COOPERATIVE AGREEMENT BETWEEN Cree, Inc. (The Recipient) AND CONCERNING Development of SiC Power Devices and Power ModulesCooperative Agreement • August 20th, 2004 • Cree Inc • Semiconductors & related devices
Contract Type FiledAugust 20th, 2004 Company IndustryThis Agreement is entered into between the United States of America, hereinafter called the Government, represented by the U.S. Army Research Laboratory (ARL), and Cree, Inc., pursuant to and under U.S. Federal Law.
COOPERATIVE AGREEMENT BETWEEN Cree, Inc. (The Recipient) AND CONCERNING Manufacturing Technology for SiC Material and Power DevicesCooperative Agreement • August 20th, 2004 • Cree Inc • Semiconductors & related devices
Contract Type FiledAugust 20th, 2004 Company IndustryThis Agreement is entered into between the United States of America, hereinafter called the Government, represented by the U.S. Army Research Laboratory (ARL), and Cree, Inc., pursuant to and under U.S. Federal Law.