GLOBAL TECHNOLOGY INC.RMB Working Capital Loan Agreement • August 12th, 2014 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Contract Type FiledAugust 12th, 2014 Company IndustryThis RMB Loan Agreement (the “Contract”) is entered into in order for the company’s daily operation expense [, including material purchase payment and employee’s salary], by and between:
GLOBAL TECHNOLOGY INC.RMB Working Capital Loan Agreement • March 6th, 2014 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Contract Type FiledMarch 6th, 2014 Company IndustryThis RMB Loan Agreement (the “Contract”) is entered into in order for the company’s daily operation expense [, including material purchase payment and employee’s salary], by and between:
GLOBAL TECHNOLOGY INC.RMB Working Capital Loan Agreement • August 13th, 2013 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Contract Type FiledAugust 13th, 2013 Company IndustryThis RMB Loan Agreement (the “Contract”) is entered into in order for the company’s daily operation expense [, including material purchase payment and employee’s salary], by and between:
GLOBAL TECHNOLOGY INC.RMB Working Capital Loan Agreement • May 22nd, 2013 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Contract Type FiledMay 22nd, 2013 Company IndustryThis RMB Loan Agreement (the “Contract”) is entered into in order for the company’s daily operation expense [, including material purchase payment and employee’s salary], by and between: