between GLOBAL TECHNOLOGY INC. as Borrower and CHINA CONSTRUCTION BANK - NINGBO YINZHOU BRANCH as Lender RMB WORKING CAPITAL LOAN AGREEMENTRMB Working Capital Loan Agreement • March 5th, 2015 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Contract Type FiledMarch 5th, 2015 Company Industry
between GLOBAL TECHNOLOGY INC. as Borrower and CHINA CONSTRUCTION BANK - NINGBO YINZHOU BRANCH as Lender RMB WORKING CAPITAL LOAN AGREEMENTRMB Working Capital Loan Agreement • November 12th, 2014 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Contract Type FiledNovember 12th, 2014 Company Industry
between GLOBAL TECHNOLOGY INC. as Borrower and CHINA CONSTRUCTION BANK - NINGBO YINZHOU BRANCH as Lender RMB WORKING CAPITAL LOAN AGREEMENTRMB Working Capital Loan Agreement • August 12th, 2014 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Contract Type FiledAugust 12th, 2014 Company Industry
between GLOBAL TECHNOLOGY INC. as Borrower and CHINA CONSTRUCTION BANK - NINGBO YINZHOU BRANCH as Lender RMB WORKING CAPITAL LOAN AGREEMENTRMB Working Capital Loan Agreement • March 6th, 2014 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Contract Type FiledMarch 6th, 2014 Company Industry
between GLOBAL TECHNOLOGY INC. as Borrower and CHINA CONSTRUCTION BANK - NINGBO YINZHOU BRANCH as Lender RMB WORKING CAPITAL LOAN AGREEMENTRMB Working Capital Loan Agreement • November 14th, 2013 • Applied Optoelectronics, Inc. • Semiconductors & related devices
Contract Type FiledNovember 14th, 2013 Company Industry