EMPLOYMENT AGREEMENTEmployment Agreement • April 28th, 2011 • Ddi Corp • Printed circuit boards • California
Contract Type FiledApril 28th, 2011 Company Industry JurisdictionThis Employment Agreement (the “Agreement”) is made and entered into as of April 27, 2011 by and between DDi Corp., a Delaware corporation, on behalf of itself and any and all of its subsidiaries (together, the “Company”), and J. Michael Dodson (“Executive”).
EMPLOYMENT AGREEMENTEmployment Agreement • April 11th, 2008 • Ddi Corp • Printed circuit boards • California
Contract Type FiledApril 11th, 2008 Company Industry JurisdictionThis Employment Agreement (the “Agreement”) is made and entered into as of April 7, 2008 by and between DDi Corp., a Delaware corporation, on behalf of itself and any and all of its subsidiaries (together, the “Company”), and Michael R. Mathews (“Executive”).
EMPLOYMENT AGREEMENTEmployment Agreement • April 11th, 2008 • Ddi Corp • Printed circuit boards • California
Contract Type FiledApril 11th, 2008 Company Industry JurisdictionThis Employment Agreement (the “Agreement”) is made and entered into as of April 7, 2008 by and between DDi Corp., a Delaware corporation, on behalf of itself and any and all of its subsidiaries (together, the “Company”), and Gerald P. Barnes (“Executive”).
EMPLOYMENT AGREEMENTEmployment Agreement • April 11th, 2008 • Ddi Corp • Printed circuit boards • California
Contract Type FiledApril 11th, 2008 Company Industry JurisdictionThis Employment Agreement (the “Agreement”) is made and entered into as of April 7, 2008 by and between DDi Corp., a Delaware corporation, on behalf of itself and any and all of its subsidiaries (together, the “Company”), and Mikel H. Williams (“Executive”).