GUARANTY RELATING TO THE CREDIT AGREEMENTGuaranty • July 30th, 2019 • NXP Semiconductors N.V. • Semiconductors & related devices • New York
Contract Type FiledJuly 30th, 2019 Company Industry JurisdictionGUARANTY, dated as of June 11, 2019 (as amended, restated, amended and restated, supplemented and otherwise modified from time to time, this “Guaranty”), made by NXP Semiconductors N.V., with its corporate seat in Eindhoven, the Netherlands (“NXP Semiconductors”) and NXP USA, Inc., a Delaware corporation (“NXP USA” and, together with NXP Semiconductors and any other Subsidiary that becomes a party hereto as a Guarantor (in each case, unless and until such Person ceases to be a Guarantor in accordance with this Guaranty, individually, a “Guarantor” and, collectively, the “Guarantors”) and Barclays Bank PLC, as administrative agent (in such capacity, together with its successors in such capacity, the “Administrative Agent”) for the lenders from time to time party to the Credit Agreement (collectively, the “Lenders”).