Credit Granting Agreement No.: xxxxxxxxxxCredit Granting Agreement • October 22nd, 2020 • Applied Optoelectronics, Inc. • Semiconductors & related devices • Hong Kong
Contract Type FiledOctober 22nd, 2020 Company Industry JurisdictionBased on Party B's application, Party A hereby agrees to provide Party B with a credit line. Party A and Party B have reached consensus on the following terms and have entered into this Credit Granting Agreement (“Agreement”) through sufficient mutual negotiation in accordance with the relevant laws and regulations.
Credit Granting Agreement No.:Credit Granting Agreement • April 25th, 2019 • Applied Optoelectronics, Inc. • Semiconductors & related devices • Hong Kong
Contract Type FiledApril 25th, 2019 Company Industry JurisdictionBased on Party B's application, Party A hereby agrees to provide Party B with a credit line. Party A and Party B have reached consensus on the following terms and have entered into this Credit Granting Agreement (“Agreement”) through sufficient mutual negotiation in accordance with the relevant laws and regulations.