TENDER AND SUPPORT AGREEMENTTender and Support Agreement • August 7th, 2023 • Sequans Communications • Semiconductors & related devices • Delaware
Contract Type FiledAugust 7th, 2023 Company Industry JurisdictionTHIS TENDER AND SUPPORT AGREEMENT (this “Agreement”) is entered into as of August [•], 2023, by and between Renesas Electronics Corporation, a Japanese corporation (“Parent”) and [•] (“Shareholder”).
TENDER AND SUPPORT AGREEMENTTender and Support Agreement • March 10th, 2021 • Talend S.A. • Services-prepackaged software • Delaware
Contract Type FiledMarch 10th, 2021 Company Industry JurisdictionTHIS TENDER AND SUPPORT AGREEMENT (this “Agreement”) is entered into as of March 10, 2021, by and between Tahoe Bidco (Cayman), LLC, a Cayman Islands limited liability company (“Parent”) and [●] (“Shareholder”).