EX-10.1 2 dex101.htm UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENT UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENTUncommitted Revolving Credit Facility Agreement • May 5th, 2020 • Tokyo
Contract Type FiledMay 5th, 2020 JurisdictionTHIS UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of December 26, 2005 is made by and between Spansion Japan Limited (the “Borrower”) and SHINKIN CENTRAL BANK (the “Lender”).
EX-10.66 5 dex1066.htm AMENDED AND RESTATED UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENT AMENDED AND RESTATED UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENTUncommitted Revolving Credit Facility Agreement • May 5th, 2020 • Tokyo
Contract Type FiledMay 5th, 2020 JurisdictionThis AMENDED AND RESTATED UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of March 31, 2006 (the “Amendment and Restatement Date”) is made by and between Spansion Japan Limited (the “Borrower”) and The Bank of Tokyo-Mitsubishi UFJ, Ltd. (the “Lender”).
AMENDED AND RESTATED UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENTUncommitted Revolving Credit Facility Agreement • May 9th, 2006 • Spansion Inc. • Semiconductors & related devices • Tokyo
Contract Type FiledMay 9th, 2006 Company Industry JurisdictionThis AMENDED AND RESTATED UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of March 31, 2006 (the “Amendment and Restatement Date”) is made by and between Spansion Japan Limited (the “Borrower”) and The Bank of Tokyo-Mitsubishi UFJ, Ltd. (the “Lender”).
UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENTUncommitted Revolving Credit Facility Agreement • December 28th, 2005 • Spansion Inc. • Semiconductors & related devices • Tokyo
Contract Type FiledDecember 28th, 2005 Company Industry JurisdictionTHIS UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of December 26, 2005 is made by and between Spansion Japan Limited (the “Borrower”) and SHINKIN CENTRAL BANK (the “Lender”).
UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENTUncommitted Revolving Credit Facility Agreement • December 8th, 2005 • Spansion Inc. • Semiconductors & related devices • Tokyo
Contract Type FiledDecember 8th, 2005 Company Industry JurisdictionTHIS UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of 28th Nov, 2005 is made by and between Spansion Japan Limited (the “Borrower”) and the Bank of Tokyo-Mitsubishi (the “Lender”).
UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENTUncommitted Revolving Credit Facility Agreement • October 21st, 2005 • Spansion Inc. • Semiconductors & related devices • Tokyo
Contract Type FiledOctober 21st, 2005 Company Industry JurisdictionTHIS UNCOMMITTED REVOLVING CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of September 20, 2005 is made by and between Spansion Japan Limited (the “Borrower”) and UFJ Bank Limited (the “Lender”).