TERM LOAN AGREEMENT Dated as of November 30, 2016, amongTerm Loan Agreement • December 1st, 2016 • Flex Ltd. • Printed circuit boards • New York
Contract Type FiledDecember 1st, 2016 Company Industry Jurisdiction[to the best knowledge of the undersigned, during such fiscal period the Borrower performed and observed each covenant and condition of the Loan Documents applicable to it, and no Default has occurred and is continuing.]
AMENDMENT NO. 1 TO TERM LOAN AGREEMENTTerm Loan Agreement • July 28th, 2014 • Flextronics International Ltd. • Printed circuit boards • New York
Contract Type FiledJuly 28th, 2014 Company Industry Jurisdiction[to the best knowledge of the undersigned, during such fiscal period the Borrower performed and observed each covenant and condition of the Loan Documents applicable to it, and no Default has occurred and is continuing.]
TERM LOAN AGREEMENT Dated as of August 30, 2013 among FLEXTRONICS INTERNATIONAL LTD., as Borrower, THE BANK OF TOKYO-MITSUBISHI UFJ, LTD., as Administrative Agent, and The Other Lenders Party Hereto AUSTRALIA AND NEW ZEALAND BANKING GROUP LIMITED, as...Term Loan Agreement • September 4th, 2013 • Flextronics International Ltd. • Printed circuit boards • New York
Contract Type FiledSeptember 4th, 2013 Company Industry Jurisdiction[to the best knowledge of the undersigned, during such fiscal period the Borrower performed and observed each covenant and condition of the Loan Documents applicable to it, and no Default has occurred and is continuing.]