General Credit Facility AgreementGeneral Credit Facility Agreement • March 13th, 2015 • Applied Optoelectronics, Inc. • Semiconductors & related devices • New Taipei
Contract Type FiledMarch 13th, 2015 Company Industry JurisdictionThe undersigned, Applied Optoelectronics, Inc., Taiwan Branch. (hereinafter referred to as “Borrower”) and it guarantor (hereinafter referred to as “Guarantor”, together with the Borrower, the "Undersigned") hereby agree to the terms and conditions set forth below in addition to the General Loan Agreement, Letter of Joint Guarantee and other signed instruments with respect to the credit facility extended by E. Sun Commercial Bank, Ltd. (hereinafter “Bank”):
General Credit Facility AgreementGeneral Credit Facility Agreement • March 13th, 2015 • Applied Optoelectronics, Inc. • Semiconductors & related devices • New Taipei
Contract Type FiledMarch 13th, 2015 Company Industry JurisdictionThe undersigned, Applied Optoelectronics, Inc., Taiwan Branch. (hereinafter referred to as “Borrower”) and it guarantor (hereinafter referred to as “Guarantor”, together with the Borrower, the "Undersigned") hereby agree to the terms and conditions set forth below in addition to the General Loan Agreement, Letter of Joint Guarantee and other signed instruments with respect to the credit facility extended by E. Sun Commercial Bank, Ltd. (hereinafter “Bank”):