AMENDMENT --------- FORBEARANCE, RESTRUCTURE AND MUTUAL RELEASE AGREEMENT This Amendment is entered into as of November 5, 1998 by and among Microelectronic Packaging, Inc. ("MPI"), CTM Electronics, Inc. ("CTM"), Microelectronic Packaging America...Forbearance, Restructure and Mutual Release Agreement • November 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices
Contract Type FiledNovember 13th, 1998 Company Industry
EXHIBIT 10.80 FORBEARANCE, RESTRUCTURE AND MUTUAL RELEASE AGREEMENT ---------------------------- This Forbearance, Restructure and Mutual Release Agreement (the "Agreement") is entered into as of this 1st day of July, 1998, by and among...Forbearance, Restructure and Mutual Release Agreement • August 13th, 1998 • Microelectronic Packaging Inc /Ca/ • Semiconductors & related devices • California
Contract Type FiledAugust 13th, 1998 Company Industry Jurisdiction