Common Contracts

AGREEMENT AND PLAN OF MERGER AND REORGANIZATION among ST ASSEMBLY TEST SERVICES LTD, CAMELOT MERGER, INC. and CHIPPAC, INC. Dated as of February 10, 2004

Merger Agreement • February 23rd, 2004 • Chippac Inc • Semiconductors & related devices • Delaware

• Contract Type
  Merger Agreement
• Filed
  February 23rd, 2004
• Company
  Chippac Inc
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

AGREEMENT AND PLAN OF MERGER AND REORGANIZATION, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), CAMELOT MERGER, INC., a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), and ChipPAC, INC., a Delaware corporation (the “Company”).

AGREEMENT AND PLAN OF MERGER AND REORGANIZATION among ST ASSEMBLY TEST SERVICES LTD, CAMELOT MERGER, INC. and CHIPPAC, INC. Dated as of February 10, 2004

Merger Agreement • February 20th, 2004 • Chippac Inc • Semiconductors & related devices • Delaware

• Contract Type
  Merger Agreement
• Filed
  February 20th, 2004
• Company
  Chippac Inc
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

AGREEMENT AND PLAN OF MERGER AND REORGANIZATION, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), CAMELOT MERGER, INC., a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), and ChipPAC, INC., a Delaware corporation (the “Company”).