AGREEMENT AND PLAN OF MERGER AND REORGANIZATION among ST ASSEMBLY TEST SERVICES LTD, CAMELOT MERGER, INC. and CHIPPAC, INC. Dated as of February 10, 2004Agreement and Plan of Merger And • February 23rd, 2004 • Chippac Inc • Semiconductors & related devices • Delaware
Contract Type FiledFebruary 23rd, 2004 Company Industry JurisdictionAGREEMENT AND PLAN OF MERGER AND REORGANIZATION, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), CAMELOT MERGER, INC., a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), and ChipPAC, INC., a Delaware corporation (the “Company”).
AGREEMENT AND PLAN OF MERGER AND REORGANIZATION among ST ASSEMBLY TEST SERVICES LTD, CAMELOT MERGER, INC. and CHIPPAC, INC. Dated as of February 10, 2004Agreement and Plan of Merger And • February 20th, 2004 • Chippac Inc • Semiconductors & related devices • Delaware
Contract Type FiledFebruary 20th, 2004 Company Industry JurisdictionAGREEMENT AND PLAN OF MERGER AND REORGANIZATION, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), CAMELOT MERGER, INC., a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), and ChipPAC, INC., a Delaware corporation (the “Company”).