------------------------------------------------------------------------------------------------------
98-21475 Equipment for fabricating semiconductor package K.N. Kim 98/11/5
----------------------------------------------------------------------------------------------------------------------------------
98-21866 Substrate structure for semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
98-47393 Equipment for fabricating semiconductor package J.H. Yoon 98/11/5
----------------------------------------------------------------------------------------------------------------------------------
98-47394 Equipment for fabricating semiconductor package S.B. Na 98/11/5
----------------------------------------------------------------------------------------------------------------------------------
98-47395 Method for fabricating semiconductor package K.N. Kim 98/11/5
----------------------------------------------------------------------------------------------------------------------------------
98-47396 Equipment for fabricating semiconductor package Y.K. Kwak 98/11/5
----------------------------------------------------------------------------------------------------------------------------------
98-21568 Substrate for semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
98-21569 Structure of flexibility substrate for semiconductor packages S.H. Ha 98/11/6
----------------------------------------------------------------------------------------------------------------------------------
98-47553 Equipment for fabricating semiconductor package Y.Y. Cho 98/11/6
----------------------------------------------------------------------------------------------------------------------------------
98-21866 Substrate structure for semiconductor packages I.G. Han 98/11/11
----------------------------------------------------------------------------------------------------------------------------------
98-21867 Sawing wheel for wafer cutting J.Y. Chung 98/11/11
----------------------------------------------------------------------------------------------------------------------------------
-59-
81
----------------------------------------------------------------------------------------------------------------------------------
98-48927 Structure of flexibility substrate for semiconductor packages D.S. You 98/11/14
----------------------------------------------------------------------------------------------------------------------------------
98-48928 Semiconductor packages and manufacturing method of it Chowdhury, Asif 98/11/14
----------------------------------------------------------------------------------------------------------------------------------
98-48929 Flexible substrate structure and semiconductor packages and S.H. Lee 98/11/14
manufacturing method with the structure
----------------------------------------------------------------------------------------------------------------------------------
98-49057 Substrate structure and manufacturing for semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
98-49058 Substrate structure and manufacturing method for semiconductor D.H. Park 98/11/16
packages
----------------------------------------------------------------------------------------------------------------------------------
98-49059 Substrate structure and manufacturing method for semiconductor D.H. Park 98/11/16
packages
----------------------------------------------------------------------------------------------------------------------------------
98-49060 Strip with display parts and semiconductor packages with the strip S.S. Cha 98/11/16
----------------------------------------------------------------------------------------------------------------------------------
98-22488 Structure of flexibility substrate for semiconductor packages S.H. Ha 98/11/18
----------------------------------------------------------------------------------------------------------------------------------
98-49887 Semiconductor packages and manufacturing method of it C.S. Han 98/11/20
----------------------------------------------------------------------------------------------------------------------------------
98-21618 Semiconductor package manufacturing apparatus G.H. Lee 98/11/7
----------------------------------------------------------------------------------------------------------------------------------
98-21619 Semiconductor package manufacturing apparatus G.H. Lee 98/11/7
----------------------------------------------------------------------------------------------------------------------------------
98-21620 Semiconductor package manufacturing apparatus H.D. Lee 98/11/7
----------------------------------------------------------------------------------------------------------------------------------
98-21621 Semiconductor package manufacturing apparatus C.H. Ko 98/11/7
----------------------------------------------------------------------------------------------------------------------------------
98-21622 Semiconductor package manufacturing apparatus M.H. Park 98/11/7
----------------------------------------------------------------------------------------------------------------------------------
98-21623 Semiconductor package manufacturing apparatus S.W. Lee 98/11/7
----------------------------------------------------------------------------------------------------------------------------------
98-21624 Semiconductor package manufacturing apparatus C.H. Ko 98/11/7
----------------------------------------------------------------------------------------------------------------------------------
-60-
82
----------------------------------------------------------------------------------------------------------------------------------
98-47878 Method for fabricating semiconductor package E.H. Pyo 98/11/9
----------------------------------------------------------------------------------------------------------------------------------
98-47798 A flexible film for semiconductor packges
----------------------------------------------------------------------------------------------------------------------------------
98-48046 Semiconductor package and its manufacturing method D.H. Park 98/11/10
----------------------------------------------------------------------------------------------------------------------------------
98-48047 Semiconductor package B.Y. Min 98/11/10
----------------------------------------------------------------------------------------------------------------------------------
98-48048 Printed circuit board and manufacturing method of printed circuit B.Y. Min 98/11/10
board and semiconductor package using the printed circuit board
----------------------------------------------------------------------------------------------------------------------------------
98-49323 Circuit tape for ball grid array semiconductor package
----------------------------------------------------------------------------------------------------------------------------------
98-52923 Manufacturing method of semiconductor package Y.Y. Cho 98/12/3
----------------------------------------------------------------------------------------------------------------------------------
98-52924 Manufacturing method of semiconductor package J.H. Lee 98/12/3
----------------------------------------------------------------------------------------------------------------------------------
98-54095 Method for fabricating semiconductor package S.H. Lee 98/12/10
----------------------------------------------------------------------------------------------------------------------------------
98-54999 Wire bonding method of semiconductor device S.H. Kim 98/12/15
----------------------------------------------------------------------------------------------------------------------------------
98-25418 Flexible circuit board and semiconductor packages using it I.G. Han 98/12/17
----------------------------------------------------------------------------------------------------------------------------------
98-25419 Flexible circuit board structure for semiconductor package J.E. Hong 98/12/17
----------------------------------------------------------------------------------------------------------------------------------
98-55910 Semiconductor package C.H. Woo 98/12/17
----------------------------------------------------------------------------------------------------------------------------------
98-55911 Semiconductor package and its manufacturing method S.H. Kim(2) 98/12/17
----------------------------------------------------------------------------------------------------------------------------------
96-01240 Method of manufacturing chip size semiconductor package Y.S. Yoon 96/1/22
----------------------------------------------------------------------------------------------------------------------------------
98-63124 Semiconductor package E.S. Sohn 98/12/31
----------------------------------------------------------------------------------------------------------------------------------
98-63125 Semiconductor package S.H. Lee 98/12/31
----------------------------------------------------------------------------------------------------------------------------------
-61-
83
----------------------------------------------------------------------------------------------------------------------------------
98-63126 Semiconductor package J.H. Lee 98/12/31
----------------------------------------------------------------------------------------------------------------------------------
98-63127 Semiconductor package D.S. You 98/12/31
----------------------------------------------------------------------------------------------------------------------------------
98-63822 Semiconductor package and its manufacturing method J.Y. Chung 98/12/31
----------------------------------------------------------------------------------------------------------------------------------
98-27353 Circuit tape for semiconductor device J.H. Yoon 98/12/29
----------------------------------------------------------------------------------------------------------------------------------
98-60454 Manufacturing apparatus of semiconductor device and punching J.H. Yoon 98/12/29
method
----------------------------------------------------------------------------------------------------------------------------------
98-60456 Wire for semiconductor device J.S. Kwak 98/12/29
----------------------------------------------------------------------------------------------------------------------------------
98-62596 Lamination method of semiconductor device and manufacturing I.K. Shim 98/12/30
apparatus
----------------------------------------------------------------------------------------------------------------------------------
98-62597 Test apparatus of semiconductor package and its test method Y.C. Cho 98/12/30
----------------------------------------------------------------------------------------------------------------------------------
98-28225 Wire bonding inspection system for manufacturing semiconductor S.H. Jang 98/12/31
package
----------------------------------------------------------------------------------------------------------------------------------
98-28226 Inspection apparatus of semiconductor device G.H. Lee 98/12/31
----------------------------------------------------------------------------------------------------------------------------------
98-58837 Device for fabricating semiconductor package S.J. Kim 98/12/26
----------------------------------------------------------------------------------------------------------------------------------
98-58838 Method for fabricating semiconductor package S.H. Kim 98/12/26
----------------------------------------------------------------------------------------------------------------------------------
98-59607 PCB board S.J. Kim 98/12/28
----------------------------------------------------------------------------------------------------------------------------------
98-60431 Structure for mold die in fabrication of semiconductor package D.J. Kim 98/12/29
----------------------------------------------------------------------------------------------------------------------------------
98-60432 Lead frame and semiconductor package with such lead frame Y.S. Lee 98/12/29
----------------------------------------------------------------------------------------------------------------------------------
98-60433 Semiconductor package and method for fabricating the same I.G. Han 98/12/29
----------------------------------------------------------------------------------------------------------------------------------
98-27790 Carrier frame for semiconductor packages D.S. You 98/12/29
----------------------------------------------------------------------------------------------------------------------------------
-62-
84
----------------------------------------------------------------------------------------------------------------------------------
98-27791 Wire bonder capillary J.Y. Chung 98/12/30
----------------------------------------------------------------------------------------------------------------------------------
98-27792 Lead frame for semiconductor packages J.Y. Ha 98/12/30
----------------------------------------------------------------------------------------------------------------------------------
98-27793 Magazine for semiconductor packages C.Y. Jang 98/12/30
----------------------------------------------------------------------------------------------------------------------------------
98-61607 Structure of semiconductor package D.S. You 98/12/30
----------------------------------------------------------------------------------------------------------------------------------
98-61608 Structure of semiconductor package Y.S. Lee 98/12/30
----------------------------------------------------------------------------------------------------------------------------------
98-61609 A substrate structure and earthing method for semiconductor S.J. Kim 98/12/30
packages
----------------------------------------------------------------------------------------------------------------------------------
98-61610 Semiconductor packages and manufacturing method of it T.B. Jung 98/12/30
----------------------------------------------------------------------------------------------------------------------------------
98-61611 Cull gripper with output transfer arms of auto molding system J.U. An 98/12/30
for semiconductor packages
----------------------------------------------------------------------------------------------------------------------------------
98-61612 A substrate structure and earthing method for semiconductor packages S.H. Ha 98/12/30
----------------------------------------------------------------------------------------------------------------------------------
Exhibit E, Continued
II. Japanese Patents and Applications
------------------------------------------------------------------------------------------------------------------------------------
APPL NO TITLE INVENTOR(S) FILE DATE PRIORITY PRIORITY DATE PATENT NO ISSUE DATE
------------------------------------------------------------------------------------------------------------------------------------
6-159039 Mold runner removal Young Wook Heo/ 94-7-11 93-15985 3-08-18
from a substrate-based Il Kwon Shim/
packaged electronic Bruce J. Freyman/
device John Briar
------------------------------------------------------------------------------------------------------------------------------------
-63-
85
------------------------------------------------------------------------------------------------------------------------------------
6-297411 Method and device for Goo Lee 96-10-11 93-25829/ 93-11-30/ 2742514 98-1-30
molding of intergrated 94-22439/ 94-09-07/
circuit package (Method) 94-22625 94-09-07
------------------------------------------------------------------------------------------------------------------------------------
6-198341 BGA semiconductor package Young Wook Heo/ 96-8-25 94-2982 /19/93
Il Kwon Shim
------------------------------------------------------------------------------------------------------------------------------------
7-153209 Method of reducing Jae Dong Kim 95-6-20 94-5635/ 94-03-21/ 2622104 97-4-4
delamination between a 94-15873 94-07-02
lead frame and molding
compound
------------------------------------------------------------------------------------------------------------------------------------
7-148910 Copper-oxide filled Choul Woll Kwak 95-6-15 94-13647 4-06-16 2706227 97-10-9
polymer die attach
adhesive composition
for semiconductor
package
------------------------------------------------------------------------------------------------------------------------------------
7-153689 Heat spreader suitable for Myung Jun Lee 95-6-20 94-14028 94-06-21 2592587 96-12-10
commonly used semiconductor
packages having different
pad sizes
------------------------------------------------------------------------------------------------------------------------------------
7-220236 Semiconductor leadframe Won Sun Shin 95-8-29 94-21610/ 94-08-30/ 2820645
having connection bar 94-26326/ 94-10-10/
and guide rings 94-25861 94-10-10
------------------------------------------------------------------------------------------------------------------------------------
-64-
86
------------------------------------------------------------------------------------------------------------------------------------
7-241960 Method for checking wire Young Wook Heo/ 95-9-20 94-24280 94-08-27 2703204 97-10-3
bonding result of BGA Dong Sin Youm
package
------------------------------------------------------------------------------------------------------------------------------------
7-345711 Chip mounting plate Youn Cheol Yoo/ 95-12-12 94-33994/ 4-12-14/ 2767404 4/10/98
construction of lead Hee Yeoul Yoo/ 94-37168 94-12-27
frame for semiconductor Jeong Lee/
package Doo Hyun Park/
In Gyu Han
------------------------------------------------------------------------------------------------------------------------------------
7-346366 Semiconductor package Won Sun Shin/ 95-12-12 94-34663 4-12-16 2660504 97-6-13
with intergral heat Byung Tae Do
dissipator
------------------------------------------------------------------------------------------------------------------------------------
7-352582 Ball grid array Il Kwon Shim/ 95-12-28 95-19582 95-07-05 2887144
semiconductor packages Young Wook Heo
with improved heat
dissipation and
dehumidification effect
------------------------------------------------------------------------------------------------------------------------------------
7-352583 BGA semiconductor package Il Kwon Shim 95-12-28 95-25172 /16/95 2727435 97-12-12
having exposed heat sink
------------------------------------------------------------------------------------------------------------------------------------
-65-
87
------------------------------------------------------------------------------------------------------------------------------------
8-241010 Heat sink-interated Won Sun Shin 95-8-26 95-28771 5-09-04 Notice of Allowance
semiconductor package
with double encapsulating
parts and method for
fabricating the same
------------------------------------------------------------------------------------------------------------------------------------
8-302542 Printed circuit board Sun Ho Ha/ 96-10-28 95-37513 5-10-27 Notice of
having epoxy barrier Young Wook Heo Allowance
around a throughout slot
and ball grid array
semiconductor package
------------------------------------------------------------------------------------------------------------------------------------
8-182798 Ball grid array Il Kwon Shim/ 96-6-24 95-41438 5-11-15 2881575
semiconductor package Young Wook Heo
with ring-type heat sink
------------------------------------------------------------------------------------------------------------------------------------
8-320732 Semiconductor package Won Sun Shin/ 96-11-15 95-41844/ 5-11-17/
provided with heatsink Won Kyun Lee 95-44554 95-11-29
and surface treating
method for such a
heat sink
------------------------------------------------------------------------------------------------------------------------------------
8-182799 Unit printed circuit board Il Kwon Shim/ 96-6-24 95-41846 5-11-17 Notice of
carrier frame for ball Young Wook Heo Allowance
grid array semiconductor
package and method for
fabricating ball grid
array semiconductor
packages using the same
------------------------------------------------------------------------------------------------------------------------------------
-66-
88
------------------------------------------------------------------------------------------------------------------------------------
8-243997 Process for bonding Seong Min Seo/ 96-8-28 95-42561 5-11-21 2727443 97-12-12
semiconductor chip Jae Hwan Song
------------------------------------------------------------------------------------------------------------------------------------
8-354355 Semiconductor chip scale Young Wook Heo 96-12-19 95-54765 5-12-12
package and method of
producing such
------------------------------------------------------------------------------------------------------------------------------------
8-358683 Semiconductor package Kil Bum Kim/ 96-12-27 95-58806 5-12-27 2779789 98-5-15
lead frame with stress Young Seok Jung
absorbing means on
fused leads
------------------------------------------------------------------------------------------------------------------------------------
8-255585 Wafer map conversion Chee Jung Song 96-9-5 96-05343 2/29/96
method
------------------------------------------------------------------------------------------------------------------------------------
9-19725 Method of producing BGA Il Kwon Shim/ 97-1-17 96-05345 2/29/96 Notice of
semiconductor package Young Wook Heo Allowance
metal carrier frame and
BGA package produced by
such method
------------------------------------------------------------------------------------------------------------------------------------
-67-
89
------------------------------------------------------------------------------------------------------------------------------------
9-23144 Method of forming chip Young Wook Heo 97-1-22 96-06302/ 6-03-11
bumps of bumps chip 96-06303
scale semiconductor
package such package
and chip bump
------------------------------------------------------------------------------------------------------------------------------------
9-98041 Solder Ball land metal Moo Eun Lee 97-3-31 96-09778 6-04-01 2860648
structure of ball grid
array semiconductor
package
------------------------------------------------------------------------------------------------------------------------------------
9-24274 Grid array type lead Won Sun Shin/ 97-1-23 96-22897/ 96-06-21
frame and lead end grid Byung Joon Han/ 96-22898/
array semiconductor Ju Hoon Yoon/ 96-22899
package employing the Sung Bum Kwak/
same In Gyu Han
------------------------------------------------------------------------------------------------------------------------------------
8-353644 Semiconductor package Byung Joon Han/ 96-12-17 96-22901 96-06-21 2860646
and method for fabricating Young Wook Heo
the same
------------------------------------------------------------------------------------------------------------------------------------
9-275281 Mold for ball grid array Young Yeop Moon 97-9-22 96-41469/ 6-09-21/
semiconductor package 70/71/72/ 96-11-28
96-58810/
11/15/16
------------------------------------------------------------------------------------------------------------------------------------
-68-
90
------------------------------------------------------------------------------------------------------------------------------------
9-289089 Semiconductor package Seon Goo Lee 97-10-6 96-43843/ 96-10-04/96-10-18
having light, thin 96-46656
simple and compact
structure
------------------------------------------------------------------------------------------------------------------------------------
9-304957 Method for reproducing Sun Ho Ha/ 97-10-20 96-46948 6-10-19 2860651
printed circuit boards for Young Wook Heo/
semiconductor packages Byung Joon Han
including poor quality
printed circuit board
units and method for
fabricating semiconductor
packages using the
reproduced printed
circuit boards
------------------------------------------------------------------------------------------------------------------------------------
9-228831 Method for marking poor Young Wook Heo/ 97-8-11 96-62305 6-12-06
quality printed Il Kwon Shim
circuit board units of
printed circuit board
strip for semiconductor
packages and the printed
circuit board strip
------------------------------------------------------------------------------------------------------------------------------------
-69-
91
------------------------------------------------------------------------------------------------------------------------------------
9-368681 Alumina-silicon carbide Seok Ho Na 97-12-26 96-77897 6-12-30
nanocomposite for ball
bonding capillaries
of wire bonding device
and method of
manufacturing such
------------------------------------------------------------------------------------------------------------------------------------
9-233372 Ball grid array Il Kwon Shim/ 97-8-14 96-77898/ 6-12-30/97-02-14
semiconductor package Young Wook Heo/ 96-77899/
with solder balls fused Robert Frarcis 97-04430
on printed circuit board Darveaux
and method for fabricating
the same
------------------------------------------------------------------------------------------------------------------------------------
9-159227 Flexible circuit for ball Il Kwon Shim/ 97-6-2 96-77900/ 6-12-30
grid array semiconductor Young Wook Heo/ 96-77901/
package Robert Frarcis 96-77902
Darveaux
------------------------------------------------------------------------------------------------------------------------------------
9-368625 Circuit board with Joong Ho Cho/ 97-12-29 96-77919 2/30/96
eye-shaped internal Young Seok Chung/
circuit tip alignment Kyung Sook Choi
structure for mounting
electronic components
------------------------------------------------------------------------------------------------------------------------------------
10-30663 Method of manufacturing Il Kwon Shim/ 98-1-28 97-02504 /28/97 Notice of
ball grid array Sun Ho Ha Allowance
semiconductor package
------------------------------------------------------------------------------------------------------------------------------------
-70-
92
------------------------------------------------------------------------------------------------------------------------------------
10-51459 Circuit board Sang Suk Cha 98-2-17 97-04656 /17/97
------------------------------------------------------------------------------------------------------------------------------------
10-58942 Mothod of fobricating Young Wook Heo 98-2-24 97-06063 /26/97
semiconductor package
------------------------------------------------------------------------------------------------------------------------------------
10-334667 Method of molding BGA SungJin Kim 98-11-25 98-19303, 98-05-27/98-09-08
Semiconductor PKG 19304,
36897,36898
------------------------------------------------------------------------------------------------------------------------------------
10-346145 PCB for grounding SungJin Kim 98-11-27 97-64125 1/28/97
BGA Semiconductor PKG
------------------------------------------------------------------------------------------------------------------------------------
11-68670 Semiconductor Package SeonGoo Lee 99-3-15 98-12364 /8/98
------------------------------------------------------------------------------------------------------------------------------------
-71-
93
Exhibit E, Continued
III. United States Patents and Applications
-------------------------------------------------------------------------------------------------------------------------
APPL NO TITLE INVENTOR(S) FILE DATE PRIORITY PRIORITY DATE ASSIGNEE
-------------------------------------------------------------------------------------------------------------------------
08/349237 Method and device for Goo Lee 94-10-5 93-25829/ 93-11-30/ Anam & Amkor
molding of intergrated 94-22439/ 94-09-07/
circuit package(Device) 94-22625 94-09-07
-------------------------------------------------------------------------------------------------------------------------
08/485936 Copper-oxide filled Choul Woll Kwak 95-6-7 94-13647 94-06-16 Anam & Amkor
polymer die attach
adhesive composition
for semiconductorpackage
-------------------------------------------------------------------------------------------------------------------------
08/530558 Method for checking wire Young Wook Heo/ 95-9-19 94-24280 94-08-27 Anam & Amkor
bonding result of BGA Dong Sin Youm
package
-------------------------------------------------------------------------------------------------------------------------
08/588172 Ball grid array Il Kwon Shim/ 96-1-18 95-19582 95-07-05 Anam & Amkor
semiconductor packages Young Wook Heo
with improved heat
dissipation and
dehumidification effect
-------------------------------------------------------------------------------------------------------------------------
08/570849 Bonding method for Seong Min Seo/ 95-12-12 95-28772 95-0904 Anam & Amkor
semiconductor Sunk Ju Jang
-------------------------------------------------------------------------------------------------------------------------
08/736107 Printed circuit board Sun Ho Ha/ 96-10-24 95-37513 95-10-27 Anam & Amkor
having epoxy barrier Young Wook Heo
around a throughout slot
and ball grid array
semiconductor package
-------------------------------------------------------------------------------------------------------------------------
08/749578 Process for bonding Seong Min Seo/ 96-11-14 95-42561 95-11-21 Anam & Amkor
semiconductor chip Jae Hwan Song
-------------------------------------------------------------------------------------------------------------------------
08/704477 Wafer map conversion method Chee Jung Song 96-8-28 96-05343 96-12-29 Anam & Amkor
-------------------------------------------------------------------------------------------------------------------------
-72-
94
-------------------------------------------------------------------------------------------------------------------------
08/775839 Grid array type lead Won Sun Shin/ 96-12-31 96-22897/ 96-06-21 Anam & Amkor
frame and lead end grid Byung Joon Han/ 96-22898/
array semiconductor Ju Hoon Yoon/ 96-22899
package employing the Sung Bum Kwak/
same In Gyu Han
-------------------------------------------------------------------------------------------------------------------------
08/763605 Semiconductor package Byung Joon Han/ 96-12-11 96-22901 96-06-21 Anam & Amkor
and method for fabricating Young Wook Heo
the same
-------------------------------------------------------------------------------------------------------------------------
09/008552 Semiconductor package Byung Joon Han/ 98-1-16 96-22901 96-06-21 Anam & Amkor
and method for fabrication Young Wook Heo
the same
-------------------------------------------------------------------------------------------------------------------------
08/915077 Ball grid array Il Kwon Shim/ 97-8-20 96-77898/ 96-12-30/ Anam & Amkor
semiconductor package with Young Wook Heo/ 96-77899/ 97-02-14
solder balls fused on Robert Frarcis 97-04430
printed circuit board Darveaux
and method for fabricating
the same
-------------------------------------------------------------------------------------------------------------------------
08/883541 Flexible circuit for Il Kwon Shim/ 97-6-25 96-77900/ 96-12-30 Anam & Amkor
ball grid array Young Wook Heo/ 96-77901/
semiconductor package Robert Frarcis 96-77902
Darveaux
-------------------------------------------------------------------------------------------------------------------------
09/013330 Method of manufacturing Il Kwon Shim/ 98-1-26 97-02504 1/28/97 Anam & Amkor
ball grid array Sun Ho Ha/
semiconductor package Robert Frarcis
Darveaux
-------------------------------------------------------------------------------------------------------------------------
09/024940 Method of fabricating Young Wook Heo 98-2-17 97-06063 2/26/97 Anam & Amkor
semiconductor package
-------------------------------------------------------------------------------------------------------------------------
-73-
