THIRD LOAN MODIFICATION AND WAIVER AGREEMENTLoan Modification Agreement • May 26th, 2015 • ECPM Holdings, LLC • Surgical & medical instruments & apparatus
Contract Type FiledMay 26th, 2015 Company IndustryThis Third Loan Modification and Waiver Agreement (this “Loan Modification Agreement”) is entered into as of December 31, 2014 by and between (i) SILICON VALLEY BANK, a California corporation (“Bank”), (ii) ECPM HOLDINGS, LLC, a Delaware limited liability company (“Holdings”), (iii) ENDOCHOICE, INC., a Delaware corporation (“EndoChoice”), and (iv) ROBERT S. SMITH, M.D., INC., a Georgia corporation (“Smith”, and together with EndoChoice, individually and collectively, jointly and severally, the “Borrower”).
THIRD LOAN MODIFICATION AND WAIVER AGREEMENTLoan Modification Agreement • March 17th, 2015 • ECPM Holdings, LLC • Surgical & medical instruments & apparatus
Contract Type FiledMarch 17th, 2015 Company IndustryThis Third Loan Modification and Waiver Agreement (this “Loan Modification Agreement”) is entered into as of December 31, 2014 by and between (i) SILICON VALLEY BANK, a California corporation (“Bank”), (ii) ECPM HOLDINGS, LLC, a Delaware limited liability company (“Holdings”), (iii) ENDOCHOICE, INC., a Delaware corporation (“EndoChoice”), and (iv) ROBERT S. SMITH, M.D., INC., a Georgia corporation (“Smith”, and together with EndoChoice, individually and collectively, jointly and severally, the “Borrower”).