Common Contracts
4 similar null contracts by NXP Semiconductors N.V.
Agreement on Lease of Land of Export Processing Zone Administration, Ministry of Economic AffairsNXP Semiconductors N.V. • June 10th, 2010 • Semiconductors & related devices
Whereas the lessee, NXP Semiconductors Taiwan Ltd. (hereinafter referred to as Party B), leases from the Export Processing Zone Administration, Ministry of Economic Affairs (hereinafter referred to as Party A) six state-owned plots located within Nanzi Export Processing Zone, both parties hereby reach on the following agreements:
Agreement on Lease of Land of Export Processing Zone Administration, Ministry of Economic AffairsNXP Semiconductors N.V. • June 10th, 2010 • Semiconductors & related devices
Whereas the lessee, NXP Semiconductors Taiwan Ltd. (hereinafter referred to as Party B), leases from the Export Processing Zone Administration, Ministry of Economic Affairs (hereinafter referred to as Party A) two state-owned plots located within Nanzi Export Processing Zone, both parties hereby reach on the following agreements:
Agreement on Lease of Land of Export Processing Zone Administration, Ministry of Economic AffairsNXP Semiconductors N.V. • June 10th, 2010 • Semiconductors & related devices
Whereas the lessee, NXP Semiconductors Taiwan Ltd. (hereinafter referred to as Party B), leases from the Export Processing Zone Administration, Ministry of Economic Affairs (hereinafter referred to as Party A) four state-owned plots located within Nanzi Export Processing Zone, both parties hereby reach on the following agreements:
Agreement on Lease of Land of Export Processing Zone Administration, Ministry of Economic AffairsNXP Semiconductors N.V. • June 10th, 2010 • Semiconductors & related devices
Whereas the lessee, NXP Semiconductors Taiwan Ltd. (hereinafter referred to as Party B), leases from the Export Processing Zone Administration, Ministry of Economic Affairs (hereinafter referred to as Party A) one state-owned plot located within Nanzi Export Processing Zone, both parties hereby reach on the following agreements:
