EX-10.24 11 dex1024.htm MASTER LEASE AGREEMENT [Translation] [execution copy] MASTER LEASE AGREEMENT Semiconductor Manufacturing Equipment January 5, 2005 SumiCrest Leasing Ltd. Spansion Japan Limited Page Schedule 1 Equipment List Schedule 2 Lease...Master Lease Agreement • May 5th, 2020
Contract Type FiledMay 5th, 2020This Master Lease Agreement is made and entered into by and between SumiCrest Leasing Ltd. (“Lessor”) and Spansion Japan Limited (“Lessee”) on January 5, 2005.
MASTER LEASE AGREEMENT Semiconductor Manufacturing Equipment January 5, 2005 SumiCrest Leasing Ltd. Spansion Japan LimitedMaster Lease Agreement • April 13th, 2005 • Spansion Inc.
Contract Type FiledApril 13th, 2005 CompanyThis Master Lease Agreement is made and entered into by and between SumiCrest Leasing Ltd. (“Lessor”) and Spansion Japan Limited (“Lessee”) on January 5, 2005.
MASTER LEASE AGREEMENT Semiconductor Manufacturing Equipment January 5, 2005 SumiCrest Leasing Ltd. Spansion Japan LimitedMaster Lease Agreement • March 1st, 2005 • Advanced Micro Devices Inc • Semiconductors & related devices
Contract Type FiledMarch 1st, 2005 Company IndustryThis Master Lease Agreement is made and entered into by and between SumiCrest Leasing Ltd. (“Lessor”) and Spansion Japan Limited (“Lessee”) on January 5, 2005.