合约LOAN AGREEMENT
Exhibit 10.6
合约LOAN AGREEMENT
日期：2020年6月15日
Date: 15th June 2020
通过电子邮件签署 (sign via email)
甲方 ：xxxWong Chiu Kin
乙方：Summit Networks, Inc.
甲乙双方因资金借贷问题达成如下意见。
Party A and Party B agree as following regarding the capital lending.
甲方xxx作为乙方的股东，同意为乙方垫付流动资金12万美金，提供并购项目运作支持。
Party A, Wong Chiu Kin, as shareholder of Party B, agrees to lend 120,000 in US dollar to Party B as financial support for merging and acquiring projects.
并确认一下条款：And also confirm the following terms:
| 1， | 资金用于借贷来入账。 |
The fund can be recorded as loan.
| 2， | 不计算利息。 |
Interest is not requested.
| 3， | 在乙方第一次融资后还款。 |
Party B shall repay after the first financing.
| 甲方Party A： | /s/Wong Chiu Kin | |
| Wong Chiu Kin |
乙方Party B: Summit Networks, Inc.
| /s/Shu Hua Liu | |
| CEO: Shu Hua Liu |
| /s/Chao Long Huang | |
| CFO: Chao Long Huang |
