PLEDGE AND SECURITY AGREEMENTPledge and Security Agreement • November 10th, 2008 • Kemet Corp • Electronic components & accessories • New York
Contract Type FiledNovember 10th, 2008 Company Industry JurisdictionPursuant to the Loan Agreement dated as of the date hereof (as amended, supplemented or modified from time to time, the “Loan Agreement”; capitalized terms used but not defined herein shall have the meanings given such terms in the Loan Agreement) by and among Kemet Electronics Corporation, as Borrower, and Secured Party, Secured Party has agreed to make a Loan to Borrower. In order to induce Secured Party to make the Loan, Grantor has agreed to grant a continuing Lien on the Collateral to secure the Obligations (as hereinafter defined). Accordingly, Grantor hereby agrees as follows:
PLEDGE AND SECURITY AGREEMENTPledge and Security Agreement • November 4th, 2008 • Vishay Intertechnology Inc • Electronic components & accessories • New York
Contract Type FiledNovember 4th, 2008 Company Industry JurisdictionPursuant to the Loan Agreement dated as of the date hereof (as amended, supplemented or modified from time to time, the “Loan Agreement”; capitalized terms used but not defined herein shall have the meanings given such terms in the Loan Agreement) by and among Kemet Electronics Corporation, as Borrower, and Secured Party, Secured Party has agreed to make a Loan to Borrower. In order to induce Secured Party to make the Loan, Grantor has agreed to grant a continuing Lien on the Collateral to secure the Obligations (as hereinafter defined). Accordingly, Grantor hereby agrees as follows: