Exhibit 10.2
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ASSIGNMENT
In consideration of Ten Dollars ($10.00) and other valuable consideration, of
which receipt is hereby acknowledged, Particle Interconnect, Inc., of 00000
Xxxxxxx Xxxxxx, Xxxxxxx, XX 00000 (ASSIGNOR) hereby sells and assigns to
Particle Interconnect Corporation, a Colorado corporation having offices at 0000
Xxxxxxxxxxx, Xxxxxxxx Xxxxxxx, XX 00000 (ASSIGNEE), its successors and assigns,
the entire right, title and interest in and to the improvements of the following
United States Patents:
1. U.S. Patent Number 4,804,132; Issue Date 2/14/89; Title: "Method For
Cold Bonding,"
2. U.S. Patent Number 5,083,697; Issue Date 1/28/92; Title: "Particle
Enhanced Joining of Metal Surfaces,"
3. U.S. Patent Number 5,471,151; Issue Date 11/28/95; Title: "Electrical
Interconnect Using Particle Enhanced Joining of Metal Surfaces,"
4. U.S. Patent Number 5,334,809; Issue Date 8/2/94; Title: "Particle
Enhanced Joining of Metal Surfaces,"
5. U.S. Patent Number 5,430,614; Issue Date 7/4/95; Title: "Electrical
Interconnect Using Particle Enhanced Joining of Metal Surfaces," and
6. U.S. Patent Number 5,506,514; Issue Date 4/9/96; Title: "Electrical
Interconnect Using Particle Enhanced Joining of Metal Surfaces."
and in and to the improvements of the following United States Patent
Applications:
7. U.S. Patent Application Number 08/320,436; Filing Date 10/7/94; Title:
"Patternable Particle Filled Adhesive Matrix For Localized Communication Between
Joined Surfaces,"
ASSIGNMENT
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8. U.S. Patent Application Number 08/320,443; Filing Date 10/7/94; Title:
"Patternable Particle Filled Adhesive Matrix For Forming Patterned Structures
Between Joined Surfaces,"
9. U.S. Patent Application Number 08/422,445; Filing Date 4/12/95; Title:
"Electrical Interconnect Using Particle Enhanced Joining of Metal Surfaces,"
10. U.S. Patent Application Number 08/422,446; Filing Date: 4/12/95;
Title: "Electrical Interconnect Using Particle Enhanced Joining of Metal
Surfaces,"
11. U.S. Patent Application Number 08/622,447; Filing Date 4/12/95; Title:
"Electrical Interconnect Using Particle Enhanced Joining of Metal Surfaces,"
12. U.S. Patent Application Number 08/422,448; Filing Date: 4/12/95;
Title: "Electrical Interconnect Using Particle Enhanced Joining of Metal
Surfaces," and
13. U.S. Patent Application Number 08/440, 497; Filing Date 5/10/95;
Title: "Method And Apparatus For Handling Electronic Devices."
and any and all applications for patent and patents therefor in any and all
countries, including all divisions, reissues, continuations and extensions
thereof, and all rights of priority resulting from the filing of said United
States patents and applications, and authorize and request any official whose
duty it is to issue patents, to issue any patent on said improvements or
resulting therefrom to said ASSIGNEE, or its successors or assigns and agree
that on request and without further consideration, but at the expense of
ASSIGNEE, ASSIGNOR will communicate to said ASSIGNEE, or its representatives or
nominees, any facts known to us respecting said improvements and testify in any
legal proceedings, sign all lawful papers, execute all divisional, continuing
and reissue applications, make all rightful oaths and generally do everything
possible to aid ASSIGNEE its successors, assigns and nominees, to obtain and
enforce proper patent protection for said inventions in all countries. ASSIGNOR
covenants with said ASSIGNEE, its successors and assign, that the rights and
property hereby covered are free and
ASSIGNMENT
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clear of any encumbrances, other than the existing licenses previously granted
by ASSIGNOR to third parties, and that has full right to convey the same as
herein expressed.
September 3, 1996 /s/ Xxxxx XxXxxxxxxxx
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Xxxxx XxXxxxxxxxx
President and CEO,
Particle Interconnect, Inc.
On this 3rd day of September, 1996, before me, the undersigned, personally
appeared Xxxxx XxXxxxxxxxx, known to me to be the person whose name is
subscribed to the within instrument, and acknowledged to me that he executed the
foregoing instrument for the purpose therein contained.
IN WITNESS WHEREOF, I have set my hand and official seal.
/s/ Xxxx X. Xxxxxxxxx
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Xxxx X. Xxxxxxxxx
Notary Public
Commission Expires 1-13-97
(Seal)
