Common Contracts
7 similar Guaranty contracts by NXP Semiconductors N.V., Freescale Semiconductor, Ltd.
GUARANTY RELATING TO THE CREDIT AGREEMENTGuaranty • September 20th, 2018 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
GUARANTY, dated as of September 19, 2018 (as amended, amended and restated, supplemented and otherwise modified from time to time, this “Guaranty”) , made by each of the Subsidiaries (as defined in the Credit Agreement referred to below) of NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”) listed on the signature pages hereto as a Guarantor (each such Subsidiary and any other Subsidiary that becomes a party hereto as Guarantor (in each case, unless and until such Person ceases to be a Guarantor in accordance with this Guaranty, individually, a “Guarantor” and, collectively, the “Guarantors”) and Barclays Bank Plc, as administrative agent (in such capacity, together with its successors in such capacity, the “Administrative Agent”) for the lenders from time to time party to the Credit Agreement (collectively, the “Lenders”).
GUARANTY RELATING TO SECURED TERM CREDIT AGREEMENTGuaranty • December 7th, 2015 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
GUARANTY (this “Guaranty”) dated as of December 7, 2015, made among the Guarantors listed on the signature pages hereto (each such subsidiary individually, a “Guarantor” and, collectively with any Person that becomes a “Guarantor” pursuant to Section 20, the “Guarantors”), CREDIT SUISSE AG, as Administrative Agent (in such capacity, the “Administrative Agent”) and MORGAN STANLEY SENIOR FUNDING, INC as Collateral Agent (in such capacity, the “Collateral Agent”), in each case, for the lenders (the “Lenders”) from time to time parties to the CREDIT AGREEMENT (the “Credit Agreement”) dated as of the date hereof, among NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP FUNDING LLC (the “Co-Borrower”), the Lenders, CREDIT SUISSE SECURITIES (USA) LLC, MORGAN STANLEY SENIOR FUNDING, INC., BARCLAYS BANK PLC, DEUTSCHE BANK SECURITIES INC. AND MERRILL LYNCH, PIERCE, FENNER & SMITH INCORPORATED as Joint Lead Arrangers (the “Joint Lead Arrangers”) and Joint Bookrunn
GUARANTY RELATING TO SECURED REVOLVING CREDIT AGREEMENTGuaranty • December 7th, 2015 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
GUARANTY (this “Guaranty”) dated as of December 7, 2015, made among NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP Funding LLC and each of the subsidiaries of the Company listed on the signature pages hereto (each such subsidiary individually, a “Subsidiary Guarantor” and, collectively with any Person that becomes a “Guarantor” pursuant to Section 20, the “Subsidiary Guarantors”; the Company, NXP Funding LLC and the Subsidiary Guarantors are referred to collectively as the “Guarantors”) and Morgan Stanley Senior Funding, Inc., as the collateral agent (in such capacity, the “Collateral Agent”) and as Administrative Agent (in such capacity, the “Administrative Agent”) in each case, for the lenders (the “Lenders”) and issuers of letters of credit (the “Letter of Credit Issuers”) from time to time party to the Secured Revolving Credit Agreement (the “Credit Agreement”) dated as of December 7, 2015, between the Company, NXP Funding LLC (the “Co-Borrower”
GUARANTY RELATING TO SECURED REVOLVING CREDIT AGREEMENTGuaranty • December 7th, 2015 • Freescale Semiconductor, Ltd. • Semiconductors & related devices • New York
GUARANTY (this “Guaranty”) dated as of December 7, 2015, made among NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP Funding LLC and each of the subsidiaries of the Company listed on the signature pages hereto (each such subsidiary individually, a “Subsidiary Guarantor” and, collectively with any Person that becomes a “Guarantor” pursuant to Section 20, the “Subsidiary Guarantors”; the Company, NXP Funding LLC and the Subsidiary Guarantors are referred to collectively as the “Guarantors”) and Morgan Stanley Senior Funding, Inc., as the collateral agent (in such capacity, the “Collateral Agent”) and as Administrative Agent (in such capacity, the “Administrative Agent”) in each case, for the lenders (the “Lenders”) and issuers of letters of credit (the “Letter of Credit Issuers”) from time to time party to the Secured Revolving Credit Agreement (the “Credit Agreement”) dated as of December 7, 2015, between the Company, NXP Funding LLC (the “Co-Borrower”
GUARANTY RELATING TO SECURED TERM CREDIT AGREEMENTGuaranty • December 7th, 2015 • Freescale Semiconductor, Ltd. • Semiconductors & related devices • New York
GUARANTY (this “Guaranty”) dated as of December 7, 2015, made among the Guarantors listed on the signature pages hereto (each such subsidiary individually, a “Guarantor” and, collectively with any Person that becomes a “Guarantor” pursuant to Section 20, the “Guarantors”), CREDIT SUISSE AG, as Administrative Agent (in such capacity, the “Administrative Agent”) and MORGAN STANLEY SENIOR FUNDING, INC as Collateral Agent (in such capacity, the “Collateral Agent”), in each case, for the lenders (the “Lenders”) from time to time parties to the CREDIT AGREEMENT (the “Credit Agreement”) dated as of the date hereof, among NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP FUNDING LLC (the “Co-Borrower”), the Lenders, CREDIT SUISSE SECURITIES (USA) LLC, MORGAN STANLEY SENIOR FUNDING, INC., BARCLAYS BANK PLC, DEUTSCHE BANK SECURITIES INC. AND MERRILL LYNCH, PIERCE, FENNER & SMITH INCORPORATED as Joint Lead Arrangers (the “Joint Lead Arrangers”) and Joint Bookrunn
GUARANTY RELATING TO SECURED BRIDGE TERM CREDIT AGREEMENTGuaranty • December 7th, 2015 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
GUARANTY (this “Guaranty”) dated as of December 7, 2015, made among NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP Funding LLC and each of the subsidiaries of the Company listed on the signature pages hereto (each such subsidiary individually, a “Subsidiary Guarantor” and, collectively with any Person that becomes a “Guarantor” pursuant to Section 20, the “Subsidiary Guarantors”; the Company, NXP Funding LLC and the Subsidiary Guarantors are referred to collectively as the “Guarantors”), Morgan Stanley Senior Funding, Inc., as the collateral agent (in such capacity, the “Collateral Agent”) and Credit Suisse AG, as the administrative agent (in such capacity, the “Administrative Agent”), in each case, for the lenders (the “Lenders”) from time to time party to the Secured Bridge Term Credit Agreement (the “Credit Agreement”) dated as of December 7, 2015, between the Company, NXP Funding LLC (the “Co-Borrower”), the Lenders from time to time party there
GUARANTY RELATING TO SECURED BRIDGE TERM CREDIT AGREEMENTGuaranty • December 7th, 2015 • Freescale Semiconductor, Ltd. • Semiconductors & related devices • New York
GUARANTY (this “Guaranty”) dated as of December 7, 2015, made among NXP B.V. with its corporate seat in Eindhoven, the Netherlands (the “Company”), NXP Funding LLC and each of the subsidiaries of the Company listed on the signature pages hereto (each such subsidiary individually, a “Subsidiary Guarantor” and, collectively with any Person that becomes a “Guarantor” pursuant to Section 20, the “Subsidiary Guarantors”; the Company, NXP Funding LLC and the Subsidiary Guarantors are referred to collectively as the “Guarantors”), Morgan Stanley Senior Funding, Inc., as the collateral agent (in such capacity, the “Collateral Agent”) and Credit Suisse AG, as the administrative agent (in such capacity, the “Administrative Agent”), in each case, for the lenders (the “Lenders”) from time to time party to the Secured Bridge Term Credit Agreement (the “Credit Agreement”) dated as of December 7, 2015, between the Company, NXP Funding LLC (the “Co-Borrower”), the Lenders from time to time party there
