Common Contracts
4 similar Facility Agreement contracts by TTM Technologies Inc
AMENDED AND RESTATED FACILITY AGREEMENT DATED 14 JUNE 2023 US$150,000,000Facility Agreement • June 20th, 2023 • TTM Technologies Inc • Printed circuit boards • Hong Kong
Pursuant to Clause 20.4 (Collateral Report) of the Facility Agreement dated ____ between, among others, TTM Technologies Enterprises (HK) Limited as a Borrower and The Hongkong and Shanghai Banking Corporation Limited as the Arranger, Original Lender, Issuing Bank, Facility Agent and Security Trustee, I certify that all information furnished in this Collateral Report is true, accurate and complete.
AMENDED AND RESTATED FACILITY AGREEMENT DATED 4 JUNE 2019 US$150,000,000Facility Agreement • June 6th, 2019 • TTM Technologies Inc • Printed circuit boards • Hong Kong
Pursuant to Clause 20.4 (Collateral Report) of the Facility Agreement dated between, among others, TTM Technologies Enterprises (HK) Limited as a Borrower and The Hongkong and Shanghai Banking Corporation Limited as the Arranger, Original Lender, Issuing Bank, Facility Agent and Security Trustee, I certify that all information furnished in this Collateral Report is true, accurate and complete.
FACILITY AGREEMENT DATED 22 May 2015 US$150,000,000 ASSET BACKED LOAN FACILITY FOR TTM TECHNOLOGIES ENTERPRISES (HK) LIMITED as Borrower arranged by THE HONGKONG AND SHANGHAI BANKING CORPORATION LIMITED as Arranger with THE HONGKONG AND SHANGHAI...Facility Agreement • May 29th, 2015 • TTM Technologies Inc • Printed circuit boards • Hong Kong
Pursuant to Clause 20.4 (Collateral Report) of the Facility Agreement dated [ ] among, inter alia, TTM Technologies Enterprises (HK) Limited as the Borrower and The HongKong and Shanghai Banking Corporation Limited as the Arranger, Original Lender, Issuing Bank, Facility Agent and Security Trustee, I certify that all information furnished in this Collateral Report is true, accurate and complete.
FACILITY AGREEMENT DATED 14 SEPTEMBER 2012 US$540,000,000 CREDIT FACILITY FOR THE COMPANIES LISTED IN SCHEDULE 1 HEREIN as Borrowers with THE HONGKONG AND SHANGHAI BANKING CORPORATION LIMITED as Facility Agent and STANDARD CHARTERED BANK (HONG KONG)...Facility Agreement • September 19th, 2012 • TTM Technologies Inc • Printed circuit boards • Hong Kong
