SUBSCRIPTION AGREEMENTSubscription Agreement • March 31st, 2008 • Dpac Technologies Corp • Semiconductors & related devices
Contract Type FiledMarch 31st, 2008 Company IndustryThe undersigned, James Bole (the “Investor”), hereby agrees with DPAC Technologies Corp., a California corporation (the “Company”), as follows:
SUBSCRIPTION AGREEMENTSubscription Agreement • March 31st, 2008 • Dpac Technologies Corp • Semiconductors & related devices
Contract Type FiledMarch 31st, 2008 Company IndustryThe undersigned, William J. Roberts (the “Investor”), hereby agrees with DPAC Technologies Corp., a California corporation (the “Company”), as follows: