* Confidential treatment has been granted or requested with respect to
portions of this exhibit, and such portions have been replaced with "**".
Such confidential portions have been deleted and separately filed with
the Securities and Exchange Commission pursuant to Rule 24b-2.
JOINT DEVELOPMENT AGREEMENT
THIS JOINT DEVELOPMENT AGREEMENT ("Agreement") is entered into and made
effective as of April 9, 1997 by and between Ramtron International
Corporation, ("Ramtron"), a Delaware corporation having its principal place
of business at 0000 Xxxxxxx Xxxxx, Xxxxxxxx Xxxxxxx, Xxxxxxxx and ULVAC
Japan, Ltd., ("ULVAC"), a Japanese corporation, having its principal place
of business at 0000 Xxxxxxxx, Xxxxxxxxx, Xxxxxxxx, 000, Xxxxx.
WHEREAS, Ramtron is engaged in the business of designing, integrating, and
developing state-of-the-art ferroelectric semiconductor technology.
WHEREAS, ULVAC is engaged in the business of manufacturing fabrication
equipment for the semiconductor industry.
WHEREAS, Ramtron and ULVAC desire to establish a successful relationship in
the joint development of equipment that will optimize the integration and
manufacturability of advanced ferroelectrics and semiconductor capacitors.
NOW THEREFORE, in consideration of the premises hereof and the mutual
promises, the parties agree as follows:
1. DESCRIPTION OF DEVELOPMENT PROJECT
Ramtron and ULVAC hereby agree to enter into a cooperative arrangement
comprised of at least two (2) phases under which the parties shall
establish a baseline study with respect to FRAM processes for which ULVAC
has developed functional applications. Under the Development Project, the
parties shall jointly conduct materials and process solution experiments to
the FRAM fabrication process that shall result in achieving optimal FRAM
performance at the device level, pursuant to the terms and conditions as
more fully described in the Statement Of Work (SOW), labelled Attachment
"A" and attached hereto and incorporated herein by reference. It is hereby
specifically agreed that such experiments shall involve the evaluation of
certain equipment designed and manufactured by ULVAC including, but not
limited to, the SPZ-1000, Phoenix Xxxxx, V-Series Vertical Furnaces,
Etchers and other equipment that may be mutually agreed to by the parties.
2. PROJECT LEADERS
The parties hereby agree that the Project Leader for Ramtron shall be
Mr. Xxx Xxxxxxxxx and the Project Leader for ULVAC shall be Xx. Xxxxxxxxx
Xxx. The responsibilities of the Project Leaders shall be to coordinate the
individual work and/or shared work as set forth in the SOW with respect to
the equipment deliverables as described in Attachment "B" and the cost
sharing as described in Attachment "C", both attached hereto and
incorporated herein by reference.
3. PHASE I PROJECT OBJECTIVES
The parties hereby agree that the primary goal of Phase I is to develop a
ferroelectric capacitor stack using the SPZ-1000 equipment-set to achieve
optimal physical and electrical properties. More specifically, the parties
shall endeavor to develop (i) a stable PZT capacitor deposition process
with materials now used by Ramtron and (ii) an effective strip process for
PZT and Pt-etch residues, as more fully described in the SOW. In addition,
the Project shall focus on (i) the immediate FRAM related manufacturing
requirements of Ramtron's licensees: **
; (ii) the ability to reliably demonstrate FRAM related
applications of the SPZ-1000 and Phoenix Xxxxx equipment-sets to potential
licensees of Ramtron and (iii) a technical evaluation of the potential of
the V-Series and Etching equipment-sets to deliver optimal FRAM process
solutions.
4. PHASE I EQUIPMENT PURCHASE
During the course of Phase I, Ramtron shall purchase from ULVAC and ULVAC
shall deliver to Ramtron, F.O.B., to Ramtron's Colorado Springs, Colorado
facility, a Phoenix Xxxxx equipment-set. The terms and conditions of such
purchase shall be set forth in a separately negotiated purchase order, the
execution of which shall be tied to the execution of this Agreement.
5. PHASE I EQUIPMENT EVALUATION
During the course of Phase I, the parties shall provide to the other party
an evaluation of the capabilities and benefits of ULVAC etching equipment-
set and V-series vertical furnaces.
6. PHASE I TERM
Phase I shall remain in force and effect for a period of nine (9) months
following the execution of this Agreement or until such date as the parties
enter into Phase II of the Development Project, whichever first occurs.
7. PHASE II PROJECT OBJECTIVES
The parties hereby agree that upon completion by Ramtron of the Phase I
evaluations to be performed by Ramtron as set-forth in the SOW, the parties
shall commence Phase II, during which the parties shall (i) use ULVAC's
SPZ-1000 equipment-set to advance materials development and processes for
an integrated FRAM stack, as defined by the Project Leaders and pursuant to
the specific Phase II objectives described in the SOW.
8. PHASE II EQUIPMENT EVALUATION
In consideration of completion of the evaluations undertaken by Ramtron
during Phase I, and the purchase of the equipment-set related thereto
(Phoenix Xxxxx), ULVAC shall furnish to Ramtron an SPZ-1000 equipment-set.
The SPZ-1000 shall be delivered F.O.B. to Ramtron's Colorado Springs,
Colorado facility. The parties expressly agree that title in the
aforementioned equipment-set shall remain fully and exclusively with ULVAC.
Ramtron shall provide adequate care and precaution for the security of
ULVAC's property on Ramtron site. Ramtron shall use such equipment-set to
undertake the Phase II evaluations and experiments and prototype
manufacturing as defined by the Project Leaders in the SOW. Ramtron shall
not modify, reform or in whatever form make changes to SPZ-1000 without the
prior written consent of ULVAC. By the end of 4 years after signing date of
this Agreement, Ramtron shall have the option, but not the obligation, to
purchase from ULVAC, the SPZ-1000 equipment-set, as described in Attachment
"B", on terms to be mutually agreed to by the parties.
9. PHASE II TERM
The parties hereby agree that Phase II shall commence upon the successful
completion of Phase I and upon the delivery by ULVAC to Ramtron of the SPZ-
1000 equipment-set set forth in Attachment "B". Phase II shall continue in
force and effect for such a period as described in Attachment A 2.2
following the delivery by ULVAC to Ramtron of the SPZ-1000 equipment-set.
10. PLANT VISITS
When visiting the other party's facilities, representatives and personnel
of each party shall be subject to all rules and regulations prevailing on
the premises of such party. None of the representatives or personnel of
either party shall be considered, for any reason, to be an employee of the
other party. Plant visits shall be coordinated through the Project
Leaders. In the event that any employee of ULVAC visits Ramtron's premises,
or any employee of Ramtron shall visit ULVAC's premises as contemplated
pursuant to this Section, then the sending party shall be responsible for
any and all liability of any type whatsoever to any other person, form or
entity arising from any direct or indirect action or inaction relating to
the carrying out of its employee's duties under the terms of this Section.
Each party shall also cause its employees to be covered by its respective
liability insurance policy or policies. Whether or not any action or
inaction of any such employee is covered by insurance, each party hereby
agrees to hold harmless and indemnify the other party against and from all
losses, claims, damages, liabilities, obligations or expenses (including
attorneys fees, court costs, and costs of investigation) incurred or to
which it may become subject as a result of any action or inaction relating
to the carrying out of its employee's duties as contemplated herein. In
addition, each party shall be solely responsible for all costs it may incur
during the terms of this Agreement related to air travel, meals and lodging
expenses, and/or other employee costs and expenses.
11. INTELLECTUAL PROPERTY
a. It is understood and agreed that Ramtron shall retain sole
ownership to all patents, patent applications, maskwork rights, copyrights,
trade secrets, know-how and other intellectual property rights in all
countries of the world relating to Ramtron's proprietary ferroelectric
technology.
b. It is understood and agreed that ULVAC shall retain sole ownership
to all patents, patent applications, maskwork rights, copyrights, trade
secrets, know-how and other intellectual property rights in all countries
of the world relating to ULVAC's proprietary equipment design and
development technology.
c. Ramtron and ULVAC shall jointly own, in equal and undivided
shares, all right, title and interest in and to any improvements,
enhancements and/or inventions made by either party during the terms of
this Agreement. From time to time when necessary during the term of this
Agreement, there shall be a meeting of a joint development technology
committee, which shall consist of the Project Leaders and one (1)
additional member appointed by each of Ramtron and ULVAC, who is
knowledgeable in the area of intellectual property matters (the "Joint
Development Technology Committee"). In the event any patentable joint
improvement is discovered under this Agreement during the preceding period,
the responsibility of the Joint Development Technology Committee shall be
to determine the following:
1. whether or not a patent application will be prepared and filed
for such invention;
2. which party will apply for such joint patent right and the
sharing of costs associated with the preparation and filing of
such joint patent right; and
3. which countries such joint patent applications will be filed
for.
Ramtron and ULVAC will each render any and all reasonable assistance to the
other party including, but not limited to, the execution and delivery of
any additional documents reasonably requested by such other party, at such
other party's expense, in order for such other party to perfect, register
and/or enforce any and all intellectual property rights and such other
party's joint ownership therein in any and all countries throughout the
world as may be mutually agreed to by the Joint Development Technology
Committee. Each party hereto, may perpetually use, without payment to the
other party, joint improvements, joint patent rights or any other statutory
intellectual property resulting from joint improvements made during the
course of the development project to the extent permitted under applicable
law. The parties shall not grant to a third party a license of joint
patent rights without the other party's prior written consent, which
consent shall not unnecessarily be withheld.
12. EQUIPMENT RECOMMENDATION
Upon the successful completion of the Development Project, regarding the
integration of advanced multi-level metal processes with ferroelectric
process technology, then Ramtron shall agree to promote the use of ULVAC's
equipment to prospective third party licensees. Such promotion by Ramtron
shall be in the form of material inducements and/or incentives as shall be
determined by Ramtron, within its sole discretion after consulting with
ULVAC, and which may further be agreed to in the course of negotiation
between Ramtron and such potential third party licensees.
13. CONFIDENTIALITY
a. The term "Confidential Information" shall mean any information
disclosed by one party to the other, or jointly created by the parties
pursuant to this Agreement, which is on written, graphic, machine-readable,
or other tangible form, and is marked "Confidential" or, in some other
manner, indicates its confidential nature. Confidential Information may
also include oral information disclosed by one party to the other pursuant
to this Agreement, provided that such information is designated as
confidential at the time of disclosure and is reduced to writing by the
disclosing party within a reasonable time (not to exceed thirty (30) days)
after its oral disclosure, and such writing is marked in a manner to
indicate its confidential nature and delivered to the receiving party.
Notwithstanding the foregoing, the SPZ-1000 equipment-set, including all
parts thereof provided to Ramtron by ULVAC during Phase II, constitutes
"Confidential Information" regardless of whether its confidential nature is
expressly indicated or not.
b. For a period of five (5) years from the receipt thereof, or from
the time when the information was developed or jointly created, neither
party shall knowingly publish or disseminate or disclose to any third party
any of the Confidential Information, except to the employees or
subcontractors of the receiving party who reasonably needs to know such
Confidential Information and who have secrecy obligations to the sending
party regarding such Confidential Information. Each page of each document
which contains Confidential Information shall be stamped with the
confidential legend of the party transferring the documents.
Notwithstanding this Section 13b or any other provisions of this Agreement,
the obligations set forth in this Section 13b shall not in any way restrict
or impair the right of the receiving party to disclose to any third party
any Confidential Information:
(i) Which is or becomes publicly available without breach of
this Agreement;
(ii) Which is already in the possession of the receiving party
or any of its subsidiaries, as evidenced by the written
records of the receiving party or any of its subsidiaries;
(iii) Which is rightfully received by the receiving party or any
of its subsidiaries from a third party;
(iv) Which is independently developed by the receiving party or
any of its subsidiaries, as evidenced by the written
records of the receiving or any of its subsidiaries;
(v) Which is released for disclosure to any third party by the
disclosing party with its written consent; or
(vi) Which is inherently disclosed by the use, lease, sale,
distribution, design or operation of any product or
service, including associated documentation.
c. Disclosure of Confidential Information will not be precluded if
such disclosure is:
(i) In response to a valid order of a court or government body
of the United States or Japan; provided, however, that the
receiving party shall first have given notice to the
disclosing party and made a reasonable effort to obtain a
protective order requiring that the Confidential
Information so disclosed be used only for the purpose for
which the order was issued;
(ii) Otherwise required by law; or
(iii) To the legal representative or a party hereto.
d. Nothing in this Agreement creates any obligation in any way
limiting or restricting assignment and/or reassignment of employees by the
receiving party or any of its subsidiaries, to or from or within any such
subsidiaries.
e. The parties hereby agree that the terms and conditions of the
Agreement shall be deemed Confidential Information.
f. If deemed by the parties to be necessary for the purpose of this
Agreement, each party will designate one or more Document Manager(s) whose
responsibility is to receive, on behalf of the receiving party, all
Confidential Information pursuant to this Agreement, and to monitor within
their company the distribution of the received Confidential Information for
the purpose of this Agreement.
14. COMPLIANCE WITH LAWS AND REGULATIONS
a. The parties shall comply with all applicable governmental laws,
ordinances and regulations. Each will be solely responsible for its own
individual violations of any such laws, ordinances and regulations.
b. The parties understand and agree that they are subject to all
applicable laws and regulations of the United States of America ("USA") or
Japan and any other applicable jurisdiction with respect to the export and
use of services and/or technology sourced from the USA or any other
applicable jurisdiction. The parties shall comply in all respects with
such laws and regulations insofar as they may apply to their performance
under this Agreement. The parties are not to export or re-export, directly
or indirectly, (i) any technical data received from the other party under
this Agreement, or (ii) any product based on the process and/or technical
data to any country to which such export or re-export is restricted or
prohibited by USA or Japan or other relevant laws without obtaining prior
authorization from the competent government authorities as required by
those laws.
15. AMENDMENTS
No part of this Agreement may be amended, altered, or otherwise changed
unless in writing duly executed by the parties hereto.
16. REPRESENTATIONS OF THE PARTIES
Each party represents and warrants to the best of its knowledge and belief
that it has the right to perform the technical and engineering services
herein without violation of obligations to others and without violation of
any patents either party knows to exist, and that each party has the right
to disclose to the other party any and all information transmitted to the
other party in the performance of such services under this Agreement, and
each party agrees that the information submitted to the other party,
whether patentable or not, may be utilized by the other party to advance to
objectives as set forth herein.
17. TERM AND TERMINATION
a. Term.
This Agreement shall become effective on the date first above set forth,
and shall be valid for a period of four (4) years unless extended by mutual
consent of the parties.
b. Default.
If either party hereto is in default of any material obligation imposed on
it herein for more than sixty (60) days after written notice has been given
by the other party to the party in default, the other party may, in
addition to any other rights or remedies available to such other party,
terminate this Agreement by written notice to the defaulting party.
c. Termination for Insolvency.
In the event of the institution of any proceedings by or against either
party in bankruptcy or insolvency or under any other provisions of the
Bankruptcy Act including proceedings under Chapter X and XI thereof, or the
appointment of a receiver or trustee or an assignment for the benefit of
creditors of the bankrupt or insolvent party, the other party, after
providing notice, may terminate this Agreement. Any termination under this
provision shall be deemed to be a termination for default in accordance
with this Section 17.
d. Survival.
Upon expiration or termination of this Agreement, all rights, privileges
and obligations hereunder shall cease; provided, however, that
notwithstanding the termination of this Agreement, the provisions of
Article 13 (CONFIDENTIALITY), 14 (COMPLIANCE WITH LAWS AND REGULATIONS),
16 (REPRESENTATIONS OF THE PARTIES), 19 (LIMITATION OF LIABILITY),
20 (ASSIGNMENT), AND 23 (ARBITRATION), shall survive and continue to be
binding on the parties.
18. INDEMNITY
Each party shall defend, indemnify and hold the other party harmless
against all claims, suits, costs, damages and judgments incurred, claims
sustained by third parties, whether for personal injury or otherwise,
because of the evaluation, experiments and all other activities of whatever
kind or nature arising under this Agreement. IN NO EVENT SHALL EITHER
PARTY BE LIABLE FOR ANY SPECIAL, CONSEQUENTIAL, INDIRECT OR INCIDENTAL
DAMAGES, HOWEVER CAUSED, ON ANY THEORY OF LIABILITY AND WHETHER OR NOT SUCH
PARTY HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING IN ANY
WAY OUT OF THIS AGREEMENT.
19. LIMITATION OF LIABILITY
THIS ARTICLE 19 STATES EACH PARTY'S TOTAL LIABILITY AND RESPONSIBILITY, AND
EACH PARTY'S SOLE REMEDY, FOR ANY ACTUAL OR ALLEGED INFRINGEMENT OF ANY
PATENT, TRADEMARK, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT BY FRAM
TECHNOLOGY, ULVAC TECHNOLOGY, OR IMPROVEMENTS MADE THERETO, OR ANY PART
THEREOF. THIS SECTION IS IN LIEU OF AND REPLACES ANY OTHER EXPRESSED OR
IMPLIED OR STATUTORY WARRANTY AGAINST INFRINGEMENT. IN NO EVENT SHALL
EITHER PARTY BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES RESULTING FROM SUCH INFRINGEMENT.
20. ASSIGNMENT
Each party to this Agreement may not assign this Agreement or any rights
under this Agreement without the expressed written permission of the other
party.
21. NOTICES
All notices and other communications required or permitted hereunder may be
sent by fax unless either party requests more formal communication, in
which case notices and communications shall be in writing and shall be
mailed by registered or certified mail postage prepaid, or otherwise
delivered by hand, by messenger or by telecommunication, addressed to the
addresses first set forth above or at such other address furnished with a
notice in the manner set forth herein. Such notices shall be deemed to
have been served when delivered or, if delivery is not accomplished by
reason of some fault of the addressee, when tendered.
22. APPLICABLE LAW
The validity of this Agreement, the construction of its terms and the
interpretation of the rights and duties of the parties hereto shall be
governed in accordance with the substantive laws of the state of Delaware,
USA.
23. ARBITRATION
Any dispute, controversy, or claim arising out of or related to this
Agreement, or the creation, validity, interpretation, breach, or
termination of this Agreement that has not been amicably resolved between
the parties, shall be finally settled by binding arbitration under the
Rules of Conciliation and Arbitration of the International Chamber of
Commerce. The arbitration shall be conducted in Japanese and take place in
Japan if it is initiated by Ramtron or conducted in English and take place
in the United States if it is initiated by ULVAC.
The expenses of arbitration shall be borne by the party against whom the
decision is rendered, or apportioned in accordance with the decision of the
arbitrator if there is a compromise decision. Judgment upon any award may
be entered in any court of competent jurisdiction. If the arbitrator
determines that either party has proceeded in bad faith with respect to the
subject matter of the arbitration proceedings, then the arbitrator shall
require such party to reimburse the other party for the attorney fees and
out of pocket expenses incurred by the other party in connection with the
arbitration.
THIS ARTICLE 23 DOES NOT APPLY TO ANY BREACH OF OBLIGATION OF ARTICLE 13
(CONFIDENTIALITY). EACH PARTY MAY SEEK RELIEF FROM THE COURTS (INCLUDING
INJUNCTIVE AND OTHER EQUITABLE RELIEF) IN CONNECTION WITH ANY SUCH BREACH.
24. FORCE MAJEURE
Neither party shall be responsible for its failure to perform due to causes
beyond its reasonable control such as, but not limited to, acts of God,
fire, theft, war, riot, embargoes or acts of civil or military authorities.
25. ENTIRE AGREEMENT
The terms and conditions herein contained constitute the entire agreement
between the parties and supersede all previous agreements and
understandings, whether oral or written, between the parties hereto with
respect to the subject matter hereof and no agreement or understanding
varying or extending the same shall be binding upon either party hereto
unless in a written document signed by the party to be bound thereby. This
Agreement shall take precedence over any other document that may be in
conflict therewith.
IN WITNESS WHEREOF, the parties have caused this Agreement to be executed
by their authorized representatives as of the effective date first above
written.
ULVAC Japan, Ltd. RAMTRON INTERNATIONAL CORPORATION
By:/S/ Kyuzo Nakamura By:/S/ Xxxx Xxxxx
Name: Kyuzo Nakamura Name: Xxxx Xxxxx
Title: President and CEO Title: President
ATTACHMENT "A"
TO
JOINT DEVELOPMENT AGREEMENT
BY AND BETWEEN
RAMTRON INTERNATIONAL CORPORATION
AND
ULVAC JAPAN, LTD.
STATEMENT OF WORK
1. INTRODUCTION
1.1 Background: Schedules and milestones are included in the
Statement of Work as the framework to describe planned activities and
events. A number of equipment areas are covered independently, but should
result in a cohesive program whereby ULVAC's equipment-set can be
recommended by Ramtron due to its having performed ferroelectric processes
in superior fashion. The equipment-set is comprised of the following
pieces: sputtering, ashing, etch and furnace.
2. SPUTTERING EQUIPMENT
2.1 PHASE 1: The ULVAC SPZ-1000 will be optimized for ferroelectric
stack depositions during this phase, lasting nine months from the date of
signing this agreement. Modifications will be made to the system as
required by ULVAC. Evaluating the stack electrical performance will be
done by Ramtron. Phase 1 will be considered complete when Ramtron and
ULVAC determine through mutual consultations that the ferroelectric stack
deposition process has matured to the point where more rapid evaluation
results will be beneficial and prototype production can be run. Ramtron
will analyze the patterned ferroelectric capacitor structures for
switching, retention, fatigue, microstructure, grain structure and
composition.
2.2 PHASE 2: The SPZ-1000 machine will be transferred to Ramtron,
Colorado Springs at the beginning of Phase 2. The work undertaken will
include composition, microstructural, electrical and other optimizations.
Specific Phase 2 objectives will be defined by the parties through mutual
consultations. A minimum of 50 wafers per month will be supplied by
Ramtron for the development. Machine time for joint development work will
be shared with customer evaluations, including ULVAC's customer
evaluations, at ULVAC's cost and Ramtron prototype production. ULVAC will
provide in-house support during Phase 2 to the extent agreed to by the
parties. Phase 2 will last until such time as the specific Phase 2
objectives described above are achieved or termination of this Agreement,
whichever comes first.
2.3 Objectives and term of the subsequent phase shall be determined
through mutual consultations.
3. ASHING EQUIPMENT
3.1 Phase 1 has already commenced with an effort conducted jointly
between ULVAC and Ramtron whereby the Phoenix Xxxxx was evaluated for
performance in regards to several ferroelectric process steps, including
yield analysis and residue removal efficiency.
3.2 Phase 1 will continue after the delivery of the Phoenix to
Ramtron, Colorado Springs and will consist of Ramtron using the xxxxx for
prototype production and evaluations of yield analysis and residue removal
efficiency thereafter. Alliance customers, both potential and current,
will be able to evaluate the performance of the Phoenix for broad
ferroelectric application as full qualification proceeds for Ramtron
product families (Local Interconnect and non-Local Interconnect families;
each of nine process steps for Local Interconnect, each of seven process
steps for non-Local Interconnect).
4. ETCHING EQUIPMENT
4.1 Necessary number of stack and/or individual layer films will be
patterned photolithographically at Ramtron for etch development work at
ULVAC.
4.2 Subsequent processing for ferroelectric device performance
evaluation will be done at Ramtron. The evaluation will be considered
complete when qualification wafers achieve adequate yields, as compared to
Ramtron's standard process. Etch degradation, selectivity, linewidth
control and cleanliness will be evaluated. If ULVAC's etching etcher is
proven to be beneficial for ferroelectric production, then this piece of
equipment will be recommended as part of the standard equipment-set to
present and potential alliance partners.
5. FURANCE EQUIPMENT
5.1 Necessary number of wafers for the development of annealing
processes for ferroelectric applications will be fabricated at Ramtron and
supplied to the appropriate ULVAC demo laboratory.
5.2 After anneal, the wafers will then be evaluated at Ramtron to
include analysis of as-annealed properties and subsequent integration steps
followed by further analysis. Microstructural and electrical performance
will be evaluated utilizing x-ray diffraction and stress measurements. If
the Series V, furnaces are proven to be beneficial for ferroelectric
production, these pieces of equipment will be recommended as part of the
standard equipment-set to present and potential alliance partners.
ATTACHMENT "B"
TO
JOINT DEVELOPMENT AGREEMENT
BY AND BETWEEN
RAMTRON INTERNATIONAL CORPORATION
AND
ULVAC JAPAN, LTD.
PHASE 2 EQUIPMENT DELIVERABLES
SPZ-1000: complete machine in standard ferroelectric configuration utilized
by alliance customers.
1 RF Module
2 DC Modules
1 Etch Module
1 Heat Module
2 Cassette Modules
TARGETS:
Following targets are delivered to Ramtron by ULVAC to use for SPZ-1000 and
remain the property of ULVAC:
Platinum 2 Pieces
Titanium 1 Piece
Ferroelectric 2 Pieces (Standard composition PZT)
ATTACHMENT C
COST SHARING
The both parties agree to the following cost sharing related to this
Agreement and on the basis of the conditions pursuant to this Agreement;
PHASE 1
-----------------------------------------------------------------------------
RAMTRON ULVAC
---------------------------------- -----------------------------------
1. Wafers for evaluation 1. Sampling Work
2. Transportation of the wafers 2. Transportation of the samples
to ULVAC to Ramtron
3. Evaluation work of the samples 3. Modification work/materials
-----------------------------------------------------------------------------
PHASE 2
-----------------------------------------------------------------------------
RAMTRON ULVAC
---------------------------------- -----------------------------------
1. Preparation work/materials for 1. Transportation/Installation of
installing SPZ-1000 at Ramtron SPZ-1000 to/at Ramtron
2. Wafers for evaluation 2. Modification work/materials
3. Utilities for SPZ-1000 3. Maintenance work/materials
4. Evaluation work of the samples 4. Targets specified in Attachment
B (Used targets owned by ULVAC)
5. System repair work/materials 5. System repair work/materials if
if the damage is caused by the damage is caused by fault
fault of Ramtron of ULVAC
-----------------------------------------------------------------------------
Shared at 50:50 by Ramtron and ULVAC
-----------------------------------------------------------------------------
1. Ferroelectric targets jointly developed for SPZ-1000 (Used targets
jointly owned)
-----------------------------------------------------------------------------
