Common Contracts

Taiwan Semiconductor Manufacturing Company Limited 100,000,000 American Depositary Shares Representing 500,000,000 Common Shares (Par Value NT$10 Per Share) Underwriting Agreement

Underwriting Agreement • November 6th, 2003 • Taiwan Semiconductor Manufacturing Co LTD • Semiconductors & related devices • New York

• Contract Type
  Underwriting Agreement
• Filed
  November 6th, 2003
• Company
  Taiwan Semiconductor Manufacturing Co LTD
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

Koninklijke Philips Electronics N.V., a company duly organized and existing under the laws of The Netherlands (the “Selling Shareholder”), proposes, subject to the terms and conditions stated herein, to sell to the Underwriters named in Schedule I hereto (the “Underwriters”) an aggregate of 100,000,000 American Depositary Shares representing 500,000,000 common shares, par value NT$10 per share (the “Common Shares”), of Taiwan Semiconductor Manufacturing Company Limited (the “Company”), a company limited by

Taiwan Semiconductor Manufacturing Company Limited 79,000,000 American Depositary Shares Representing 395,000,000 Common Shares (Par Value NT$10 Per Share) Underwriting Agreement

Underwriting Agreement • July 7th, 2003 • Taiwan Semiconductor Manufacturing Co LTD • Semiconductors & related devices • New York

• Contract Type
  Underwriting Agreement
• Filed
  July 7th, 2003
• Company
  Taiwan Semiconductor Manufacturing Co LTD
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

The shareholders named in Schedule I hereto (the “Selling Shareholders”) of Taiwan Semiconductor Manufacturing Company Limited, a company limited by shares (the “Company”) and duly organized and existing under the laws of the Republic of China (the “ROC”), propose, subject to the terms and conditions stated herein, to sell to the Underwriters