INTERCREDITOR AGREEMENTIntercreditor Agreement • May 5th, 2010 • Daystar Technologies Inc • Semiconductors & related devices • New York
Contract Type FiledMay 5th, 2010 Company Industry JurisdictionTHIS INTERCREDITOR AGREEMENT (this “Agreement”) dated as of the 29th day of April, 2010, is made by and among TD Waterhouse RRSP Account 230832S, in trust for Peter Alan Lacey as beneficiary, a corporation (“Lender 1”), Peter A. Lacey, an individual (“Lender 2”“), Michael Moretti, an individual (“Lender 3”), Tejas Securities Group, Inc 401k Plan and Trust, FBO John J. Gorman, John J. Gorman TTEE, a trust (“Lender 4”), William S. Steckel, an individual (“Lender 5”),and Dynamic Worldwide Solar Energy, LLC a Delaware Limited Liability Company (“Lender 6”), (Lender 1, Lender 2 Lender 3, Lender 4, Lender 5, and Lender 6 are sometimes referred to herein as the “Lenders”).
INTERCREDITOR AGREEMENTIntercreditor Agreement • February 18th, 2010 • Daystar Technologies Inc • Semiconductors & related devices • New York
Contract Type FiledFebruary 18th, 2010 Company Industry JurisdictionTHIS INTERCREDITOR AGREEMENT (this “Agreement”) dated as of the 11th day of February, 2010, is made by and among TD Waterhouse RRSP Account 230832S, in trust for Peter Alan Lacey as beneficiary, a corporation (“Lender 1”), Peter A. Lacey, an individual (“Lender 2”“), Michael Moretti, an individual (“Lender 3”), Tejas Securities Group, Inc 401k Plan and Trust, FBO John J. Gorman, John J. Gorman TTEE, a trust (“Lender 4”), , a corporation (“Lender 5”), and , a corporation (“Lender 6”), (Lender 1, Lender 2 Lender 3, Lender 4, Lender 5, and Lender 6 are sometimes referred to herein as the “Lenders”).