Capital Increase Agreement on Beijing Tongmei Xtal Technology Co., Ltd. Among Guangshuo Semiconductor Equipment (Shanghai) Co., Ltd., Beijing Tongmei Xtal Technology Co., Ltd. and AXT, INC. January 2021Capital Increase Agreement • March 15th, 2024 • Axt Inc • Semiconductors & related devices
Contract Type FiledMarch 15th, 2024 Company IndustryThis CAPITAL INCREASE AGREEMENT (hereinafter referred to as the “Agreement”) is entered into as of [DD] [MM], 2021 in Beijing by and among:
Capital Increase Agreement on Beijing Tongmei Xtal Technology Co., Ltd. Among Guangshuo Semiconductor Equipment (Shanghai) Co., Ltd., Beijing Tongmei Xtal Technology Co., Ltd. and AXT, INC. January 2021Capital Increase Agreement • March 16th, 2023 • Axt Inc • Semiconductors & related devices
Contract Type FiledMarch 16th, 2023 Company IndustryThis CAPITAL INCREASE AGREEMENT (hereinafter referred to as the “Agreement”) is entered into as of [DD] [MM], 2021 in Beijing by and among:
Capital Increase Agreement on Beijing Tongmei Xtal Technology Co., Ltd. Among Guangshuo Semiconductor Equipment (Shanghai) Co., Ltd., Beijing Tongmei Xtal Technology Co., Ltd. and AXT, INC. January 2021Capital Increase Agreement • March 15th, 2022 • Axt Inc • Semiconductors & related devices
Contract Type FiledMarch 15th, 2022 Company IndustryThis CAPITAL INCREASE AGREEMENT (hereinafter referred to as the “Agreement”) is entered into as of [DD] [MM], 2021 in Beijing by and among:
Capital Increase Agreement on Beijing Tongmei Xtal Technology Co., Ltd. Among Guangshuo Semiconductor Equipment (Shanghai) Co., Ltd., Beijing Tongmei Xtal Technology Co., Ltd. and AXT, INC. January 2021Capital Increase Agreement • March 23rd, 2021 • Axt Inc • Semiconductors & related devices
Contract Type FiledMarch 23rd, 2021 Company IndustryThis CAPITAL INCREASE AGREEMENT (hereinafter referred to as the “Agreement”) is entered into as of [DD] [MM], 2021 in Beijing by and among: