EXHIBIT 2.01
AGREEMENT
1. The Parties to this Agreement are: Particle Interconnect Corporation, a
Colorado Corporation, Intercell Corporation, a Colorado Corporation,
Nanopierce Technologies, Inc., a Nevada Corporation.
2. Intercell Corporation as the Sole Shareholder of Particle Interconnect
Corporation hereby consents to the sale by Particle Interconnect
Corporation of all or substantially all of its assets, consisting of the
Intellectual Property identified on Exhibit A and such other intellectual
properties as it shall own to Nanopierce Technologies, Inc.
3. Particle Interconnect Corporation by and through its Sole Director, Xxxx X.
Xxxxxxxxx hereby consents to the sale by Particle Interconnect Corporation
of all or substantially all of its assets, consisting of the Intellectual
Property identified on Exhibit A and such other intellectual properties as
it shall own to Nanopierce Technologies, Inc.
4. Nanopierce Technologies, Inc. through its sole officer and director Xxxx X.
Xxxxxxxxx, hereby agrees to deliver to Intercell Corporation, Seven
Million, Two Hundred and Fifty Thousand (7,250,000) post-split common
shares and One Hundred (100) Series A, 8%, Voting Convertible Cumulative
Participating Preferred Shares, convertible into Seven Million, Two Hundred
and Fifty Thousand (7,250,000) post-split shares.
Dated: February 26, 1998
NANOPIERCE TECHNOLOGIES, INC. INTERCELL CORPORATION
By /s/ Xxxx X. Xxxxxxxxx By /s/ Xxxx X. Xxxxxxxxx
------------------------------ ------------------------------------
Xxxx X. Xxxxxxxxx, President Xxxx X. Xxxxxxxxx, President & Chief
& Chief Executive Officer Executive Officer
PARTICLE INTERCONNECT CORPORATION
By /s/ Xxxx X. Xxxxxxxxx
------------------------------------
Xxxx X. Xxxxxxxxx, President & Chief
Executive Officer
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PARTICLE INTERCONNECT CORPORATION
PATENTS AND APPLICATIONS
Updated: November 6, 1997
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Patent Serial File
Number Issue Date Title (Subject) Number Date
------------ ------------ ------------------------------------------ ------------- ------------
4,804,132 2/14/89 Method of Cold Bonding 90,608 8/28/87
(A method of cold bonding aluminum metal
surfaces using aluminum-coated diamond
particles)
5,083,697 1/28/92 Particle-Enhanced Joining of Metal 479,696 2/14/90
Surfaces
(A method of forming metal surfaces using
coatings containing hard particles
between the surfaces and compressive
force.)
-- -- 07/720,182 2/11/91
5,334,809 8/2/94 Particle Enhanced Joining of Metal 08/16,190 2/11/93
Surfaces
(An electrical junction formed by method
of 5,083,697.)
5,430,614 7/4/95 Electrical Interconnect Using Particle 08/148,907 11/8/93
Enhanced Joining of Metal Surfaces
(An integrated circuit carrier with a
terminal array formed by method of
5,471,151.)
5,471,151 11/28/95 Electrical Interconnect Using Particle 07/951,860 9/28/92
Enhanced Joining of Metal Surfaces
(A method of electrically coupling
terminals using particles and compressive
force.)
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Patent Serial File
Number Issue Date Title (Subject) Number Date
------------ ------------ ------------------------------------------ ------------- ------------
5,506,514 4/9/96 Electrical Interconnect Using Particle 08/422,546 4/12/95
Enhanced Joining of Metal Surfaces
(Apparatus for testing an integrative
circuit with a probe array formed by
method of 5,471,151.)
5,565,280 10/15/96 Electrical Interconnect Using Particle 08/422,447 4/12/95
Enhanced Joining of Metal Surfaces
(Spaced structure with particle enhanced
sheet between two planar sheets.)
-- -- Patternable Particle Filled Adhesive 08/320,436 10/7/94
Matrix for Localized Communication
Between Joined Surfaces
(A mixture of adhesive and particles for
joining substrates.)
5,670,251 9/23/97 Patternable Particle Filled Adhesive 8/320,443 10/7/94
Matrix for Forming Patterned Structures
Between Joined Surfaces
(A joint formed by joining substrates
with an adhesive and particle mixture.)
5,642,055 6/24/97 Electrical Interconnect Using Particle 08/422,445 4/12/95
Enhanced Joining of Metal Surfaces
(Testing apparatus including a terminal
array produced by the method of
5,471,151.)
08/422,446 4/12/95
-- -- Electrical Interconnect Using Particle 08/749,376 11/6/96
Enhanced Joining of Metal Surfaces
(A crimp for coupling a power
transmission medium to a contact point
formed by the method of 5,471,151.)
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Patent Serial File
Number Issue Date Title (Subject) Number Date
------------ ------------ ------------------------------------------ ------------- ------------
5,634,265 6/3/97 Electrical Interconnect Using Particle 08/422,448 4/12/95
Enhanced Joining of Metal Surfaces
(A method of forming a contact surface
for connecting electronic elements from a
metal containing interconnect particles.)
-- -- Method and Apparatus for Handling 08/440,497 5/10/95
Electronic Devices
(A preciser or handler with spaced
dividers and ridges forming a test site
array of recesses.)
-- -- Method and Apparatus of Handling 08/855,964 5/14/97
Electronic Devices
(A method of testing electronic devices
using a handler and test board with probe
array.)
-- -- Spiral Leaf Spring Contact ??? 5/15/97
Spiral Leaf Spring Contact PCT/US 6/6/97
97/09899
Method of Joining Surfaces with 08/854,107 5/9/97
Patternable Adhesive and Particle Matrix
(Method of joining substrates using
patterned coatings of a mixture of
adhesive and particles.)
-- -- High Ionic Flow Rate Plating Process and
Apparatus
(A latch apparatus for high ionic
apparatus for high ionic electro-coating
substrates with metal and particles.)
Electroplating Process
(Apparatus for high ionic continuous
electro-coating of substrates with metal
and particles.)
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Patent Serial File
Number Issue Date Title (Subject) Number Date
------------ ------------ ------------------------------------------ ------------- ------------
Method and Apparatus for Conductivity
Joining Components
(Conductive tape.)
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