Common Contracts

2 similar Loan Agreement contracts by Advanced Micro Devices Inc, Spansion Inc.

JPY18,000,000,000 LOAN AGREEMENT FASL JAPAN LIMITED as Borrower MIZUHO CORPORATE BANK, LTD. as Arranger and Agent MIZUHO CORPORATE BANK, LTD. THE DAI- ICHI MUTUAL INSURANCE COMPANY SHINKIN CENTRAL BANK. THE BANK OF YOKOHAMA, LTD as Lender September...
Loan Agreement • April 13th, 2005 • Spansion Inc. • Tokyo

FASL JAPAN LIMITED (hereinafter referred to as the “Borrower”); the financial institutions described in Part III of Schedule ONE (hereinafter respectively referred to as a “Lender”, and collectively referred to as “All Lenders”); and MIZUHO CORPORATE BANK, LTD, (hereinafter referred to as the “Agent”), as of the date of September 25, 2003 enter into the following agreement (hereinafter referred to as this “Agreement”).

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JPY18,000,000,000 LOAN AGREEMENT FASL JAPAN LIMITED as Borrower MIZUHO CORPORATE BANK, LTD. as Arranger and Agent MIZUHO CORPORATE BANK, LTD. THE DAI- ICHI MUTUAL INSURANCE COMPANY SHINKIN CENTRAL BANK. THE BANK OF YOKOHAMA, LTD as Lender September...
Loan Agreement • March 9th, 2004 • Advanced Micro Devices Inc • Semiconductors & related devices • Tokyo

FASL JAPAN LIMITED (hereinafter referred to as the “Borrower”); the financial institutions described in Part III of Schedule ONE (hereinafter respectively referred to as a “Lender”, and collectively referred to as “All Lenders”); and MIZUHO CORPORATE BANK, LTD, (hereinafter referred to as the “Agent”), as of the date of September 25, 2003 enter into the following agreement (hereinafter referred to as this “Agreement”).

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