LOAN AND SECURITY AGREEMENTLoan and Security Agreement • August 10th, 2015 • eASIC Corp • Semiconductors & related devices • Delaware
Contract Type FiledAugust 10th, 2015 Company Industry JurisdictionTHIS LOAN AND SECURITY AGREEMENT (this “Agreement”) dated as of September 29, 2010 (the “Effective Date”) between SILICON VALLEY BANK, a California corporation (“Bank”), and EASIC CORPORATION, a Delaware corporation (“Borrower”), provides the terms on which Bank shall lend to Borrower and Borrower shall repay Bank. The parties agree as follows:
LOAN AND SECURITY AGREEMENTLoan and Security Agreement • December 18th, 2014 • eASIC Corp • Semiconductors & related devices • Delaware
Contract Type FiledDecember 18th, 2014 Company Industry JurisdictionTHIS LOAN AND SECURITY AGREEMENT (this “Agreement”) dated as of September 29, 2010 (the “Effective Date”) between SILICON VALLEY BANK, a California corporation (“Bank”), and EASIC CORPORATION, a Delaware corporation (“Borrower”), provides the terms on which Bank shall lend to Borrower and Borrower shall repay Bank. The parties agree as follows: