Common Contracts
2 similar Technology Development, License and Manufacturing Agreement contracts by Ezchip Semiconductor LTD
TECHNOLOGY DEVELOPMENT, LICENSE AND MANUFACTURING AGREEMENTTechnology Development, License and Manufacturing Agreement • September 27th, 2011 • Ezchip Semiconductor LTD • Computer communications equipment • California
This TECHNOLOGY DEVELOPMENT, LICENSE AND MANUFACTURING AGREEMENT (this “Agreement”) is entered into as of April 12, 2006 (the “Effective Date”) and is by and between MARVELL INTERNATIONAL LTD., a Bermuda corporation, with offices at Argyle House, 41a Cedar Avenue, Hamilton, HM 12, MARVELL SEMICONDUCTOR ISRAEL LTD., an Israeli corporation, with offices at 6 Hamada Street, Mordot HaCarmel Industrial Park, Yokneam, Israel 20692 (Marvell International Ltd. And Marvell Semiconductor Israel Ltd. are collectively referred to as “Marvell”) and EZCHIP TECHNOLOGIES LTD., an Israeli corporation with offices at 1 Hatamar Street, PO Box 527, Yokneam 20692, Israel (“EZchip”). Marvell and EZchip are each a “party” and collectively are the “parties” herein.
TECHNOLOGY DEVELOPMENT, LICENSE AND MANUFACTURING AGREEMENTTechnology Development, License and Manufacturing Agreement • March 31st, 2011 • Ezchip Semiconductor LTD • Computer communications equipment • California
This TECHNOLOGY DEVELOPMENT, LICENSE AND MANUFACTURING AGREEMENT (this “Agreement”) is entered into as of April 12, 2006 (the “Effective Date”) and is by and between MARVELL INTERNATIONAL LTD., a Bermuda corporation, with offices at Argyle House, 41a Cedar Avenue, Hamilton, HM 12, MARVELL SEMICONDUCTOR ISRAEL LTD., an Israeli corporation, with offices at 6 Hamada Street, Mordot HaCarmel Industrial Park, Yokneam, Israel 20692 (Marvell International Ltd. And Marvell Semiconductor Israel Ltd. are collectively referred to as “Marvell”) and EZCHIP TECHNOLOGIES LTD., an Israeli corporation with offices at 1 Hatamar Street, PO Box 527, Yokneam 20692, Israel (“EZchip”). Marvell and EZchip are each a “party” and collectively are the “parties” herein.
