THIRD AMENDMENT TO LOAN AND SECURITY AGREEMENT (EX-IM LOAN FACILITY)Loan and Security Agreement • February 2nd, 2012 • Ramtron International Corp • Semiconductors & related devices • California
Contract Type FiledFebruary 2nd, 2012 Company Industry JurisdictionThis THIRD AMENDMENT to Loan and Security Agreement (Ex-Im Loan Facility) (this “Amendment”) is entered into this 31st day of January, 2012, by and between SILICON VALLEY BANK (“Bank”) and RAMTRON INTERNATIONAL CORPORATION, a Delaware corporation (“Borrower”), whose address is 1850 Ramtron Drive, Colorado Springs, Colorado 80921.
SECOND AMENDMENT TO LOAN AND SECURITY AGREEMENT (EX-IM LOAN FACILITY)Loan and Security Agreement • January 3rd, 2012 • Ramtron International Corp • Semiconductors & related devices • California
Contract Type FiledJanuary 3rd, 2012 Company Industry JurisdictionThis SECOND AMENDMENT to Loan and Security Agreement (Ex-Im Loan Facility) (this “Amendment”) is entered into this 31st day of December, 2011, by and between SILICON VALLEY BANK (“Bank”) and RAMTRON INTERNATIONAL CORPORATION, a Delaware corporation (“Borrower”), whose address is 1850 Ramtron Drive, Colorado Springs, Colorado 80921.
FIRST AMENDMENT TO LOAN AND SECURITY AGREEMENT (EX-IM LOAN FACILITY)Loan and Security Agreement • November 4th, 2011 • Ramtron International Corp • Semiconductors & related devices • California
Contract Type FiledNovember 4th, 2011 Company Industry JurisdictionThis FIRST AMENDMENT to Loan and Security Agreement (Ex-Im Loan Facility) (this “Amendment”) is entered into this 31st day of October, 2011, by and between SILICON VALLEY BANK (“Bank”) and RAMTRON INTERNATIONAL CORPORATION, a Delaware corporation (“Borrower”), whose address is 1850 Ramtron Drive, Colorado Springs, Colorado 80921.